A printed circuit board according to various embodiments of the disclosure includes a plurality of layers in which at least one opening is formed and at least one antenna included in at least one layer among the plurality of layers, and the at least one opening is located within a specified distance from the at least one antenna and is formed through at least one of the plurality of layers.

A method of manufacturing component carriers includes carrying out a test for each of multiple sections of a component-carrier structure, inserting at least one functional component in each of further sections of a further component-carrier structure to be connected with the component-carrier structure so that each further section assigned to a respective section having successfully passed the test is provided with at least one functional component, and inserting at least one functionally inactive dummy component in each of the further sections assigned to a respective section having failed the test.

A display module and its formation method are provided in the present disclosure. The display module includes a main flexible circuit board, including a first binding terminal, a second binding terminal, a first test point and a second test point, where the first test point is electrically connected to the first binding terminal, and the second test point is electrically connected to the second binding terminal; and further includes an auxiliary flexible circuit board, including a third binding terminal and a fourth binding terminal, where the third binding terminal is electrically connected to the fourth binding terminal, the first binding terminal is disposed corresponding to the third binding terminal, and the second binding terminal is disposed corresponding to the fourth binding terminal.

A testing apparatus includes a chip carrying device and a pressing device. The chip carrying device includes a circuit board and a plurality of electrically connecting units that are disposed on the circuit board and each can receive a chip. The pressing device includes a cover and an abutting member disposed between the cover and the electrically connecting units. The cover is disposed on the circuit board to jointly define an accommodating space that accommodates the abutting member and the electrically connecting units. The cover can be connected to an air suction apparatus for expelling air in the accommodating space. When the air suction apparatus performs a suction operation to expel the air in the accommodating space, the abutting member is abutted against the electrically connecting units and the chips so as to connect each of the electrically connecting units and the corresponding chip.

A display panel including: a substrate; a plurality of first connecting wires in a first portion of the substrate and connected to a first flexible printed circuit board; a plurality of second connecting wires in a second portion of the substrate and connected to a second flexible printed circuit board, the second portion being adjacent to the first portion; first and second test pads provided between the first and second portions of the substrate, the first test pad being connected to an endmost first connecting wire adjacent to the second portion, the second test pad being connected to an endmost second connecting wire adjacent to the first portion; and an electrical circuit in which the endmost first and second connecting wires are included in different power supply nodes.

In a device for producing and/or processing a workpiece, in particular circuit boards (1), in a work station (2), in particular for printing a corresponding blank or for checking finished circuit boards (1), at least one mark (15) is provided on the workpiece. In this arrangement, at least one reference (14), which can be brought into alignment with the mark (15), is provided in the work station (2).

The present disclosure relates to extremely high frequency (“EHF”) systems and methods for the use thereof, and more particularly to board-to-board connections using contactless connectors.

A printing process for printing an ink pattern on a substrate is provided. The ink pattern to be printed is based on an available pattern layout. The pattern layout defines a desired layout of the ink pattern to be printed. Based on the pattern layout an input image for allocating dot positions of the ink pattern is generated. The printing process includes a step of comparing a scan image with the input image to carry out a quality inspection to detect any print defects in the printed ink pattern. The printing process includes a step of providing a decision on an approval or a rejection of the printed ink pattern. In case of an approval, the substrate can be supplied to a subsequent processing station to finalize the substrate. In case of a rejection, the substrate including print defects can be recycled.

A multilayer printed circuit having a control circuit including n vias that are connected in series between a first and a second electrical terminal so that an applied electric current passes at least partially through each one of the n vias. The control circuit includes track portions in each one of the layers, each one of the n vias connecting a track portion of one layer to a track portion of another layer. The control circuit includes a measurement device for measuring a potential difference across its terminals, storage for storing a threshold value and a comparator for comparing the potential difference with the threshold value so as to validate the printed circuit when the potential difference is lower than the threshold value.

A fixing jig is provided, including a supporting base, a fixing plate, and a fixing component. The supporting base includes a first upper surface. The fixing plate is disposed on the supporting base. A side of the fixing plate is pivotally connected to the supporting base and includes a second upper surface, a bottom surface, and via a hole. The fixing component presses the fixing plate on the second upper surface. The fixing jig can fix an object pending testing and allows one flexible electric circuit board of the object pending testing to be exposed outside of the fixing jig, so that when performing a pull force test, this can allow an angle between two flexible electric circuit boards to be 90 degrees, thereby improving accuracy of an experimental result.