A vertical circuit board printer includes a multi-layer conveyor, a printer assembly, and a control system. The multi-layer conveyor includes a number of front conveyors and one rear conveyor. Each upper front conveyor is coupled to a lower front conveyor by a circuit board-lowering mechanism to transport a number of circuit boards in sequence from the number of front conveyors to the rear conveyor. The printer assembly includes a number of printers arranged in sequence above the number of front conveyors. The control system controls operation of the multi-layer conveyor and controls operation of the printing assembly through a software system.

A filling assembly for filling holes formed in a board with a filling material, including: a board holding device having a carrier frame formed by frame elements to hold the board; a filling device arranged on a side of the carrier frame and includes a filling material feeding device with a filling head to provide filling material to the board, wherein the filling head is movable relative to the carrier frame parallel to the carrier frame surface; a screen holding frame formed by screen holding frame elements to hold a screen between the carrier frame and the filling device, wherein the screen includes a screen cloth surrounded by a screen frame; and a fixing device with an expansion element arranged in a frame element, wherein the expansion element can provide a temporary compressive force to the screen frame to fixedly press the screen frame against a screen holding frame.

This invention forms a multilayer substrate by one apparatus. A multilayer substrate forming method includes fixing a substrate on a stage, forming, on the substrate fixed on the stage, a layer of a mixed material obtained by mixing a conductive material and a photo-curing resin, performing exposure by scanning a laser beam according to first circuit pattern data prepared in advance on the layer of the mixed material, washing away the mixed material on the substrate after the exposure in the performing exposure by scanning the laser beam according to the first circuit pattern data, forming a layer of an insulating resin on the substrate after the cleaning in the washing away the mixed material on the substrate after the exposure in the performing exposure by scanning the laser beam according to the first circuit pattern data, performing exposure by scanning a laser beam according to through hole data prepared in advance on the layer of the insulating resin, washing away the insulating resin on the substrate after the exposure in the performing exposure by scanning the laser beam according to the through hole data, forming a layer of the mixed material on the substrate after the cleaning in the washing away the insulating resin, performing exposure by scanning a laser beam according to second circuit pattern data prepared in advance on the layer of the mixed material, and washing away the mixed material on the substrate after the exposure in the performing exposure by scanning the laser beam according to the second circuit pattern data.

A shield enclosure includes a housing with a peripheral wall that defines a cavity, and a cover removably coupleable to the housing to at least partially seal the cavity. The cavity is sized to receive a printed circuit board therein. The housing shields the printed circuit board from electromagnetic interference and noise during noise figure testing of a radiofrequency component on the printed circuit board.

A pressing area set on a main surface of a plate-shaped holding jig is arranged on contact parts. The contact parts are pressed against a multilayer board while heating the multilayer board and the pressing area of the holding jig is inclined with a warp of the multilayer board. In this way, when pressing for bonding the contact parts is performed, even if the multilayer board is warped by the heating and the contact parts are shifted, the contact parts are pressed against the multilayer board without fail.

A method for repairing a printed circuit board (PCB) including the steps of presenting a PCB having an initial coating on a surface thereof, removing the initial coating from the surface of the PCB at least in an area in need of repair, and recoating at least the area of the PCB in need of repair by way of atomic layer deposition.

A blade includes an edge to be pressed against an end portion of a carrier film to fold the end portion upwards from a sheet. A clamp mechanism peels the carrier film off from the sheet by moving while clamping the upwardly folded end portion of the carrier film.

A method of manufacturing printed circuit boards includes some or all of: chemically or electrically applying metallic layers to a substrate; incorporating bores into the substrate; through-contacting the bores incorporated into the substrate; applying a layer from a photoresist to an electrically conducting layer in a masking step; exposing the photoresist while using an exposure mask in an exposing step; removing exposed or unexposed regions of the layer from the photoresist while in regions laying bare the electrically conducting layer in a developing step; removing the laid-bare regions of the electrically conducting layer in an etching step; cleaning the substrate in a rinsing step; and drying the substrate, wherein the substrate for carrying out the developing step and/or the etching step is set in rotation and a developer solution and/or an etching liquid is applied to the rotating substrate by at least one nozzle.

A conveyor system for a stencil printer includes a pair of rail members, with the pair of rail members extending through a frame and configured to transport the substrate through the stencil printer. The conveyor system further includes, for each rail member, a lift tool assembly coupled to the rail member. The lift tool assembly includes a lifter portion, a main plate secured to the lifter portion, and a clamping member coupled to the main plate. The clamping member is configured to move horizontally between a substrate engaged position and a substrate disengaged position. The lift tool assembly further includes a thin foil coupled to the main plate. The thin foil is configured to move vertically and horizontally, independent from the clamping member.

A component fastening system includes a fastener for fastening a first electronic component to a second electronic component and a movable part configured to move the fastener. The fastener includes an arm, a head, and a lock. The arm is connected to the movable part. The head is connected to the arm and contacts the first electronic component. The lock contacts the arm when the first electronic component is moved to a reference space and is spaced apart from the arm when the first electronic component is fastened to the second electronic component.