This invention discloses methods to form a micro thin film device. The methods use release layer on a substrate, encapsulation layers, electrode formation, and forming a bank layer. The methods further use VIA's to provide access to pads. The methods also entail transfer of multiple micro thin film devices by forming micro thin film devices on a cartridge, forming a housing, using anchors, and covering a side wall of the housing with a release layer.

There is provided a deposition mask in which a plurality of pixel openings are disposed in a surface, of a deposition mask, which is to face a substrate on which a deposition pattern is deposited. Protrusions including a material different from a material included in the deposition mask are formed in a region which is located from a pixel opening that is disposed at an outermost peripheral portion in the surface, from among the plurality of pixel openings, up to an edge of the deposition mask. In the deposition mask, a crosspiece which is located between two pixel openings adjacent to each other, from among the plurality of pixel openings include the material.

There is provided a deposition mask in which a plurality of pixel openings are disposed in a surface, of a deposition mask, which is to face a substrate on which a deposition pattern is deposited. Protrusions including a material different from a material included in the deposition mask are formed in a region which is located from a pixel opening that is disposed at an outermost peripheral portion in the surface, from among the plurality of pixel openings, up to an edge of the deposition mask. In the deposition mask, a crosspiece which is located between two pixel openings adjacent to each other, from among the plurality of pixel openings include the material.

A method for producing a bent organic light-emitting diode and a bent organic light-emitting diode are disclosed. In an embodiment the method includes providing an emitter unit having an organic layer sequence for generating radiation, providing at least one electrical connection piece, bending the at least one connection piece and the emitter unit into a curved shape and subsequently mechanically fixedly and permanently connecting the at least one connection piece to the emitter unit so that the curved shape is permanently maintained.

An optoelectric device can comprise a substrate and at least one junction configured to provide an active region within the substrate. Additionally, the device can comprise a metal-mesh semiconductor electrical contact structure attached to a surface of the substrate. The metal-mesh semiconductor electrical contact structure can further comprise a mesh line width, a mesh opening size, and a mesh thickness.

Provided is a planar light emitting device which is highly productive employing inexpensive FPCs capable of being easily electrically connected, and which has a light emitting region with reduced unevenness in luminance and hence is highly reliable. The planar light emitting device, which has a light emitting surface and a back surface, includes a planar light emitting tile including a planar light emitting element and a plurality of flexible printed circuits (FPCs) disposed on the back surface. The planar light emitting tile includes a non-pad region where none of an anode pad and a cathode pad are disposed. In an overlapped region where part of two circuit boards overlap each other, an electrical connection site where an equipotential region of the two circuit boards are directly electrically connected to each other is formed. The non-pad region forms a connecting-part disposed region that overlaps with the electrical connection site.

The organic light-emitting diode (1) has a first electrode (21) with a first electric conductivity and a second electrode (22) with a second lower electric conductivity. An organic layer stack (4) for generating light is located between the electrodes (21, 22). The light-emitting diode (1) further comprises a current distribution layer (3) with a third high electric conductivity. When seen in a plan view, multiple contact regions (33) are located outside of an outer contour line (40) of the layer stack (4). The second electrode (22) and the current distribution layer (3) contact each other in the contact regions (33). In a current blocking region (34), the current distribution layer (3) is located entirely within the contour line (40) such that the second electrode (22) is electrically disconnected from the current distribution layer (3). The luminous intensity of a lighting surface (11) of the light-emitting diode (1) is preferably set in a controlled manner via the distribution of the contact regions (33) and the current blocking regions (34).

A light-emitting unit (140) is formed over a first surface (102) of a substrate (100). A first terminal (112) and a second terminal (132) are formed on the first surface (102) of the substrate (100), and are electrically connected to the light-emitting unit (140). A sealing layer (200) is formed over the first surface (102) of the substrate (100), and seals the light-emitting unit (140). In addition, the sealing layer (200) does not cover the first terminal (112) and the second terminal (132). A cover layer (210) is formed over the sealing layer (200), and is formed of a material different from that of the cover layer (210). In at least a portion of a region located next to the first terminal (112) and a region located next to the second terminal (132), a portion of an end of the cover layer (210) protrudes from the sealing layer (200).

The present application provides a package structure, a method for manufacturing the same, a method for detecting a package defect in the package structure, an OLED device, and a display apparatus. The package structure includes: a first cover plate and a second cover plate; a sealant disposed between the first cover plate and the second cover plate and configured to form a sealed space with the first cover plate and the second cover plate; a moisture detection portion located in the sealed space; a first electrode having one terminal connected to a portion of the moisture detection portion, and the other terminal extending beyond the sealed space; and a second electrode having one terminal connected to another portion of the moisture detection portion, and the other terminal extending beyond the sealed space.

Disclosed herein is an OLED lighting apparatus which can achieve both improvement in reliability and reduction in manufacturing cost. In the OLED lighting apparatus, an encapsulation layer is disposed over the active area and the non-active area on a buffer layer, such that a pad disposed in the non-active area of the buffer layer can be stably secured by the encapsulation layer bonded thereto. Accordingly, upon tape automated bonding between an FPCB substrate with a COF tape attached thereto and a via electrode, the COF tape does not directly contact the pad but contacts the via electrode connected to the pad, particularly a connection terminal of the via electrode disposed on an upper surface of the encapsulation layer, thereby establishing electrical connection between the FPCB substrate and the via electrode. In this way, the connection terminal of the via electrode is electrically connected to the FPCB substrate via the COF tape, whereby a signal from the outside can be applied to the pad connected to the via electrode.