Patent classifications
H05K2203/1333
SENSORS, SYSTEMS AND METHODS FOR DETECTING ANALYTES USING SAME
Sensors, as well as systems and methods of using the same are provided. Aspects of the sensors include a piezoelectric base, a plurality of surface-associated compositions that are stably associated with the piezoelectric base, and a plurality of crosslinking compositions that are configured to crosslink one or more surface-associated compositions in the presence of an analyte. The sensors, systems and methods described herein find use in a variety of applications, including the detection of an analyte in a sample.
Coated electrical assembly
The present invention relates to an electrical assembly which has a conformal coating, wherein said conformal coating is obtainable by a method which comprises: (a) plasma polymerization of a compound of formula (I) and a fluorohydrocarbon, wherein the molar ratio of the compound of formula (I) to the fluorohydrocarbon is from 5:95 to 50:50, and deposition of the resulting polymer onto at least one surface of the electrical assembly: wherein: R.sub.1 represents C.sub.1-C.sub.3 alkyl or C.sub.2-C.sub.3 alkenyl; R.sub.2 represents hydrogen, C.sub.1-C.sub.3 alkyl or C.sub.2-C.sub.3 alkenyl; R.sub.3 represents hydrogen, C.sub.1-C.sub.3 alkyl or C.sub.2-C.sub.3 alkenyl; R.sub.4 represents hydrogen, C.sub.1-C.sub.3 alkyl or C.sub.2-C.sub.3 alkenyl; R.sub.5 represents hydrogen, C.sub.1-C.sub.3 alkyl or C.sub.2-C.sub.3 alkenyl; and R.sub.6 represents hydrogen, C.sub.1-C.sub.3 alkyl or C.sub.2-C.sub.3 alkenyl, and (b) plasma polymerization of a compound of formula (I) and deposition of the resulting polymer onto the polymer formed in step (a). ##STR00001##
LAMINATED STRUCTURE WITH PADS
A laminated structure and the manufacturing methods thereof are provided. The structure includes an interconnect substrate having a first surface and a second surface opposite to the first surface, an insulating encapsulant laterally wrapping the interconnect substrate, and a redistribution structure disposed on the first surface of the interconnect substrate and electrically connected with the interconnect substrate. The redistribution structure has a third surface facing the first surface and a fourth surface opposite to the third surface. The redistribution structure includes first pads, second pads located beside the first pads, and protective patterns disposed on the first pads and covering the first pads. The first pads include pad portions protruded from the fourth surface and the protective patterns are in contact with sidewalls and top surfaces of the pad portions of the first pads.
Laminated structure with pads and manufacturing method thereof
A laminated structure and the manufacturing methods thereof are provided. The structure includes an interconnect substrate having a first surface and a second surface opposite to the first surface, an insulating encapsulant laterally wrapping the interconnect substrate, and a redistribution structure disposed on the first surface of the interconnect substrate and electrically connected with the interconnect substrate. The redistribution structure has a third surface facing the first surface and a fourth surface opposite to the third surface. The redistribution structure includes first pads, second pads located beside the first pads, and protective patterns disposed on the first pads and covering the first pads. The first pads include pad portions protruded from the fourth surface and the protective patterns are in contact with sidewalls and top surfaces of the pad portions of the first pads.
TECHNIQUES FOR MANUFACTURING A WEARABLE DEVICE
Methods, systems, and devices for manufacturing a wearable device are described. Techniques described herein may enable a method for forming one or more dome-shaped protrusions over apertures of a wearable device usable to collect physiological data from a user. For example, a manufacturing process may include adhering a layer of a material with a relatively lower surface energy than metal onto an outer surface of the inner housing of the wearable device prior to dispensing an optically transparent material into the apertures. The optically transparent material may accordingly form the dome-shaped protrusions while in contact with the layer, which may enable the optically transparent material to form relatively higher dome-shaped protrusions as compared to a dome-shaped protrusion formed on a metal material. The layer may be removed following dispensing of the optically transparent material.
TECHNIQUES FOR EQUALIZING DOME HEIGHTS FOR WEARABLE DEVICES
Methods, systems, and devices for manufacturing a wearable device are described. Techniques described herein may enable a method for forming one or more dome-shaped protrusions over apertures of a wearable device usable to collect physiological data from a user. For example, a manufacturing process may include forming the dome-shaped protrusions via a channel that connects a first cavity housing a first sensor and a second cavity housing a second sensor. For example, the optically transparent material may be dispensed through a first aperture into the first cavity, may flow via the channel into the second cavity, and may therefore form dome-shaped protrusions through both of the first aperture and a second aperture of the second cavity. The dome-shaped protrusions may accordingly have a same height above a surface of the wearable device.
Fully 3D Printed mm-Wave Board Embedded Designs with High Integration Levels
A printed circuit board (PCB) that has been fabricated by a 3D printing process. The PCB includes a substrate printed by the 3D printing process, a plurality of stacked dielectric layers printed on the substrate by the 3D printing process, and a plurality of embedded electrical circuit components printed by the 3D printing process on and throughout the substrate and the plurality of dielectric layers. The PCB can be part of a device that operates at millimeter wave frequencies, such as a mm-wave antenna.