Patent classifications
H05K2203/1173
CONDUCTIVE GRAPHENE INTERFACIAL BARRIERS FOR LIQUID METAL ELECTRONICS
Articles, electronic devices and related methods of fabrication interfacing graphene with a gallium liquid metal alloy.
Systems with low-friction matte flexible printed circuits
An electronic device may include flexible printed circuits. A flexible printed circuit may have metal traces supported by a polymer substrate. The flexible printed circuit may extend between an upper laptop computer housing and a lower laptop computer housing or other structures that move relative to each other in an electronic device. The flexible printed circuit may have a low-friction coating and a matte finish. The flexible printed circuit may have a fluoropolymer coating on the polymer substrate, a fluoropolymer coating on a matte coating on the polymer substrate, a fluoropolymer coating that includes a matting agent on the polymer substrate, a fluoropolymer layer or other polymer layer that is attached to the substrate with a layer of adhesive, a textured surface layer, and/or other structures that help provide the flexible printed circuit with desired physical properties and a desired appearance.
STRUCTURE, WIRING BOARD, SUBSTRATE FOR WIRING BOARD, COPPER CLAD LAMINATE, AND METHOD FOR MANUFACTURING THE STRUCTURE
According to an embodiment, a structure is provided. The structure comprises a silicone formed product, water, and a protective member. The silicone formed product contains hydroxyl groups in at least a portion of a surface. The water is in contact with at least the portion of the surface containing the hydroxyl groups. The protective member retains the water.
BIOCOMPATIBLE ENCAPSULATION AND COMPONENT STRESS RELIEF FOR SENSOR ENABLED NEGATIVE PRESSURE WOUND THERAPY DRESSINGS
Devices and methods for encapsulating a portion of a wound dressing with biocompatible coating are disclosed. In some embodiments, a method includes coating a first side of a flexible wound contact layer of the wound dressing with a hydrophobic coating. The first side of the wound contact layer can support a plurality of electronic components. The method can further include coating a second side of the wound contact layer opposite the first side with the hydrophobic coating. The wound contact layer can be formed at least partially from hydrophilic material.
ELECTROLESS COPPER PLATING POLYDOPAMINE NANOPARTICLES
Aqueous dispersions of artificially synthesized, mussel-inspired polyopamine nanoparticles were inkjet printed on flexible polyethylene terephthalate (PET) substrates. Narrow line patterns (4 m in width) of polydopamine resulted due to evaporatively driven transport (coffee ring effect). The printed patterns were metallized via a site-selective Cu electroless plating process at a controlled temperature (30 C.) for varied bath times. The lowest electrical resistivity value of the plated Cu lines was about 6 times greater than the bulk resistivity of Cu. This process presents an industrially viable way to fabricate Cu conductive fine patterns for flexible electronics at low temperature, and low cost.
PRINTED CIRCUIT NANOFIBER WEB MANUFACTURING METHOD, PRINTED CIRCUIT NANOFIBER WEB MANUFACTURED THEREBY, AND ELECTRONIC DEVICE EMPLOYING SAME
Provided is a method of manufacturing a printed circuit nano-fiber web. A method of manufacturing a printed circuit nano-fiber web according to an embodiment of the present invention includes (1) a step of electrospinning a spinning solution including a fiber-forming ingredient to manufacture a nano-fiber web; and (2) a step of forming a circuit pattern to coat an outer surface of nano-fiber included in a predetermined region on the nano-fiber web using an electroless plating method. According to the present invention, a circuit pattern-printed nano-fiber web having flexibility and resilience suitable for future smart devices may be realized. In addition, a circuit pattern may be densely formed to a uniform thickness on a flexible nano-fiber web using an electroless plating method, and the flexible nano-fiber web may include a plurality of pores. Accordingly, since the printed circuit nano-fiber web may satisfy waterproofness and air permeability characteristics, it can be used in various future industrial fields including medical devices, such as biopatches, and an electronic device, such as smart devices.
Composite member and method of manufacturing the same, and aliphatic polycarbonate-containing layer
[Problem] Provided is a composite member which can contribute to simple formation and/or increased quality of fine wiring. [Solution] A composite member 100 according to one embodiment of the present invention includes a base material, an aliphatic polycarbonate-containing layer with multiple island-shaped portions arranged on the base material, and a metal ink, wherein at least a surface of the aliphatic polycarbonate-containing layer with multiple island-shaped portions has a contact angle of 50 or more between pure water and the surface when exposed to ultraviolet light including a wavelength of 180 nm or more and 370 nm or less for 15 minutes, and the metal ink is arranged on the base material at at least a portion of a region sandwiched by the precursor layers.
METHOD FOR MANUFACTURING A PATTERNED SILVER NANOWIRE FILM, A TOUCH SCREEN AND A MANUFACTURING METHOD THEREOF
The present application provides a method for manufacturing a patterned silver nanowire film, a touch screen and a manufacturing method thereof. The method for manufacturing a patterned silver nanowire film, includes: forming a patterned surface modification layer on a substrate; coating a silver nanowire solution on the substrate, the surface modification layer repels the silver nanowire solution, the silver nanowire solution is automatically scattered on the surface modification layer and is gathered onto a portion of the substrate that is not covered by the surface modification layer; and performing a baking process to cure the silver nanowire solution to form the patterned silver nanowire film.
Circuit board and manufacturing method thereof
A circuit board is obtained by providing a wiring pattern on an insulating board. The circuit board includes a first region and a second region. In the first region, a first wiring pattern is provided on which a first surface treatment is applied. In the second region, a second wiring pattern is provided on which a second surface treatment having a cutting fluid resistance and/or a humidity resistance lower than the first surface treatment is applied.
WIRING BODY AND WIRING BODY ASSEMBLY
A wiring body includes: a first insulator; a conductor disposed on a first surface of the first insulator and that includes a terminal; and a second insulator disposed on the first surface to cover the conductor. The second insulator includes: an opening from which the terminal is exposed; and an end face that delimits the opening and that includes a first face, a second face that is farther away from the first insulator than the first face, and an edge that connects the first face and the second face.