A carbene-coated metal foil is produced by applying an N-heterocyclic carbene (NHC) compound to one or more surfaces of a metal foil (e.g., an electrodeposited copper foil having a surface that is smooth and non-oxidized). The NHC compound contains a matrix-reactive pendant group that includes at least one of a vinyl-, allyl-, acrylic-, methacrylic-, styrenic-, amine-, amide- and epoxy-containing moiety capable of reacting with a base polymer (e.g., a vinyl-containing resin such as a polyphenylene oxide/triallyl-isocyanurate (PPO/TAIC) composition). The NHC compound may be synthesized by, for example, reacting a halogenated imidazolium salt (e.g., 1,3-bis(4-bromo-2,6-dimethylphenyl)-4,5-dihydro-1H-imidazol-3-ium chloride) and an organostannane having a vinyl-containing moiety (e.g., tributyl(vinyl)stannane) in the presence of a palladium catalyst. In some embodiments, an enhanced substrate for a printed circuit board (PCB) is produced by laminating the carbene-coated metal foil to a substrate that includes glass fiber impregnated with the base polymer.

A built-in-electronic-component substrate includes a core substrate, an electronic component mounted on one main surface of the core substrate via a joining member, and a resin layer including the electronic component embedded therein. The electronic component is a multilayer ceramic capacitor including a ceramic multilayer body, and a first outer electrode including an end surface portion and a second outer electrode including an end surface portion provided on end surfaces of the ceramic multilayer body. A first gap is provided between the resin layer and the end surface portion of the first outer electrode and the joining member and a second gap is provided between the resin layer and the end surface portion of the second outer electrode and the joining member.

A resin composition, a copper-clad laminate using the same, and a printed circuit board using the same are introduced. The resin composition comprises a specific phosphorus-containing salt and a prepolymer of vinyl-containing polyphenylene ether. The resin composition features specific ingredients and proportion to thereby achieve satisfactory properties of prepreg made from the resin composition, and attain satisfactory laminate properties, such as high degree of heat resistance and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper-clad laminates and printed circuit boards.

An electrical system includes a motherboard including a receptacle that provides a first plurality of electrical connectors and an auxiliary card including an extension defining a second plurality of electrical connectors. The extension is fixedly coupled to the receptacle to substantially fix the position of the auxiliary card with respect to the mother board and to electrically connect the first plurality of electrical connections and the second plurality of electrical connections. An electrically-conductive lubricant is disposed between the extension and the receptacle.

A circuit board includes a core layer, at least one passive component, a first and a second conductive wire layers, at least one contact pad, and a resin packing layer. The core layer defines at least one through hole to receive the passive component. The first and the second conductive wire layers are connected to two opposite surfaces of the core layer. Each contact pad is positioned between and connected to one passive component and the first conductive wire layer. The resin packing layer is filled among the core layer, each passive component, each contact pad, the first and the second conductive wire layers. The resin packing layer can connect the first and the second conductive wire layers to the core layer, and connect the core layer, each passive component, and each contact pads to each other.

Semiconductor package substrates and methods of forming semiconductor package substrates are described. In an example, a semiconductor package substrate includes an interfacial layer between a metal layer and a dielectric layer. For example, the interfacial layer may be attached to the metal layer and the dielectric layer by a chemical bond, e.g., a coordinate bond or a covalent bond. Accordingly, the metal layer may adhere to the dielectric layer.

An ink comprising: a metal nanoparticle with at least a portion of the surface of the metal nanoparticle coordinated by a hydroxycarboxylic acid ligand, the hydroxycarboxylic acid ligand comprising a carboxyl group and at least one hydroxyl group; and a solvent.

To provide a metal particle composition having excellent oxidation resistance, which does not require a transition metal catalyst and can be applied to existing metal particles, a method for producing the metal particle composition, and a paste. The metal particle composition contains, with respect to 100 parts by mass of metal particles, 0.1 to 5 parts by mass of a compound (A) having a structure represented by the following general formula (I): ##STR00001## in which R.sup.1 and R.sup.2 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, an aryl group, or an aralkyl group, R.sup.3 and R.sup.4 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group, an alkenyl group having 2 to 6 carbon atoms, an alkenyloxy group, an aryl group, or an aralkyl group.

A conductor composition ink of the invention includes: (A) a fluorine-containing compound to form a self-assembled monomolecular film; (B) metal particles; and (C) a solvent.

Systems and methods for positioning a component on a surface or substrate including the steps of applying a coating to a selected deposit area of the surface, each deposit area defining at least a portion of a perimeter of an alignment area, depositing an fluid on the coating, and depositing, dropping, or otherwise positioning the component above the alignment area are disclosed.