An image display device includes: a display panel which displays an image on a front surface of the display panel; a heat diffusing plate on a rear side of the display panel; and a frame along an edge surface of the display panel and an edge surface of the heat diffusing plate. The frame includes: a side wall which is disposed opposite to the edge surface of the display panel and the edge surface of the heat diffusing plate; and a support wall which projects from the side wall toward the heat diffusing plate. The heat diffusing plate includes a peripheral portion between the support wall and the display panel. The peripheral portion includes, on a rear side, a stepped portion which houses at least part of support wall.

A display module includes a display panel on which a display area and a non-display area surrounding the display area are defined and a functional layer disposed on the display panel. Here, the functional layer includes a color filter layer including a plurality of color filters and a plurality of first light shielding layers each disposed between the plurality of color filters, a light control layer including a plurality of light control parts overlapping the plurality of color filter layers, respectively, wherein at least one of the plurality of light control parts includes a quantum dot, and a heat conductive layer. The heat conductive layer includes at least one of metal, graphite, and silicon carbide.

Provided are a display panel including: a first component, a second component, and a bending component connecting the first component and the second component; wherein, the first component has a display surface, and the bending component has a via passing through the bending component in a direction perpendicular to the display surface. A display device is also provided.

A semiconductor device, includes: a substrate having an effective element area on which a functional element is disposed, and a peripheral area that surrounds the effective element area, the substrate having a terminal portion in at least a portion of the peripheral area a first wiring board connected to the substrate via the terminal portion of the substrate; and a drive circuit chip having a drive circuit, and connected to the first wiring board, wherein a thermal conductivity of the first wiring board is equal to or higher than a thermal conductivity of the substrate and of the drive circuit chip.

A flexible display device includes: a display panel capable of being bent with respect to a folding line; and a metal plate disposed on the display panel and capable of being bent with respect to the folding line. The metal plate has a plurality of holes disposed on each side of the folding line, the plurality of holes being formed in a zigzag pattern with respect to the folding line.

A display substrate includes a first region, a second region, and a bendable region between the first region and the second region, and a heat dissipation plate assembly for heat dissipation of the display substrate includes: a first release film; a heat dissipation plate, comprising a first portion and a second portion which are separated by a space and located on the first release film; a protective film, located on a side of the heat dissipation plate distal to the first release film, having a substantially same shape as the heat dissipation plate, and comprising a third portion located on the first portion and a fourth portion located on the second portion, the third portion being able to be bonded to the first region of the display substrate, and the fourth portion being able to be bonded to the second region of the display substrate; and a second release film, located on a side of the protective film distal to the heat dissipation plate and having a substantially same shape as the first release film.

Disclosed is a display apparatus for protecting a side surface of a substrate from the outside. The display apparatus includes a base substrate including a stepped portion, a buffer layer provided on the base substrate, a pixel array layer provided on the buffer layer, an encapsulation substrate provided on the pixel array layer, and a cover layer covering a side surface of the encapsulation substrate. The buffer layer covers the stepped portion of the base substrate.

A display device includes: a display panel including a front surface and a rear surface, the rear side being opposite to the front side; a front stacked structure on the front surface including a front bonding member disposed on the front surface; and a rear stacked structure on the rear surface including a rear bonding member disposed on the rear surface. A loss tangent of the front bonding member has a value greater than a loss tangent of the rear bonding member, the loss tangent being represented by an equation: (loss tangent)=(loss modulus)/(storage modulus), wherein the loss modulus refers to energy lost by viscosity of a material, and the storage modulus refers to energy stored without loss by elasticity of the material.

An organic light-emitting diode display device includes a first substrate that includes a display region with a plurality of pixels and a non-display region in a periphery of the display region, a first electrode disposed on the first substrate, a second electrode opposed to the first electrode, an organic light-emitting layer disposed between the first electrode and the second electrode, and at least one light sensing member disposed on a rear surface of the first substrate that overlaps the display region.

There is disclosed a display device comprising a display panel; an inner plate disposed on a rear surface of the display panel; a module cover disposed on a rear surface of the inner plate; a space formed between the inner plate and the module cover; and a back cover configured to form a loading portion by covering a first area provided in a rear surface of the module cover and being coupled to the first area, wherein the module cover comprises a lateral wall portion projected from a circumference of the first area toward the rear surface and configured to define a lateral surface of the loading portion; an inclined portion inclined from the lateral wall portion and extended toward the front surface; a first vent hole formed in a first lateral wall portion provided in an upper area of the lateral wall portion and configured to communicate the loading portion and the space; a second vent hole formed in a first inclined portion provided in an upper area of the first area and configured to communicate the space with the outside; and a third vent hole formed in an upper area of the module cover.