To provide a substrate holder and a plating apparatus that can easily position a substrate. A substrate holder includes a substrate holding body for holding a substrate, and a first holding member and a second holding member that interpose and hold the substrate holding body therebetween, and the first holding member includes an opening portion through which the plating target surface of the substrate is exposed, and a power supply member configured to be in contact with a plating target surface of the substrate.

A method for manufacturing an electronic component by a pressure-assisted low-temperature sintering process, by using a pressure sintering device having an upper die and a lower die is disclosed. The upper the die and/or the lower die is provided with a first pressure pad, wherein the method includes the following steps: placing a first sinterable component on a first sintering layer provided on a top layer of a first substrate; joining the sinterable component and the top layer of the first substrate to form a first electronic component by pressing the upper die and the lower die towards each other, wherein the sintering device is simultaneously heated.

A soldering apparatus for selective soldering, comprising a solder bath for holding the molten solder at least one solder nozzle a solder pump for conveying solder from the solder bath through the solder nozzle a movement device for the relative movement of the solder nozzle and an assembly to be soldered
wherein several solder nozzles are provided in several solder nozzle assemblies, with each solder nozzle assembly having one or more solder nozzles and wherein each solder nozzle assembly may be assigned an assembly, and the movement device is designed for synchronous movement of the several solder nozzle assemblies relative to the respective assemblies in the horizontal X-Y plane, and the soldering machine is so designed that the individual solder nozzle assemblies and the respective assemblies may be moved towards one another and independently of one another in the vertical direction (Z-direction) by means of a coupling device.

Embodiments of the present invention provide a manufacturing jig and a manufacturing apparatus for a temperature measuring sample. The manufacturing jig for a temperature measuring sample includes a first clamping mechanism configured to clamp the strip thermometer and adjust position of the strip thermometer, so that the best temperature measuring point at an end of the strip thermometer is at width center point of the coupling end of the printed circuit board. With the first clamping mechanism, the best temperature measuring point can be located at the width center point of the coupling end, so that alignment deviation of the best temperature measuring point in the width direction of the coupling end due to manual alignment is greatly reduced, which further ensures temperature measuring result of the temperature measuring sample are more accurate, and accurate control on actual pressing temperature of the pressing device can be achieved.

A soldering apparatus, in particular a reflow soldering apparatus, for the continuous soldering of printed circuit boards along a transport direction, including a process channel that has a preheating zone, a soldering zone and a cooling zone, and further includes a base body and a cover hood movable between a closed position and an open position, wherein nozzle plates, fan units with fan motors, air ducts that conduct the process gas, filter elements and/or cooling elements are provided in the base body. The soldering apparatus further includes a drawer, which extends along a pull-out direction running transversely to the transport direction, is provided in the base body, with a bottom, a front wall and a rear side. Air ducts for conducting the process gas, at least one replaceable filter element in a filter region and at least one cooling device are provided in the drawer.

A system is provided for installing a heatsink onto a circuit board. The heatsink has a base, a first hook and a second hook. The system includes a heatsink holder, a circuit board arm, a heatsink pusher, and a hook pusher. The heatsink holder is operable to receive the heatsink. The circuit board arm is operable to move the circuit board onto the heatsink received on the heatsink holder such that the bottom surface of the heatsink is adjacent to the circuit board. The heatsink pusher is operable to move the heatsink holder in a first direction so as to move the first hook relative to the first catch. The hook pusher is operable to push the first hook in a direction normal to the base from the top surface to the bottom surface.

An apparatus for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.

A conveyor system for a stencil printer includes a pair of rail members, with the pair of rail members extending through a frame and configured to transport the substrate through the stencil printer. The conveyor system further includes, for each rail member, a lift tool assembly coupled to the rail member. The lift tool assembly includes a lifter portion, a main plate secured to the lifter portion, and a clamping member coupled to the main plate. The clamping member is configured to move horizontally between a substrate engaged position and a substrate disengaged position. The lift tool assembly further includes a thin foil coupled to the main plate. The thin foil is configured to move vertically and horizontally, independent from the clamping member.

An apparatus that cleans end surfaces of a substrate includes: a guide unit including a guide portion that has a channel, through which an end surface of a substrate passes, formed in a front surface thereof; and a brush with a front end whose position is controlled by a rear surface of the guide portion. The channel includes an opening that extends through the guide portion and the front end of the brush contacts an end surface of a substrate passing through the channel via the opening. The guide unit includes a concave portion in which at least the front end of the brush is housed and a suction hole that sucks dust from the concave portion.

Discussed is a laser welding apparatus including a lower jig, a laser welding unit configured to weld a metal and another metal to each other, the metal being disposed at an upper surface of a printed circuit board (PCB) disposed on the lower jig, and an upper jig configured to support at least one of at least a part of the upper surface of the PCB, at least a part of an upper surface of the metal, and at least a part of an upper surface of the another metal, wherein: the upper jig is fixed such that the vertical position of the upper jig is constant, or when the upper jig is movable upwards and downwards, the upper jig is configured to be fixed at a specific position.