Patent classifications
H10K39/18
SOLAR CELL, METHOD FOR MANUFACTURING THE SAME, AND SOLAR CELL MODULE COMPRISING THE SAME
A solar cell includes a first photoelectric conversion part, a second photoelectric conversion part, a side insulating layer, a first electrode, and a second electrode. The first photoelectric conversion part includes a photoelectric conversion layer composed of a perovskite compound, a first transport layer on one side of the photoelectric conversion layer, and a second transport layer on the other side of the photoelectric conversion layer. The second photoelectric conversion part is arranged below the second transport layer and has a different material or structure from the first photoelectric conversion part. The side insulating layer is formed as a side surface surrounding the first photoelectric conversion part. The first electrode is electrically connected to the first photoelectric conversion part on one surface of the first photoelectric conversion part serving as a light-receiving surface. The second electrode is electrically connected to a bottom of the second photoelectric conversion part.
SOLAR CELL, METHOD FOR MANUFACTURING THE SAME, AND SOLAR CELL MODULE COMPRISING THE SAME
A solar cell includes a first photoelectric conversion part, a second photoelectric conversion part, a side insulating layer, a first electrode, and a second electrode. The first photoelectric conversion part includes a photoelectric conversion layer composed of a perovskite compound, a first transport layer on one side of the photoelectric conversion layer, and a second transport layer on the other side of the photoelectric conversion layer. The second photoelectric conversion part is arranged below the second transport layer and has a different material or structure from the first photoelectric conversion part. The side insulating layer is formed as a side surface surrounding the first photoelectric conversion part. The first electrode is electrically connected to the first photoelectric conversion part on one surface of the first photoelectric conversion part serving as a light-receiving surface. The second electrode is electrically connected to a bottom of the second photoelectric conversion part.
SOLAR CELL AND MANUFACTURING METHOD THEREOF, AND PHOTOVOLTAIC MODULE
Provided are a solar cell and a manufacturing method thereof, and a photovoltaic module. The solar cell includes: a bottom cell, a perovskite top cell, an inter layer between the bottom cell and the perovskite top cell, and a back electrode located on a back surface of the bottom cell. The perovskite top cell includes a hole transport layer, a perovskite layer, an electron transport layer, and a conductive structure stacked sequentially. The conductive structure includes at least one stack each including a first conductive layer and a second conductive layer located between the first conductive layer and the electron transport layer. The first conductive layer includes a first transparent conductive film. The second conductive layer includes a metal conductive film in a metallization region and a second transparent conductive film in a non-metallization region.
SOLAR CELL AND MANUFACTURING METHOD THEREOF, AND PHOTOVOLTAIC MODULE
Provided are a solar cell and a manufacturing method thereof, and a photovoltaic module. The solar cell includes: a bottom cell, a perovskite top cell, an inter layer between the bottom cell and the perovskite top cell, and a back electrode located on a back surface of the bottom cell. The perovskite top cell includes a hole transport layer, a perovskite layer, an electron transport layer, and a conductive structure stacked sequentially. The conductive structure includes at least one stack each including a first conductive layer and a second conductive layer located between the first conductive layer and the electron transport layer. The first conductive layer includes a first transparent conductive film. The second conductive layer includes a metal conductive film in a metallization region and a second transparent conductive film in a non-metallization region.
PHOTOELECTRIC CONVERSION MODULE AND METHOD FOR MANUFACTURING THE SAME
A photoelectric conversion module is a photoelectric conversion module including a translucent substrate and one or more photoelectric conversion elements formed on the translucent substrate, wherein each of the photoelectric conversion elements is formed by stacking a transparent conductive film, a first charge transport layer, a power generation layer, and a second charge transport layer made of a porous film containing a carbon material, in this order from the side of the translucent substrate, and a portion of the second charge transport layer of at least one of the photoelectric conversion elements, the portion facing another transparent conductive film adjacent to the transparent conductive film of the photoelectric conversion element is electrically connected to the other transparent conductive film via a conductive layer that is thicker than a thickness of adding up the first charge transport layer and the power generation layer.
SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING SAME
A semiconductor module has a layer structure and at least one capacitive sensor. The layer structure is formed with an upper electrode layer, a lower electrode layer, and an active layer arranged between the electrode layers. The active layer is made of a semiconductor material. The capacitive sensor has a measuring electrode which is integrated into the layer structure. There is also described a device which has such a semiconductor module and a method for producing such a semiconductor module.
SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING SAME
A semiconductor module has a layer structure and at least one capacitive sensor. The layer structure is formed with an upper electrode layer, a lower electrode layer, and an active layer arranged between the electrode layers. The active layer is made of a semiconductor material. The capacitive sensor has a measuring electrode which is integrated into the layer structure. There is also described a device which has such a semiconductor module and a method for producing such a semiconductor module.
A PROCESS OF FORMING AN ELECTRODE INTERCONNECTION IN AN INTEGRATED MULTILAYER THIN-FILM ELECTRONIC DEVICE
A process of forming an electrode interconnection between at least two adjacent unit devices in an integrated multilayer thin-film electronic device comprising: providing an intermediary device that comprises: a first electrode layer on a thin film substrate comprising a first patterned coating that includes at least two spaced apart first electrode sections of adjacent unit devices; a first functional layer comprising a substantially continuous coating over the first electrode layer; and a second functional layer comprising a second patterned coating on the first functional layer comprising at least two spaced apart functional sections, each functional section positioned on the first functional layer to overlay a portion of one of the first electrode sections so to define a gap portion between adjacent functional sections that includes a portion of that first electrode section and the first functional layer; and applying a second electrode layer over the second functional layer as a third patterned coating that includes at least two spaced apart second electrode sections of adjacent unit devices, each second electrode section being positioned to overlay at least one functional section of the second functional layer and a portion of an adjoining gap portion that includes at least one portion of the first electrode section of an adjacent unit device, the third patterned coating being formed using a solution including a conductive species and at least a first solvent, wherein the first functional layer is soluble in the first solvent and the second functional layer has a low to zero solubility in the first solvent, such that application of the second electrode layer to the gap portion forms at least one electrically conductive path through the first functional layer between the first electrode and the second electrode of adjacent unit devices.
A PROCESS OF FORMING AN ELECTRODE INTERCONNECTION IN AN INTEGRATED MULTILAYER THIN-FILM ELECTRONIC DEVICE
A process of forming an electrode interconnection between at least two adjacent unit devices in an integrated multilayer thin-film electronic device comprising: providing an intermediary device that comprises: a first electrode layer on a thin film substrate comprising a first patterned coating that includes at least two spaced apart first electrode sections of adjacent unit devices; a first functional layer comprising a substantially continuous coating over the first electrode layer; and a second functional layer comprising a second patterned coating on the first functional layer comprising at least two spaced apart functional sections, each functional section positioned on the first functional layer to overlay a portion of one of the first electrode sections so to define a gap portion between adjacent functional sections that includes a portion of that first electrode section and the first functional layer; and applying a second electrode layer over the second functional layer as a third patterned coating that includes at least two spaced apart second electrode sections of adjacent unit devices, each second electrode section being positioned to overlay at least one functional section of the second functional layer and a portion of an adjoining gap portion that includes at least one portion of the first electrode section of an adjacent unit device, the third patterned coating being formed using a solution including a conductive species and at least a first solvent, wherein the first functional layer is soluble in the first solvent and the second functional layer has a low to zero solubility in the first solvent, such that application of the second electrode layer to the gap portion forms at least one electrically conductive path through the first functional layer between the first electrode and the second electrode of adjacent unit devices.
Module Layup for Perovskite-Silicon Tandem Solar Cells
Solar cell modules and methods of fabrication are described. In an embodiment, a pair of tandem solar cells are bonded together along a contact ledge of a first tandem solar cell using a solid electrically conductive bonding material.