A hair iron according to one example embodiment includes a first arm and a second arm movable relative to each other between an open position and a closed position. A contact surface is positioned on an exterior of the first arm for contacting hair during use. The hair iron includes a heater having a ceramic substrate and an electrical resistor material thick film printed on a surface of the ceramic substrate. The heater generates heat by applying an electric current to the electrical resistor material. The heater is positioned to supply heat to the contact surface.

A board, including a first pad area, a second pad area, a first micro heater, a second micro heater, a first heater terminal pad, a second heater terminal pad, and a third heater terminal pad, is provided. The first pad area and the second pad area respectively include at least one pad. The first micro heater and the second micro heater are respectively disposed corresponding to the first pad area and the second pad area. The first heater terminal pad and the second heater terminal pad form a loop with the first micro heater by being electrically connected to an outside, so that the first micro heater generates heat. The second heater terminal pad and the third heater terminal pad form another loop with the second micro heater by being electrically connected to the outside, so that the second micro heater generates heat. A circuit board and a fixture are also provided.

A programmable circuit includes an array of printed groups of microscopic transistors or diodes having pn junctions. The devices are pre-formed and printed as an ink and cured. The devices have a proper orientation and a reverse orientation after settling on a conductor layer. The devices are connected in parallel within small groups. To neutralize the reverse-oriented devices, a sufficient voltage is applied across the parallel-connected diodes to forward bias only the devices having the reverse orientation. This causes a sufficient current to flow through each of the reverse-orientated devices to destroy an electrical interface between an electrode of the devices and the conductor layer to create an open circuit, such that those devices do not affect a rectifying function of the devices in the group having the proper orientation. An interconnection conductor pattern may then interconnect the groups to form complex logic circuits.

A test element support comprises a heating element for heating a test element for analytical examination of a sample. The heating element comprises a substrate, which is made of at least one substrate material. The substrate comprises at least one active area configured for being heated and at least one non-active area outside the active area. The active and the non-active areas are separated by at least one thermal insulation element. The thermal insulation element has a lower thermal conductivity than the substrate material. The thermal insulation element is fully or partially embedded into the substrate. The test element support further comprises at least one heater. The heater comprises at least one heater substrate and the heater substrate is attached to the substrate, wherein the heater substrate is attached to a back face of the substrate. The back face opposes a front face of the substrate contacting the test element.

A multi-layer printed circuit board (PCB) includes a laminate between a PCB heating core and a PCB signal core. The PCB heating core includes an electrically conductive resistive heating element upon a first core substrate. During a lamination cure PCB fabrication stage, a platen contacts the PCB and a power supply is electrically connected to the resistive heating element. The laminate is cured with heat transferred by the platen and heat from the resistive heating element. The PCB heating core may be located within an inner layer of the multi-layer PCB to normalize a thermal gradient across the multi-layer PCB that may otherwise occur during the laminate cure fabrication stage. As a result of the normalized thermal gradient, the degree of laminate cure and material characteristics of the cured laminate material are more consistent throughout the multi-layer PCB thickness.

A multi-layer printed circuit board (PCB) includes a laminate between a PCB heating core and a PCB signal core. The PCB heating core includes an electrically conductive resistive heating element upon a first core substrate. During a lamination cure PCB fabrication stage, a platen contacts the PCB and a power supply is electrically connected to the resistive heating element. The laminate is cured with heat transferred by the platen and heat from the resistive heating element. The PCB heating core may be located within an inner layer of the multi-layer PCB to normalize a thermal gradient across the multi-layer PCB that may otherwise occur during the laminate cure fabrication stage. As a result of the normalized thermal gradient, the degree of laminate cure and material characteristics of the cured laminate material are more consistent throughout the multi-layer PCB thickness.

A programmable circuit includes an array of printed groups of microscopic transistors or diodes having pn junctions. The devices are pre-formed and printed as an ink and cured. The devices have a proper orientation and a reverse orientation after settling on a conductor layer. The devices are connected in parallel within small groups. To neutralize the reverse-oriented devices, a sufficient voltage is applied across the parallel-connected diodes to forward bias only the devices having the reverse orientation. This causes a sufficient current to flow through each of the reverse-orientated devices to destroy an electrical interface between an electrode of the devices and the conductor layer to create an open circuit, such that those devices do not affect a rectifying function of the devices in the group having the proper orientation. An interconnection conductor pattern may then interconnect the groups to form complex logic circuits.

Techniques and mechanisms for controlling configurable circuitry including an antifuse. In an embodiment, the antifuse is disposed in or on a substrate, the antifuse configured to form a solder joint to facilitate interconnection of circuit components. Control circuitry to operate with the antifuse is disposed in, or at a side of, the same substrate. The antifuse is activated based on a voltage provided at an input node, where the control circuitry automatically transitions through a pre-determined sequence of states in response to the voltage. The pre-determined sequence of states coordinates activation of one or more fuses and switched coupling one or more circuit components to the antifuse. In another embodiment, multiple antifuses, variously disposed in or on the substrate, are configured each to be activated based on the voltage provided at an input node.

The storage device unit includes: a substrate having a main surface and having a plurality of wiring layers stacked together; and a storage device that has a plate shape having a first surface and is disposed on the substrate, the first surface facing the main surface. The plurality of wiring layers includes a heat-generating layer having a heat-generating circuit.

A donor plate for deposition of a deposition substance on a target is disclosed herein. The donor plate includes a flexible substrate, which at a first main surface of the flexible substrate has, in sequential order, further layers in the form of: an electrode layer, a first electrically insulating layer, a resistive heater layer, a second electrically insulating layer and a patterned layer provided with one or more recesses for holding deposition substance to be deposited on the target. The electrode layer comprises a first and a second electrode of a complementary shape and being electrically insulated from each other. The resistive heater layer is electrically connected to each of a contact surface of the first electrode and a contact surface of the second electrode via at least one respective slit in the first electrically insulating layer.