A semiconductor memory structure includes a substrate having thereon a transistor forming region and a capacitor forming region. A transistor is disposed on the substrate within the transistor forming region. A capacitor is disposed within the capacitor forming region and electrically coupled to the transistor. A first inter-layer dielectric layer covers the transistor forming region and the capacitor forming region. The first inter-layer dielectric layer surrounds a metal gate of the transistor and a bottom plate of the capacitor. A cap layer is disposed on the first inter-layer dielectric layer. The cap layer has a first thickness within the transistor forming region and a second thickness within the capacitor forming region. The first thickness is greater than the second thickness. The cap layer within the capacitor forming region acts as a capacitor dielectric layer of the capacitor.

A semiconductor memory structure includes a substrate having thereon a transistor forming region and a capacitor forming region. A transistor is disposed on the substrate within the transistor forming region. A capacitor is disposed within the capacitor forming region and electrically coupled to the transistor. A first inter-layer dielectric layer covers the transistor forming region and the capacitor forming region. The first inter-layer dielectric layer surrounds a metal gate of the transistor and a bottom plate of the capacitor. A cap layer is disposed on the first inter-layer dielectric layer. The cap layer has a first thickness within the transistor forming region and a second thickness within the capacitor forming region. The first thickness is greater than the second thickness. The cap layer within the capacitor forming region acts as a capacitor dielectric layer of the capacitor.

A semiconductor device includes first nanostructures vertically separated from one another, a first gate structure wrapping around each of the first nanostructures, and second nanostructures vertically separated from one another. The semiconductor device also includes a second gate structure wrapping around the second nanostructures, a first drain/source structure coupled to a first end of the first nanostructures, a second drain/source structure coupled to both of a second end of the first nanostructures and a first end of the second nanostructures, and a third drain/source structure coupled to a second end of the second nanostructures. The first drain/source structure has a first doping type, the second and third drain/source structures have a second doping type, and the first doping type is opposite to the second doping type.

A semiconductor device includes first nanostructures vertically separated from one another, a first gate structure wrapping around each of the first nanostructures, and second nanostructures vertically separated from one another. The semiconductor device also includes a second gate structure wrapping around the second nanostructures, a first drain/source structure coupled to a first end of the first nanostructures, a second drain/source structure coupled to both of a second end of the first nanostructures and a first end of the second nanostructures, and a third drain/source structure coupled to a second end of the second nanostructures. The first drain/source structure has a first doping type, the second and third drain/source structures have a second doping type, and the first doping type is opposite to the second doping type.

An anti-fuse cell structure includes: a first anti-fuse transistor having a first end and a second end; a first selection transistor having a first end and a second end, the first end of the first selection transistor being electrically connected to the second end of the first anti-fuse transistor; and a Blow Enable (BE) line electrically connected to a first end of the first anti-fuse transistor, and configured to perform programming operation on the first anti-fuse transistor.

An anti-fuse cell structure includes: a first anti-fuse transistor having a first end and a second end; a first selection transistor having a first end and a second end, the first end of the first selection transistor being electrically connected to the second end of the first anti-fuse transistor; and a Blow Enable (BE) line electrically connected to a first end of the first anti-fuse transistor, and configured to perform programming operation on the first anti-fuse transistor.

The present disclosure relates to the technical field of semiconductors, and provides a semiconductor structure and a manufacturing method thereof. The semiconductor structure includes an anti-fuse unit, and the anti-fuse unit includes a selection unit and a memory cell. The semiconductor structure further includes: a substrate; a gate provided in the substrate, where in a cross section perpendicular to the substrate, the gate includes a first sidewall and a second sidewall opposite to each other; a first doped region, provided in the substrate and close to the first sidewall; a second doped region, provided in the substrate and close to the second sidewall; and an oxide layer, covering a partial surface of the gate. The gate, the first doped region and the oxide layer form the memory cell; the gate, the first doped region, the second doped region, and the oxide layer form the selection unit.

The present disclosure relates to the technical field of semiconductors, and provides a semiconductor structure and a manufacturing method thereof. The semiconductor structure includes an anti-fuse unit, and the anti-fuse unit includes a selection unit and a memory cell. The semiconductor structure further includes: a substrate; a gate provided in the substrate, where in a cross section perpendicular to the substrate, the gate includes a first sidewall and a second sidewall opposite to each other; a first doped region, provided in the substrate and close to the first sidewall; a second doped region, provided in the substrate and close to the second sidewall; and an oxide layer, covering a partial surface of the gate. The gate, the first doped region and the oxide layer form the memory cell; the gate, the first doped region, the second doped region, and the oxide layer form the selection unit.

A one-time programmable memory structure comprises: A transistor includes a gate. A capacitor includes a first electrode, a second electrode, and an insulating layer. The second electrode is disposed on the first electrode. A top surface of the first electrode and a top surface of the gate are located on a same plane perpendicular to a direction of the first electrode toward the second electrode. An interconnect structure is electrically connected between the transistor and the first electrode of the capacitor. The interconnect structure is electrically connected to the first electrode at a top surface of the first electrode. A resistor comprises a conductive layer. Top and bottom surfaces of the conductive layer are respectively located on a same plane, perpendicular to the direction of the first electrode toward the second electrode, with the top and bottom surfaces of the gate.

A one-time programmable memory structure comprises: A transistor includes a gate. A capacitor includes a first electrode, a second electrode, and an insulating layer. The second electrode is disposed on the first electrode. A top surface of the first electrode and a top surface of the gate are located on a same plane perpendicular to a direction of the first electrode toward the second electrode. An interconnect structure is electrically connected between the transistor and the first electrode of the capacitor. The interconnect structure is electrically connected to the first electrode at a top surface of the first electrode. A resistor comprises a conductive layer. Top and bottom surfaces of the conductive layer are respectively located on a same plane, perpendicular to the direction of the first electrode toward the second electrode, with the top and bottom surfaces of the gate.