Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.

An apparatus, method and system for securing proprietary semiconductor IC components including a target semiconductor IC; at least one laser diode array disposed adjacent to the target semiconductor IC and coupled thereto; a power supply coupled to the at least one laser diode array; a sensor for sensing a predetermined parameter operatively coupled to the laser diode array through the power supply; wherein the sensor detects the existence of a predetermined event and as a result of the detection of the predetermined event activates the power supply and energizes the laser diode array, causing the laser diode array to project focused laser energy into the target semiconductor IC, damaging the target semiconductor IC.

An electronic circuit assembly comprises a substrate and circuit components attached to the substrate by means of an electrically conductive adhesive, wherein the adhesive is releasable under predetermined release conditions, whereby to enable the circuit components to be removed from the substrate for recovery or re-use.

The invention provides transient devices, including active and passive devices that physically, chemically and/or electrically transform upon application of at least one internal and/or external stimulus. Incorporation of degradable device components, degradable substrates and/or degradable encapsulating materials each having a programmable, controllable and/or selectable degradation rate provides a means of transforming the device. In some embodiments, for example, transient devices of the invention combine degradable high performance single crystalline inorganic materials with selectively removable substrates and/or encapsulants.

Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.

A detachment apparatus for detaching at least one component (120) from a circuit board (125) can include a shaft (105) configured to rotate about a central axis, at least one lever (110) having a first end and a second end, the lever being attached to the shaft at the first end, and a hook (115) attached to the second end of the lever. Rotation of the shaft causes the hook to come into contact with the component on the circuit board, and the hook is configured to separate the component from the circuit board.

Disclosed are an insulating material (high-k layer) which includes a fiber assembly mainly composed of a cellulose nanofiber, and an electroconductive metal material supported by the fiber assembly; and a passive element (capacitor) which includes a high-k layer which is composed of the insulating material, and an electroconductive part stacked on the high-k layer.

Processes for recycling printed wire boards using environmentally-friendly compositions, wherein electronic components, precious metals and base metals may be collected for reuse and recycling.

A method for extracting components includes the steps of heating an electronic device having one or more components to a predetermined temperature so as to substantially weaken a bonding substance arranged to bond the one or more components to the electronic device, and thereafter manipulating the electronic device to extract the one or more components from the electronic device.

Biodegradable printed circuit boards, or PCBs, may be produced from substrate sheets that include at least one biodegradable polymer. In addition, the electrical traces used on the PCBs, may also include a biodegradable polymer incorporated with an electrically conductive material. The PCBs may be composted to degrade the PCBs, and the