Solar cell modules and methods of fabrication are described. In an embodiment, a pair of tandem solar cells are bonded together along a contact ledge of a first tandem solar cell using a solid electrically conductive bonding material.

A sensing and/or beacon device comprising: a flexible substrate; a flexible organic photovoltaic (OPV) module comprising a plurality of organic photovoltaic cells disposed on the flexible substrate; a top electrode and a bottom electrode incorporated into the flexible OPV module, wherein the top electrode and the bottom electrode are at least partially exposed; a first encapsulation covering the flexible substrate and the flexible OPV modules, a flexible hybrid electronics (FHE) device disposed on a side of the first encapsulation, wherein the FHE device comprises flexible electronics and die components, the flexible electronics comprising conductive traces, and wherein the FHE device completes an electrical contact with the fop electrode and the bottom electrode; a second encapsulation covering the flexible substrate, the flexible OPV module, the first encapsulation, and the FHE device; and an adhesive disposed on the second encapsulation.

A sensing and/or beacon device comprising: a flexible substrate; a flexible organic photovoltaic (OPV) module comprising a plurality of organic photovoltaic cells disposed on the flexible substrate; a top electrode and a bottom electrode incorporated into the flexible OPV module, wherein the top electrode and the bottom electrode are at least partially exposed; a first encapsulation covering the flexible substrate and the flexible OPV modules, a flexible hybrid electronics (FHE) device disposed on a side of the first encapsulation, wherein the FHE device comprises flexible electronics and die components, the flexible electronics comprising conductive traces, and wherein the FHE device completes an electrical contact with the fop electrode and the bottom electrode; a second encapsulation covering the flexible substrate, the flexible OPV module, the first encapsulation, and the FHE device; and an adhesive disposed on the second encapsulation.

A solar cell module includes a first substrate and a plurality of photoelectric conversion elements disposed on the first substrate. Each of the plurality of photoelectric conversion elements includes a first electrode, an electron transport layer, a perovskite layer, a hole transport layer, and a second electrode. In at least two of the photoelectric conversion elements adjacent to each other, the hole transport layers are extended continuous layers; and the first electrodes, the electron transport layers, and the perovskite layers in the at least two of the photoelectric conversion elements adjacent to each other are separated by the hole transport layer. The hole transport layer includes, as hole transport material, a polymer having a weight average molecular weight of 2,000 or more or a compound having a molecular weight of 2,000 or more.

A solar cell module includes a first substrate and a plurality of photoelectric conversion elements disposed on the first substrate. Each of the plurality of photoelectric conversion elements includes a first electrode, an electron transport layer, a perovskite layer, a hole transport layer, and a second electrode. In at least two of the photoelectric conversion elements adjacent to each other, the hole transport layers are extended continuous layers; and the first electrodes, the electron transport layers, and the perovskite layers in the at least two of the photoelectric conversion elements adjacent to each other are separated by the hole transport layer. The hole transport layer includes, as hole transport material, a polymer having a weight average molecular weight of 2,000 or more or a compound having a molecular weight of 2,000 or more.

A solar cell according to some embodiments of the present disclosure includes a first photoelectric conversion portion, a second photoelectric conversion portion, a side insulating layer, a first electrode, and a second electrode. The first photoelectric conversion portion includes a photoelectric conversion layer including a perovskite compound, a first transport layer on one side of the photoelectric conversion layer, and a second transport layer on the other side of the photoelectric conversion layer, the second photoelectric conversion portion is arranged below the second transport layer of the first photoelectric conversion portion and has a different material or structure from the first photoelectric conversion portion, the side insulating layer is formed on at least one side surface of the first photoelectric conversion portion, the first electrode is electrically connected to the first photoelectric conversion portion on one surface of the first photoelectric conversion portion serving as a light-receiving surface, and the second electrode is electrically connected to the second photoelectric conversion portion below the second photoelectric conversion portion. Therefore, a solar cell module that includes a photoelectric conversion portion including a perovskite compound, is further provided with a tandem structure provided with another photoelectric conversion portion having a different material or structure, and has excellent efficiency and reliability can be provided. In addition, a short-circuit current can be drastically reduced to ? of an existing level while an active region of the solar cell with a tandem structure is ensured to a maximum extent.

A process of forming an electrode interconnection between at least two adjacent unit devices in an integrated multilayer thin-film electronic device comprising: providing an intermediary device that comprises: a first electrode layer on a thin film substrate comprising a first patterned coating that includes at least two spaced apart first electrode sections of adjacent unit devices; a first functional layer comprising a substantially continuous coating over the first electrode layer; and a second functional layer comprising a second patterned coating on the first functional layer comprising at least two spaced apart functional sections, each functional section positioned on the first functional layer to overlay a portion of one of the first electrode sections so to define a gap portion between adjacent functional sections that includes a portion of that first electrode section and the first functional layer; and applying a second electrode layer over the second functional layer as a third patterned coating that includes at least two spaced apart second electrode sections of adjacent unit devices, each second electrode section being positioned to overlay at least one functional section of the second functional layer and a portion of an adjoining gap portion that includes at least one portion of the first electrode section of an adjacent unit device, the third patterned coating being formed using a solution including a conductive species and at least a first solvent, wherein the first functional layer is soluble in the first solvent and the second functional layer has a low to zero solubility in the first solvent, such that application of the second electrode layer to the gap portion forms at least one electrically conductive path through the first functional layer between the first electrode and the second electrode of adjacent unit devices.

A process of forming an electrode interconnection between at least two adjacent unit devices in an integrated multilayer thin-film electronic device comprising: providing an intermediary device that comprises: a first electrode layer on a thin film substrate comprising a first patterned coating that includes at least two spaced apart first electrode sections of adjacent unit devices; a first functional layer comprising a substantially continuous coating over the first electrode layer; and a second functional layer comprising a second patterned coating on the first functional layer comprising at least two spaced apart functional sections, each functional section positioned on the first functional layer to overlay a portion of one of the first electrode sections so to define a gap portion between adjacent functional sections that includes a portion of that first electrode section and the first functional layer; and applying a second electrode layer over the second functional layer as a third patterned coating that includes at least two spaced apart second electrode sections of adjacent unit devices, each second electrode section being positioned to overlay at least one functional section of the second functional layer and a portion of an adjoining gap portion that includes at least one portion of the first electrode section of an adjacent unit device, the third patterned coating being formed using a solution including a conductive species and at least a first solvent, wherein the first functional layer is soluble in the first solvent and the second functional layer has a low to zero solubility in the first solvent, such that application of the second electrode layer to the gap portion forms at least one electrically conductive path through the first functional layer between the first electrode and the second electrode of adjacent unit devices.

A semiconductor module has a layer structure and at least one capacitive sensor. The layer structure is formed with an upper electrode layer, a lower electrode layer, and an active layer arranged between the electrode layers. The active layer is made of a semiconductor material. The capacitive sensor has a measuring electrode which is integrated into the layer structure. There is also described a device which has such a semiconductor module and a method for producing such a semiconductor module.

A semiconductor module has a layer structure and at least one capacitive sensor. The layer structure is formed with an upper electrode layer, a lower electrode layer, and an active layer arranged between the electrode layers. The active layer is made of a semiconductor material. The capacitive sensor has a measuring electrode which is integrated into the layer structure. There is also described a device which has such a semiconductor module and a method for producing such a semiconductor module.