H05K2203/302

Printed circuit board and method for producing the printed circuit board

Disclosed is a printed circuit board having a holder for a battery, wherein the holder includes first and second contacts connected to conductive traces of the printed circuit board and wherein the holder is embodied such that a battery inserted into the holder is clamped so that poles of the battery on opposite end faces of the battery make electrical contact with the first and second contacts. The battery lies clamped between the contacts on a support region of the printed circuit board and is oriented with reference to the printed circuit board so that an imaginary line connecting the poles of the battery is essentially in parallel with the plane of the support region. The printed circuit board has connected with the support region a rigid first section, which is essentially perpendicular to the support region, and wherein the first contact is arranged on the first section.

Printed circuit board with a bent connecting section and method for testing and producing said printed circuit board, and also electronic control unit and method for operating said electronic control unit
11067622 · 2021-07-20 · ·

A method for testing a printed circuit board includes providing a printed circuit board having a first main section, a second main section, a bent connecting section and at least one monitoring conductor track. The connecting section is disposed between the first main section and the second main section. The monitoring conductor track runs from the first main section, in a curved manner through the connecting section, to the second main section. At least one electrical measurement value which is representative of the integrity of the at least one monitoring conductor track is detected. A printed circuit board, a control unit and methods for producing the printed circuit board and for operating the control unit are also provided.

MAIN BOARD WITH INTEGRATED TRUSTED PLATFORM MODULE FOR A COMPUTER DEVICE AND METHOD FOR PRODUCING A MAIN BOARD WITH INTEGRATED TRUSTED PLATFORM MODULE

A main board for a computer device can include main board components arranged on a first surface of the main board and Trusted Platform Module (TPM) components arranged on the first surface of the main board. The TPM components can be located in a predetermined area of the main board that is detachable from the main board (e.g. by means of a predetermined break line). A method for producing an embodiment of the main board with an integrated TPM can include producing a Printed Circuit Board (PCB); arranging a plurality of main board components in a first area of the PCB; and arranging TPM components in a second area of the PCB that is a detachable predetermined area of the main board. A predetermined breakline which at least partly surronds the predetermined area can be formed by drilling holes to form a perforated line.

RESIN MULTILAYER SUBSTRATE AND ELECTRONIC APPARATUS

A resin multilayer substrate includes a multilayer body including resin layers and adhesive layers that are laminated, via conductors in the resin layers, and bonding portions in the adhesive layers. The bonding portion is connected to the via conductor. One of the resin layer and the adhesive layer is a gas high-permeable layer having a higher gas permeability than the other one. The bonding portion includes an organic substance, or has a higher void content rate per unit plane sectional area than the via conductor. At least a portion of each of the bonding portions contacts the gas high-permeable layers.

Connection for printed circuit board assemblies

A printed circuit board assembly is provided. The assembly has a substantially rigid member, the substantially rigid member having a first protrusion, a support member with a first slot that accepts the protrusion in such a way to produce flex in at least one of the rigid member and the support member. The flex exerts compression on the protrusion that prevents it from disengaging the slot.

Circuit board interposer

An interposer for mechanically and electrically connecting two circuit boards is described. The interposer can be bent to enclose an area of a circuit board. The interposer can include a first layer external to the enclosed area. The first layer can be conductive and can serve as an EMI shield. The interposer can also include a second layer internal to the enclosed area. The second layer can be non-conductive but can carry multiple discrete pins that can electrically couple the first and second circuit boards and provide signal transmission pathways between the circuit boards. The interposer can be formed by folding a sheet of conductive material having different cutout regions that forms a comb pattern into multiple stacked layers. Then, the bent regions that connect the stacked layers can be removed so that the conductive bars in the comb patterns can be separated and isolated to form discrete pins.

Electronic control unit

An electronic control unit comprises at least one controller and at least one memory device, wherein the controller comprises at least one electronic component mounted on a main circuit board. An embedded circuit board is formed in one piece with the main circuit board, and a predetermined separation line is provided for separating the embedded circuit board from the main circuit board.

ELECTRICAL INTERCONNECTION SYSTEM AND METHOD FOR ELECTRICALLY INTERCONNECTING ELECTRICAL COMPONENTS OF A MODULE

An electrical interconnection system for electrical components of a module includes a hub printed circuit board (PCB) having a first electrically conductive track and a second electrically conductive track. Each of the first and second electrically conductive tracks is configured to electrically connect at least two of the electrical components of the module, wherein the at least two of the electrical components of the module are external to the hub PCB. The system also includes multiple electrical terminals, wherein each of the electrical terminals is configured to electrically connect one of the first and second electrically conductive tracks of the hub PCB to one of the at least two electrical components of the module.

RESIN MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE
20210045241 · 2021-02-11 · ·

A resin multilayer substrate includes a stacked body including a first main surface, a cavity provided in the first main surface, and conductor patterns provided in the stacked body. The stacked body includes insulating substrate layers including resin as a main material that are stacked. The cavity includes a side surface and a bottom surface. At least a portion of a boundary between the side surface and the bottom surface includes conductor patterns continuous with the side surface and the bottom surface.

Display device and method of manufacturing the same
10939547 · 2021-03-02 · ·

A display device includes a substrate having a flat portion, a first curved portion adjacent to a side of the flat portion, and a second curved portion adjacent to a corner of the flat portion and the first curved portion, and a display unit on the substrate, the display unit including a plurality of display pieces on the second curved portion of the substrate, the display pieces being spaced apart from each other, and extending from the corner of the flat portion to an edge of the second curved portion.