An electronic device includes electrical components in a housing. The components may include optical components such as a display. Protective structures may be used to protect the optical components. The protective structures may include one or more protective transparent layers such as layers of glass or crystalline material such as sapphire. The protective transparent layers may be coated with an oleophobic coating. To enhance coating durability, catalyst may be used to help bond the oleophobic coating. An adhesion promotion layer such as a silicon oxide layer may be deposited on the transparent protective layer. A catalyst layer such as a layer of sodium fluoride may be deposited on the adhesion promotion layer. The oleophobic material may be evaporated or otherwise deposited on the catalyst layer. Heat and moisture may help the oleophobic material form chemical bonds with the adhesion promotion layer, thereby forming a durable oleophobic coating.

Sensors, as well as systems and methods of using the same are provided. Aspects of the sensors include a piezoelectric base, a plurality of surface-associated compositions that are stably associated with the piezoelectric base, and a plurality of crosslinking compositions that are configured to crosslink one or more surface-associated compositions in the presence of an analyte. The sensors, systems and methods described herein find use in a variety of applications, including the detection of an analyte in a sample.

An electronic device includes electrical components in a housing. The components may include optical components such as a display. Protective structures may be used to protect the optical components. The protective structures may include one or more protective transparent layers such as layers of glass or crystalline material such as sapphire. The protective transparent layers may be coated with an oleophobic coating. To enhance coating durability, catalyst may be used to help bond the oleophobic coating. An adhesion promotion layer such as a silicon oxide layer may be deposited on the transparent protective layer. A catalyst layer such as a layer of sodium fluoride may be deposited on the adhesion promotion layer. The oleophobic material may be evaporated or otherwise deposited on the catalyst layer. Heat and moisture may help the oleophobic material form chemical bonds with the adhesion promotion layer, thereby forming a durable oleophobic coating.

A method of making a sensor comprises depositing a plurality of surface-associated compositions on a piezoelectric base. The plurality of surface-associated compositions are adapted to stably associate with the piezoelectric base. The method further comprises depositing a plurality of crosslinking compositions on top of the surface-associated compositions. The crosslinking compositions are configured to bind to an analyte and crosslink one or more of the surface-associated compositions when the analyte binds to an analyte binding domain of a crosslinking composition and the surface-associated compositions include one or more polyclonal antibodies.

A system for protecting electronics includes a printed wiring assembly (PWA) having a surface with at least one electronic component. The system also includes a water resistant film configured to be used as a conformal coating on the PWA and further configured to be placed on the surface of the PWA and to shrink about the at least one electronic component.

A system for protecting electronics includes a printed wiring assembly (PWA) having a surface with at least one electronic component. The system also includes a water resistant film configured to be used as a conformal coating on the PWA and further configured to be placed on the surface of the PWA and to shrink about the at least one electronic component.

A device includes a printed circuit board assembly having a printed circuit board and one or more electronic components disposed on the printed circuit board, and a nanofilm disposed on the printed circuit board assembly. The nanofilm includes an inner coating in contact with the printed circuit board assembly, the inner coating including metal oxide nanoparticles having a particle diameter in a range of 5 nm to 100 nm; and an outer coating in contact with the inner coating, the outer coating including silicon dioxide nanoparticles having a particle diameter in a range of 0.1 nm to 10 nm.

A circuit board includes a base layer, an electrode layer formed on the base layer, a passivation layer formed on the electrode layer while opening a part of the electrode layer, and a surface treatment layer formed on the open surface of the electrode layer. The surface treatment layer may contain 70 to 40% of copper and 30 to 60% of nickel.

A method for waterproofing a device and the resulting device are provided. The device includes a printed circuit board assembly (PCBA), which includes a printed circuit board, and at least one electronic component disposed on the printed circuit board. A waterproof coating such as a polymer coating is disposed on or in contact with at least one portion of the at least one electronic component. A nanofilm is disposed on the PCBA. The nanofilm includes an inner coating and an outer coating. The inner coating is disposed on the printed circuit board or in contact with the waterproof coating. The inner coating comprises metal oxide nanoparticles having a particle diameter in a range of about 5 nm to about 100 nm. The outer coating in contact with the inner coating, and comprises silicon dioxide nanoparticles having a particle diameter in a range of 0.1 nm to 10 nm.

A method for fabricating a printed circuit board comprising preparing a surface of an organic material substrate then depositing conductive traces and at least one conductive pad on the organic material substrate through an additive deposition process. The conductive traces and pads are then heat-treated to create electrically conductive pathways and at least one heat-treated conductive pad. A dielectric material is then deposited through the additive deposition process over a portion of the heat-treated conductive traces to create a dielectric material containing area and a non-dielectric material containing area. The dielectric material containing area is then heat-treated.