A light emitting display device includes a lower substrate, a thin film transistor on the lower substrate, a passivation layer disposed on the thin film transistor and including hydrogen, an overcoating layer disposed on the passivation layer and planarizing the passivation layer, a light emitting element disposed on the overcoating layer and including an anode, a light emitting layer on the anode, and a cathode on the light emitting layer, a bank disposed on the overcoating layer and defining a light emitting area, an adhesive layer on the light emitting element and the bank, and a hydrogen absorbing layer disposed on the adhesive layer and including a hydrogen absorbing filler, wherein a side end of the bank is disposed more inwardly than side ends of the adhesive layer and the hydrogen absorbing layer, wherein the side ends of the adhesive layer and the hydrogen absorbing layer are disposed more inwardly than a side end of the overcoating layer.

Disclosed is a photoelectric conversion element for converting light into electric energy, including a first electrode, a second electrode, and at least one organic layer existing therebetween, the organic layer containing a compound represented by the general formula (1): ##STR00001##
wherein R.sup.1 to R.sup.4 are alkyl groups, cycloalkyl groups, alkoxy groups, or arylether groups, which may be respectively the same or different; R.sup.5 and R.sup.6 are halogens, hydrogens, or alkyl groups, which may be respectively the same or different; R.sup.7 is an aryl group, a heteroaryl group, or an alkenyl group; M represents an m-valent metal and is at least one selected from boron, beryllium, magnesium, aluminum, chromium, iron, nickel, copper, zinc, and platinum; L is selected from halogen, hydrogen, an alkyl group, an aryl group, and a heteroaryl group; and m is in a range of 1 to 6 and, when m−1 is 2 or more, each L may be the same or different.

The present application relates to a composition for an encapsulant and an encapsulant formed using the same. The composition for an encapsulant according to one embodiment of the present application includes 1) a silicone resin; 2) one or more types of moisture absorbents; and 3) one or more types of photoinitiators.

Graphene photodetectors capable of operating in the sub-bandgap region relative to the bandgap of semiconductor nanoparticles, as well as methods of manufacturing the same, are provided. A photodetector can include a layer of graphene, a layer of semiconductor nanoparticles, a dielectric layer, a supporting medium, and a packaging layer. The semiconductor nanoparticles can be semiconductors with bandgaps larger than the energy of photons meant to be detected.

A gas barrier composite film is provided. The gas barrier composite film includes a substrate layer; a functional layer disposed on one or two sides of the substrate layer, wherein the functional layer includes a first copolymer of p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid, or a second copolymer of acrylic acid and vinylidene dichloride, and an inorganic stack layer disposed on the functional layer.

Provided are novel cross-linked polymers and their use in various materials, including packaging films and injection molded articles. These polymers, which comprise certain hydroxyl-containing crosslinking compounds, as well as optionally adjuvants, show improved creep resistance when compared to conventional ethylene acrylic or methacrylic acid copolymers and their ionomers.

A method of producing an organic optoelectronic component includes: forming a first electrode layer comprising a contact region, arranging an electrically conductive contact lug on the first electrode layer. A first section of the contact lug is secured in the contact region on the first electrode layer such that a second section projects beyond the contact region. The method further includes forming an organic functional layer structure laterally alongside the contact lug on the first electrode layer, forming a second electrode on the organic functional layer structure, forming an encapsulation layer such that it extends over the second electrode and over the first section, and severing the first electrode layer and the encapsulation layer in the region of the lug such that subsequently the first section is arranged between the contact region and the encapsulation layer and the second section projects between the encapsulation layer and the first electrode layer.

The present disclosure relates to a composition that includes a particle and a surface species, where the particle has a characteristic length between greater than zero nm and 100 nm inclusively, and the surface species is associated with a surface of the particle such that the particle maintains a crystalline form when the composition is at a temperature between −180° C. and 150° C.

A glazing comprising a luminous means with a substrate having a first main surface, to which a first electrode is applied, a second electrode, and an organic layer stack within an active region of the substrate between the first and the second electrode, wherein the organic layer stack comprises at least one organic layer which is suitable for generating light, wherein the luminous means is arranged between two glass plates of the glazing of a window. Also, storage furniture is disclosed comprising a storage element shaped in planar fashion and having at least one storage surface and at least one radiation-emitting component, and at least one holding apparatus for holding the storage element.

The present invention relates to an encapsulated semiconductor device (20) provided on a flexible substrate (1), a method of providing an at least partially encapsulated semiconductor device (20) on a flexible substrate (1) and a software product for providing an at least partially encapsulated semiconductor device (20) on a flexible substrate (1). In a preferred embodiment, an encapsulation method is presented in which the organic layer (3) of an inorganic/organic/inorganic multilayer barrier (5) on a plastic foil (1) as a substrate is removed at the edges of an OLED (13). The edges are subsequently sealed with a standard TFE process to encapsulate the OLED (13). This enables cuttable OLEDs (20) that are cut out of a larger plastic substrate (1) and gives a method to reduce side leakage in OLEDs (20) that have been manufactured in a roll-to-toll process.