The disclosure discloses a manufacturing method of an electronic device, which comprises the following steps: providing a first substrate, providing a second substrate, bonding the first substrate and the second substrate through an adhesive layer, forming a conductive layer on the side surfaces of the first substrate, the second substrate and the adhesive layer, performing a first patterning process on a first region of the conductive layer, and performing a second patterning process on a second region of the conductive layer, the first region at least partially overlaps the adhesive layer, and the second region overlaps the side surfaces of the first substrate and the second substrate, and the first patterning process is different from the second patterning process.

An electronic device includes a housing, a buffer component is connected to the housing, a first electronic element is located on a side that is of the buffer component and that is away from the housing, and a second electronic element is located on a side that is of the housing and that is away from the buffer component. The buffer component has a recess, and at least a part of a front projection of the second electronic element in a thickness direction of the electronic device falls within a front projection of the recess.

An electronic device includes a housing, a buffer component is connected to the housing, a first electronic element is located on a side that is of the buffer component and that is away from the housing, and a second electronic element is located on a side that is of the housing and that is away from the buffer component. The buffer component has a recess, and at least a part of a front projection of the second electronic element in a thickness direction of the electronic device falls within a front projection of the recess.

A hybrid display may include different display portions with different resolutions. The high resolution display portion may be positioned in a main viewing area for the viewer whereas the low resolution display portion may be positioned in a peripheral viewing area. The high resolution display portion may have a silicon backplane. The low resolution display portion may have a different type of backplane such as a thin-film transistor backplane. The different display portions may optionally share a common organic light-emitting diode layer such that light is emitted from the same plane across both display portions. The high resolution display portion may emit light through a transparent window in the low resolution display portion. A high resolution display may also be formed by separately forming a frontplane and a backplane. Conductive attachment structures such as indium bumps may be used to mechanically and electrically connect the backplane to the frontplane.

A splicing display panel and a splicing display device are provided. The splicing display panel includes at least two spliced first display modules and at least one second display module. There is a seam between two adjacent first display modules. A portion of the first display module corresponding to a bezel area is provided with an accommodating slot. The accommodating slot of one of the first display modules is spliced with the accommodating slot of another one of the first display modules to form an accommodating cavity. The at least one second display module is arranged in the accommodating cavity, and the second display module covers the seam.

A splicing display panel and a splicing display device are provided. The splicing display panel includes at least two spliced first display modules and at least one second display module. There is a seam between two adjacent first display modules. A portion of the first display module corresponding to a bezel area is provided with an accommodating slot. The accommodating slot of one of the first display modules is spliced with the accommodating slot of another one of the first display modules to form an accommodating cavity. The at least one second display module is arranged in the accommodating cavity, and the second display module covers the seam.

A microcavity pixel array device and fabrication method having a shared multi-DBR system configured to cover a wide spectral bandwidth range. A wide emission waveband is achieved by depositing a first DBR on top of an OLED array and subsequently depositing a second DBR on top of the first DBR, with each DBR having a unique design. The multi-DBR covers a wider spectral bandwidth range than a single DBR, therefore achieving nearly total reflection for a range of OLEDs designed at different color wavelengths.

A microcavity pixel array device and fabrication method having a shared multi-DBR system configured to cover a wide spectral bandwidth range. A wide emission waveband is achieved by depositing a first DBR on top of an OLED array and subsequently depositing a second DBR on top of the first DBR, with each DBR having a unique design. The multi-DBR covers a wider spectral bandwidth range than a single DBR, therefore achieving nearly total reflection for a range of OLEDs designed at different color wavelengths.

The present invention relates to a full-color ?LED display device without electrical contact and mass transfer. The full-color ?LED display device without electrical contact and mass transfer comprises a lower driving electrode disposed on a surface of a lower transparent substrate, optical micro-structures disposed on an upper surface and a lower surface of an upper transparent substrate, an upper driving electrode, a barrier micro-structure connecting the upper transparent substrate and the lower transparent substrate, a ?LED crystal grain disposed in the barrier micro-structure, wavelength down-conversion light emitting layers, an insulating layer and a control module, wherein a unit R for displaying red light, a unit G for displaying green light and a unit B for displaying blue light are successively formed on the barrier micro-structure along a direction of the upper driving electrode. The upper driving electrode and the lower driving electrode are free from electrical contact with the ?LED crystal grain. The control module provides an alternating driving signal and electrical coupling to lighten the ?LED crystal grain so as to excite the wavelength down-conversion light emitting layers to realize full color display, so that there are no complicated manufacturing process for a three-primary-color ?LED chip in a full color ?LED device and complicated Bonding and mass transfer processes of a light emitting chip and a driving chip, the manufacturing period of ?LED display is shortened, and the manufacturing cost is lowered.

The present invention relates to a full-color ?LED display device without electrical contact and mass transfer. The full-color ?LED display device without electrical contact and mass transfer comprises a lower driving electrode disposed on a surface of a lower transparent substrate, optical micro-structures disposed on an upper surface and a lower surface of an upper transparent substrate, an upper driving electrode, a barrier micro-structure connecting the upper transparent substrate and the lower transparent substrate, a ?LED crystal grain disposed in the barrier micro-structure, wavelength down-conversion light emitting layers, an insulating layer and a control module, wherein a unit R for displaying red light, a unit G for displaying green light and a unit B for displaying blue light are successively formed on the barrier micro-structure along a direction of the upper driving electrode. The upper driving electrode and the lower driving electrode are free from electrical contact with the ?LED crystal grain. The control module provides an alternating driving signal and electrical coupling to lighten the ?LED crystal grain so as to excite the wavelength down-conversion light emitting layers to realize full color display, so that there are no complicated manufacturing process for a three-primary-color ?LED chip in a full color ?LED device and complicated Bonding and mass transfer processes of a light emitting chip and a driving chip, the manufacturing period of ?LED display is shortened, and the manufacturing cost is lowered.