A circuitized structure with a 3-dimensional configuration. A base structure is provided that includes an insulating substrate of electrically insulating material with a flat configuration, and further includes an electric circuit including at least one layer of electrically conductive material arranged on the insulating substrate. The insulating material includes a thermosetting material being partially cured by stopping a cure thereof at a B-stage before reaching a gel point. The base structure is formed according to the 3-dimensional configuration, and the cure of the thermosetting material is completed.

A small-sized inductor with desired characteristics is provided. An inductor 1a includes a resin layer 3 and an inductor electrode 6, which includes an inner winding portion 6a and an outer winding portion 6b. The inner winding portion 6a and the outer winding portion 6b forming the inductor electrode 6 include the metal pins 7a to 7d and the wiring boards 8a to 8d. Here, the inner winding portion 6a and the outer winding portion 6b include the metal pins 7a to 7d and the wiring boards 8a to 8d, which have lower specific resistance than conductive paste or plating. This structure thus can reduce the resistance of the entirety of the inductor electrode 6, and improve the characteristics of the inductor 1a. The inductor 1a can reduce its size by including the inductor electrode 6 wound to have a multiplex winding structure.

A method of determining curing conditions is for determining the curing conditions of a thermosetting resin to seal a conductive part between a substrate and an electronic component. A curing degree curve is created. The curing degree curve indicates, with respect to each of heating temperatures, relationship between heating time and curing degree of the thermosetting resin. On the basis of the created curing degree curve, a void removal time of a void naturally moving upward in the thermosetting resin, at a first heating temperature, is calculated. The first heating temperature is one of the heating temperatures.

An electronic component is mounted on the mounting face of a printed wiring board and a plurality of terminals arranged on the mounting face of the printed wiring board are respectively bonded to a plurality of terminals arranged on the bottom surface of the electronic component by means of solder. Solder paste containing powdery solder and thermosetting resin is provided to the plurality of terminals on the mounting face, then the electronic component is mounted on the mounting face of the printed wiring board, and subsequently the solder paste is heated to bond the corresponding terminals by means of molten solder. Thereafter, the molten solder is allowed to solidify and the thermosetting resin separated from the solder paste is allowed to cure in a state where it is held in contact with metal members arranged separately relative to the terminals.

A printed circuit board and a method of manufacturing the same are disclosed. The printed circuit board includes: a first core layer including a first insulating layer and a first core; a second core layer including a second insulating layer and a second core; a first element embedded in the first core; a second element embedded in the second core; a first pad and a second pad disposed on the first core layer and connected to the first element; a third pad and a fourth pad disposed on the second core layer and connected to the second element; and first connection layers interposed between one surface of the first core layer and one surface of the second core layer. The first pad and the third pad contact each other, and the first connection layers include at least one material of SiO.sub.2, SiN, and SiCN.

According to at least one aspect, a lighting system is provided. The lighting system includes a first lighting device comprising a first light emitting diode (LED), a second lighting device comprising a second LED, a two-part connector configured to electrically couple the first lighting device to the second lighting device and comprising a first connector portion attached to the first lighting device and a second connector portion attached to the second lighting device, at least one elastomer commonly encapsulating the first lighting device, the second lighting device, and the two-part connector, and a cutting device configured to facilitate separation of the first lighting device from the second lighting device at least in part by cutting at least some of the at least one elastomer that is adjacent a surface of the two-part connector.

An integrated multilayer assembly for an electronic device includes a first substrate film configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature on the first side of the first substrate film, at least one other electrical feature on the first side of the second substrate film, and a molded plastic layer between the first and second substrate films at least partially embedding the electrical features on the first sides thereof.

A method for producing an electric component carrier for automobile applications, in particular an electric component carrier for a lock. The electric component carrier is equipped with a conductive track arrangement and a base plate, which supports the conductive track. In the initial state, the conductive track arrangement has one or more separation points depending upon the required mode of operation in the operational state. According to the invention, the conductive track arrangement in the initial state is coated at least partially with a casting compound by means of injection molding and then the separation point is introduced into the free region.

A method of vertically assembling encapsulated single microbatteries, wherein the vertical assembly contains, between the microbatteries, an electrical insulation and/or sealing layer and a metal layer, successively including: a step of stacking and attaching at least two single microbatteries, previously encapsulated, stacked on each other; and forming a metal layer, capable of ensuring the electrical coupling of each of the metal layers of each of the encapsulated single microbatteries. Each of the at least two encapsulated single microbatteries is previously prepared by: forming at least one electrical insulation and/or sealing layer over at least a portion of the lateral sides and of the surface including the current collectors of a microbattery including positive and negative electrodes, an electrolyte, and positive and negative current collectors; making the current collectors of the microbattery accessible; and forming a metal layer extending from the current collectors to the lateral sides of said microbattery.

An electrical node including a first substrate film defining a cavity and a first material layer arranged to at least partly fill the cavity, and to embed or at least partly cover at least one electrical element arranged into the cavity, wherein the first material layer includes elastic material to reduce thermal expansion related stresses between elements adjacent thereto.