A method of dividing drain select gate electrodes in a three-dimensional vertical memory device is provided. An alternating stack of insulating layers and spacer material layers is formed over a substrate. A first insulating cap layer is formed over the alternating stack. A plurality of memory stack structures is formed through the alternating stack and the first insulating cap layer. The first insulating cap layer is vertically recessed, and a conformal material layer is formed over protruding portions of the memory stack structures. Spacer portions are formed by an anisotropic etch of the conformal material layer such that the sidewalls of the spacer portions having protruding portions. A self-aligned separator trench with non-uniform sidewalls having protruding portions is formed through an upper portion of the alternating stack by etching the upper portions of the alternating stack between the spacer portions.

The present invention discloses a three-dimensional offset-printed memory (3D-oP) with multiple bits-per-cell. The mask-patterns for different bits-in-a-cell are merged onto a same data-mask. At different printing steps, a wafer is offset by different values with respect to the data-mask. Accordingly, data-patterns from a same data-mask are printed into different bits-in-a-cell.

The present invention discloses a three-dimensional 3D-oP (three-dimensional offset-printed memory)-based package (3D.sup.2-oP). The mask-patterns for different dice in a same 3D.sup.2-oP package are merged onto a same data-mask. At different printing steps, a wafer is offset by different values with respect to the data-mask. Accordingly, data-patterns from a same data-mask are printed into different dice in a same 3D.sup.2-oP package.

A 3D semiconductor device including: a first layer including a first monocrystalline layer, the first layer including first logic cells; a second layer including a monocrystalline semiconductor layer, the second layer overlying the first layer, the second layer including second transistors, where the logic cells include a Look-Up-Table logic cell, and where the second transistors are aligned to the first logic cells with less than 200 nm alignment error.

A die stack comprises a first integrated circuit (IC) die having at least a first device comprising a first source, a first drain and a first gate electrode above a first channel region between the first source and the first drain. A second IC die has at least a second device comprising a second source, a second drain and a second gate electrode above a second channel region between the second source and the second drain. The second gate electrode is connected to the first gate electrode by a path including a first through substrate via (TSV), the second drain connected to the first source by a path including a second TSV.

The present disclosure includes methods for replacement gate formation in memory, and apparatuses and systems including memory formed accordingly. An embodiment includes forming a first oxide material in an opening through alternating layers of a second oxide material and a nitride material. An array of openings can be formed through the first oxide material formed in the opening. The layers of the nitride material can be removed. A metal material can be formed in voids resulting from the removal of the layers of the nitride material.

A ROM cell includes first and second three-dimensional transistors. The second transistor is formed above the first transistor, and the channel portions of the first and second transistors overlap each other. First data is stored depending on whether first and second local interconnects connected to the nodes of the first transistor are connected to a same line, or different lines, out of a bit line and a ground power supply line. Second data is stored depending on whether third and fourth local interconnects connected to the nodes of the second transistor are connected to a same line, or different lines, out of a bit line and a ground power supply line.

The present invention discloses a mixed three-dimensional printed memory (3D-P). The slow contents (e.g., digital books, digital maps, music, movies, and/or videos) are stored in large memory blocks and/or large memory arrays, whereas the fast contents (e.g., operating systems, software, and/or games) are stored in small memory blocks and/or small memory arrays.

According to one embodiment, a semiconductor device includes a substrate; a stacked body; a columnar portion; a plate portion; and a sidewall insulating film. The thermal expansion coefficient of the substrate is 1. The stacked body includes a plurality of electrode layers and a memory cell array. The columnar portion includes a semiconductor body and a charge storage film. The plate portion includes a first layer and a second layer. The thermal expansion coefficient of the first layer is the .sub.2 being different from the .sub.1. The thermal expansion coefficient of the second layer is the .sub.3 being different from the .sub.2. The value of the .sub.3 is in a direction from the value of the .sub.2 toward the value of the .sub.1. The second layer faces the major surface of the substrate continuously in the memory cell array.

A semiconductor device may include: a plurality of source-side half channels positioned in a first region and arranged in first to 2Nth rows, wherein N is an integer equal to or greater than 2; a plurality of first drain-side half channels positioned in a second region at one side of the first region and arranged in first to Nth rows; a plurality of second drain-side half channels positioned in a third region at the other side of the first region and arranged in first to Nth rows; a plurality of first pipe channels suitable for connecting the first to Nth rows of source-side half channels to the first to Nth rows of first drain-side half channels, respectively; and a plurality of second pipe channels suitable for connecting the (N+1)th to 2Nth rows of source-side half channels to the first to Nth rows of second drain-side half channels, respectively.