A semiconductor device includes: a memory array; a modulation circuit configured to generate a temperature-dependent voltage; a driving circuit configured to access the memory array based on the temperature-dependent voltage; and a controller. The controller is configured to: determine an operation mode of the memory array; cause the driving circuit to provide a first current corresponding to a positive temperature coefficient in response to the operation mode being a read operation of the memory array; and cause the driving circuit to provide a second current corresponding to a negative temperature coefficient in response to the operation mode being a write operation of the memory array.

Semiconductor memory is provided wherein a memory cell includes a capacitorless transistor having a floating body configured to store data as charge therein when power is applied to the cell. The cell further includes a nonvolatile memory comprising a resistance change element configured to store data stored in the floating body under any one of a plurality of predetermined conditions. A method of operating semiconductor memory to function as volatile memory, while having the ability to retain stored data when power is discontinued to the semiconductor memory is described.

A method for manufacturing an electronic chip includes providing a semiconductor layer located on an insulator covering a semiconductor substrate. First and second portions of the semiconductor layer are oxidized up to the insulator. Stresses are generated in third portions of the semiconductor layer, and each of the third portions extend between two portions of the semiconductor layer that are oxidized. Cavities are formed which extend at least to the substrate through the second portions and the insulator. Bipolar transistors are formed in at least part of the cavities and first field effect transistors are formed in and on the third portions. Phase change memory points are coupled to the bipolar transistors.

In order to provide a crossbar switch type memory circuit designed to be usable in normal circumstances even when a resistance change element is in an adverse state, the present invention is provided with: a first unit including a first column wiring to which one end of a first resistance change element is connected, a first power supply-side transistor for controlling the connection of the first column wiring and a power supply node, a first ground-side transistor, of a reverse operation type to the first power supply-side transistor, for controlling the connection of the first column wiring and a ground node, and a first polarity control line for causing the first power supply-side transistor or the first ground-side transistor to turn on and the other to turn off by a polar signal from a polar signal terminal, the first polarity control line being connected to the control terminals of the first power supply-side transistor and first ground-side transistor; a second unit including a second column wiring to which one end of a second resistance change element is connected, a second power supply-side transistor, of the same operation type as the first power supply-side transistor, for controlling the connection of the second column wiring and the power supply node, a second ground-side transistor, of a reverse operation type to the second power supply-side transistor, for controlling the connection of the second column wiring and the ground node, a logic inversion circuit for inverting the polarity of the polar signal from the polar signal terminal and outputting the polarity-inverted signal, and a second polarity control line for causing the second power supply-side transistor or the second ground-side transistor to turn on and the other to turn off by a polar signal from the logic inversion circuit, the second polarity control line being connected to the control terminals of the second power supply-side transistor and second ground-side transistor; and n row wirings (n: positive integer) to which the other ends of the first and second resistance change elements are connected.

Bipolar transistors and MOS transistors are formed in a common process. A semiconductor layer is arranged on an insulating layer. On a side of the bipolar transistors: an insulating region including the insulating layer is formed; openings are etched through the insulating region to delimit insulating walls; the openings are filled with first epitaxial portions; and the first epitaxial portions and a first region extending under the first epitaxial portions and under the insulating walls are doped. On the side of the bipolar transistors and on a side of the MOS transistors: gate structures are formed; second epitaxial portions are made; and the second epitaxial portions covering the first epitaxial portions are doped.

In the cases of performing programming by forming a two-terminal-type variable resistance element on a semiconductor device, it has been difficult to control the programming, and malfunctions have often occurred. This switching element includes at least a first variable resistance element, a second variable resistance element, a first rectifying element, and a second rectifying element, one end of the first variable resistance element and one end of the second variable resistance element are respectively connected to one end of the first rectifying element and one end of the second rectifying element, and each of the rectifying elements has two terminals.

The nonvolatile memory device includes a semiconductor substrate, a first and a second diffusion regions formed under a surface of the semiconductor substrate, a storage layer formed on the semiconductor substrate, a gate stacked on the storage layer, wherein the first diffusion region may at least one of active regions being separated by a part of the semiconductor substrate forming a channel region., wherein the second diffusion region may include an active region intersecting the gate insulating layer, wherein the storage layer may include an insulating layer or a variable resistor, and may service as a data storage layer to store data, and may be selected by a structure including the first and the second diffusion regions.

Memories having a plurality of resistive storage elements in a shared resistance variable material, a plurality of select devices coupled to the plurality of resistive storage elements in a one-to-one relationship and sense circuitry coupled to the plurality of select devices.

Semiconductor memory is provided wherein a memory cell includes a capacitorless transistor having a floating body configured to store data as charge therein when power is applied to the cell. The cell further includes a nonvolatile memory comprising a resistance change element configured to store data stored in the floating body under any one of a plurality of predetermined conditions. A method of operating semiconductor memory to function as volatile memory, while having the ability to retain stored data when power is discontinued to the semiconductor memory is described.

A process forms a phase change memory cell using a resistive element and a memory region of a phase change material. The resistive element has a first thin portion having a first sublithographic dimension in a first direction; and the memory region has a second thin portion having a second sublithographic dimension in a second direction transverse to the first dimension. The first thin portion and the second thin portion are in direct electrical contact and define a contact area of sublithographic extension. The second thin portion is delimited laterally by oxide spacer portions surrounded by a mold layer which defines a lithographic opening. The spacer portions are formed after forming the lithographic opening, by a spacer formation technique.