Provided is a method for producing a conductive member including: forming a first silver halide emulsion layer, a light absorption layer, and a second silver halide emulsion layer on a transparent support in this order; performing pattern exposure on the first silver halide emulsion layer; and the second silver halide emulsion layer and applying a development treatment thereto to obtain a conductive layer comprising a thin metal wire, in which the light absorption layer absorbs at least some of the wavelengths of light to which the first silver halide emulsion layer or the second silver halide emulsion layer is exposed.

A bonding method of a flexible display module is provided. The flexible display module includes a flexible display panel having a first bonding area and an integrated driving circuit having a second bonding area. The bonding method includes: attaching, through a colloid, a transfer plate to a surface of the flexible display panel; solidifying the colloid facing the first bonding area to form a fixed portion; flattening the transfer plate to flatten the first bonding area through the fixed portion; aligning the second bonding area with the first bonding area pre-laminating the first bonding area and the second bonding area at a first temperature; breaking the fixed portion, and separating the flexible display panel and the transfer plate; flattening the flexible display panel; laminating the first bonding area and the second bonding area at a second temperature to form the flexible display module.

A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.

In a method for manufacturing a multilayer substrate for having a BGA-type component thereon, a conductive through hole for restricting a signal interference and a resist film are formed on the multilayer substrate, an occurrence of a fault caused by a residual of a resist in the conductive through hole is reduced. In the method for manufacturing the multilayer substrate for having the BGA-type component thereon, a step of forming the resist film includes an applying step of applying a photosensitive resist to an entirety of a front surface portion of a base. The applying step is performed while restricting the resist from entering the conductive through hole by supplying a high pressure air to a rear surface of the base to pass through the conductive through hole using an air supply mechanism.

An optoelectronic assembly (10) is provided in different embodiments. The optoelectronic assembly (10) has the following; a printed circuit board (12); at least one optoelectronic first component (20) which is arranged on a first face (14) of the printed circuit board (12); a heat sink (24) which has a first surface (26) that is arranged on a second printed circuit board (12) face (16) facing away from the first component (20), wherein a boundary surface (34) extends between the second face (16) and the first surface (26); and at least one first welding connection (30), by means of which the heat sink (24) is directly connected to the printed circuit board (12) in a bonded manner and which together with the boundary surface (34) forms a first cut surface (36), the first component (20) at least partly overlapping the cut surface.

An electronic device capable of supplying a large current to a circuit pattern containing conductive nanoparticles includes a substrate, a region provided on the substrate, configured to mount an electronic component therein, a first circuit pattern placed within the region and electrically connected to the electronic component, a second circuit pattern connected to the first circuit pattern and configured to supply current to the first circuit pattern from outside of the region. At least a part of the first circuit pattern includes a layer obtained by sintering conductive nanosized particles with a diameter of less than 1 m. The second circuit pattern is thicker than the first circuit pattern.

A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.

An applying apparatus that applies a flux liquid includes: a nozzle from which the flux liquid is injected; and an intake and exhaust unit that sucks the flux liquid injected from the nozzle through an intake port and exhausts a gas through an exhaust port. The intake and exhaust unit has a filtering unit that filters the flux liquid sucked through the intake port and through which the gas passes before the gas reaches the exhaust port. The filtering unit is movably provided within the intake and exhaust unit so that when installing/removing the filtering unit with respect to the intake and exhaust unit, the filtering unit moves in a direction substantially parallel to a direction in which the flux liquid is sucked through the intake port and in which the gas is exhausted through the exhaust port.

An apparatus and method for establishing a contact connection between at least one connection contact of a substrate and at least one connection contact of a semiconductor component, a conductor material web being formed on the substrate and the semiconductor component. The apparatus includes a joining tool for positioning and joining the semiconductor component on/to the substrate, a beam channel for optical radiation being formed within the joining tool, a laser device for applying laser radiation to the substrate and/or to the semiconductor component, a detection device for detecting optical radiation, and a substrate receptacle on which the substrate is fixed in place and with which at least one underside of the substrate can be brought into contact. An optical window having an optically transparent window body is incorporated in the substrate receptacle for the unobstructed passage of optical radiation into and/or out of the substrate, the optical window being disposed in a beam path of the laser device and/or in a beam path of the detection device.

An apparatus may reinforce solder joints by bracing corners of integrated circuit substrates. To do so, an exemplary apparatus may include (1) a substrate of an integrated circuit coupled to a circuit board and (2) at least one corner reinforcement brace coupled to the circuit board and at least one corner of the substrate. Various other apparatuses, systems, and methods are also disclosed.