A circuit board includes a board, a land on the board, and an electronic component soldered to the land, the electronic component including a surface with a back surface electrode portion, the surface opposing the board, the land including an electrode land portion and a protruding land portion, the back surface electrode portion opposing the electrode land portion in a state in which the electronic component and the board are soldered, and the protruding land portion and the electrode land portion being integrated.

A printed circuit board comprises a board main body, a sensor, an external connection pad, and a hollow-structured electrical conductor. The board main body has a top face and a bottom face opposite the top face. The sensor is mounted on one of the top face and the bottom face of the board main body. The external connection pad is provided on the top face or the bottom face of the board main body opposite the sensor. The hollow-structured electrical conductor extends through the board main body and electrically connects the sensor to the external connection pad.

An electronic circuit (4) comprises at least one electrically conductive portion arranged to a substrate (2) and at least one electrical coupling point (5) determined at the at least one electrically conductive portion. The electronic circuit (4) comprises at the at least one electrical coupling point (5) at least one magnetic and electrically conductive coupling element (6a, 6b, 6c, 6d, 6e, 6f, 6g, 6h, 6i, 6j, 6k, 6l) for providing an electrically conductive coupling point (5) with magnetic fastening force.

An operation checking device of an electronic component mounting machine is provided with a first memory section configured to memorize an operation program of the electronic component mounting machine including at least a collection operation of an electronic component by a collecting device; a second memory section configured to memorize shape data of the electronic component and shape data of the collecting device; a first acquiring section configured to acquire information of the electronic components and information of the collecting device based on the operation program required for a current operation memorized on the first memory section; and a second acquiring section configured to acquire corresponding shape data of the electronic component and shape data of the collecting device from the second memory section based on the information of the electronic component and the information of the collecting device acquired by the first acquiring section.

A manufacturing method of the light-emitting diode package structure is provided. A carrier is formed. The carrier comprises a first build-up circuit. At least one self-assembled material layer is formed on the first build-up circuit. A first solder mask layer is formed on the first build-up circuit. The first solder mask layer has at least one opening to expose a portion of the at least one self-assembled material layer. At least one light-emitting diode is disposed on the first build-up circuit. The at least one light-emitting diode has a self-assembled pattern, and the at least one light-emitting diode is self-assembled into the at least one opening of the first solder mask layer through a force between the self-assembled pattern and the at least one self-assembled material layer.

A monochrome image forming apparatus includes an image forming unit that forms a black image, a motor that drives the image forming unit, a control circuit that controls the motor, a first connector to which the motor is connected via a control line, a second connector to which a control target is not connected, and a substrate on which the control circuit, the first connector, and the second connector are arranged. A predetermined mark is formed on the substrate through silk screen printing. A distance between the predetermined mark and the second connector is shorter than a distance between the predetermined mark and the first connector. If the substrate is disposed in a multi-color image forming apparatus configured to form a color image, a control target for the multi-color image forming apparatus is connected to the second connector.

A manufacturing method of the light-emitting diode package structure is provided. A carrier is formed. The carrier comprises a first build-up circuit. At least one self-assembled material layer is formed on the first build-up circuit. A first solder mask layer is formed on the first build-up circuit. The first solder mask layer has at least one opening to expose a portion of the at least one self-assembled material layer. At least one light-emitting diode is disposed on the first build-up circuit. The at least one light-emitting diode has a self-assembled pattern, and the at least one light-emitting diode is self-assembled into the at least one opening of the first solder mask layer through a force between the self-assembled pattern and the at least one self-assembled material layer.

A light-emitting diode package structure includes a carrier, at least one self-assembled material layer, a first solder mask layer, and at least one light-emitting diode. The carrier includes a first build-up circuit. The self-assembled material layer is disposed on the first build-up circuit. The first solder mask layer is disposed on the first build-up circuit. The first solder mask layer has at least one opening to expose a portion of the self-assembled material layer. The light-emitting diode is disposed on the first build-up circuit. The light-emitting diode has a self-assembled pattern. The light-emitting diode is self-assembled into the opening of the first solder mask layer through a force between the self-assembled pattern and the self-assembled material layer. A manufacturing method of the light-emitting diode package structure is also provided.

A protection relay connection assembly (10) for connecting a current transformer (14) and/or a voltage transformer (16) of an electrical network (12) to a protection relay (18) is provided. The protection relay connection assembly (10) includes a protection relay data acquisition board (20) and a protection relay connector (22). The protection relay data acquisition board (20) includes a first current mating member (24) connectable to a current measurement sensor (28), the current measurement sensor (28) being connectable in use to the protection relay (18) and/or a first voltage mating member (26) connectable to a voltage measurement sensor (30), the voltage measurement sensor (30) being connectable in use to the protection relay (18). The protection relay connector (22) includes a second current mating member (36) connectable to the current transformer (14) and/or a second voltage mating member (38) connectable to the voltage transformer (16). The first current mating member (24) and the second current mating member (36) are selectively mateable with one another to permit a measured current waveform of the electrical network (12) to be transmitted from the current transformer (14) to the protection relay (18). The first voltage mating member (26) and the second voltage mating member (38) are shaped to be selectively mateable with one another to permit a measured voltage waveform of the electrical network (12) to be transmitted from the voltage transformer (16) to the protection relay (18). Wherein the first current mating member (24) is shaped to prevent mating of the first current mating member (24) with the second voltage mating member (38), and the first voltage mating member (26) is shaped to prevent mating of the first voltage mating member (26) with the second current mating member (36).

Systems and methods for improved interconnections for electronic components using ACAs are provided. The methods involve using magnets specific for each component to be connected and optimized in terms of size and strength and position relative to the substrate and component. Also provided are ovens adapted for use with the methods and systems and kits providing the parts of the system for use with existing ovens.