A method of manufacturing an electronic device is provided. The method includes forming a stack structure by placing a to-be-peeled layer on a substrate, applying thermal shock to the stack structure, detaching the to-be-peeled layer from the substrate, and transferring the detached to-be-peeled layer to a target substrate.

Technologies for manufacturing a touch input device are disclosed. The method includes: forming, on a single carrier substrate, a flexible display for each of a plurality of display devices, cutting the flexible display into individual pieces, and separating the flexible display from the carrier substrate; a separate structure different from electrodes may be used to detect touch position forming step of forming, under a single substrate, a separate structure different from electrodes may be used to detect touch position for each of the plurality of display devices and cutting the substrate for the separate structure into individual pieces; and adhering each of the individual pieces of the separated flexible display to an individual piece of the substrate for the separate structure. The substrate for the separate structure may not be relatively easily bent as compared to the flexible display.

Disclosed is a thermal transfer substrate including a base substrate and a touch module on the base substrate. A side of the touch module which is in contact with the base substrate is adhesive, the adhesiveness decreasing under a first condition while increasing under a second condition. The present disclosure solves the problem that the manufacturing yield rate of touch display panels is relatively low, and improves the manufacturing yield rate of the touch display panels. The present disclosure is used for manufacturing a touch display panel.

A method of manufacturing a display device includes: providing a first substrate, a second substrate, and a plurality of connection lines, wherein the first substrate has a base substrate, wherein the second substrate faces the first substrate, and wherein the plurality of connection lines are disposed between the base substrate and the second substrate; grinding a side surface of the base substrate, a side surface of the second substrate, and side surfaces of the plurality of connection lines; and simultaneously transferring a conductive film and laser-curing the conductive film, wherein the conductive film is transferred to the ground side surface of the base substrate, the ground side surface of the second substrate, and the ground side surfaces of the plurality of connection lines.

Printing apparatus includes a donor supply assembly, which positions a transparent donor substrate having opposing first and second surfaces and a donor film formed on the second surface so that the donor film is in proximity to a target area on an acceptor substrate. An optical assembly directs one or more beams of laser radiation to pass through the first surface of the donor substrate and impinge on the donor film so as to induce ejection of material from the donor film onto the acceptor substrate. Means are provided to mitigate or compensate for the variation in reflection of the laser radiation across an area of the donor substrate, so as to equalize a flux of the laser radiation that is absorbed in the donor film across the area of the donor substrate.

A method for applying a patterned structure on a surface, comprising providing a donor substrate (1) comprising donor material (1a) between a light source (3) and a receiving surface (5), providing by means of the light source (3) a light pulse (3a) directed to the donor substrate (1), the light pulse (3a) being configured to cause the donor material (1a) to be transferred from the donor substrate (1) onto the receiving surface (5), wherein the donor substrate (1) comprises a pattern (2) of donor material (1a) on discrete portions (2a) of the donor substrate (1). The pattern (2) on the donor substrate (1) is transferred so as to form a pattern (4) of donor material (1a) on the receiving surface (5).

A method for manufacturing a flexible display includes forming a coating film. Forming the coating film includes depositing a high rigidity material layer on a substrate and forming a transfer layer on the high rigidity material layer. The coating film is bonded to a display surface of a display panel by the transfer layer. The substrate is removed after the coating film is bonded to the display surface of the display panel.

A method of patterning a film, a display device and a method for preparing the same. The method of patterning a film includes preparing a magnetic substrate by forming a magnetic material pattern within a flexible substrate; disposing a film to be processed and a first rigid substrate opposite to and spaced apart from each other, and placing the magnetic substrate against a surface of the film to be processed at a side thereof facing away from the first rigid substrate; pushing a portion of the film to be processed corresponding to the magnetic material pattern to project towards and to attach onto the first rigid substrate, by the magnetic material pattern via a magnetic effect of a magnetic force of a magnetic field which is applied onto the magnetic substrate; and forming a patterned film on the first rigid substrate.

Methods and devices for controlling pressures in microenvironments between a deposition apparatus and a substrate are provided. Each microenvironment is associated with an aperture of the deposition apparatus which can allow for control of the microenvironment.

A technology called RINSE (Removal of Incubated Nanotubes through Selective Exfoliation) is demonstrated. RINSE removes carbon nanotube (CNT) aggregates in CNFETs without compromising CNFET performance. In RINSE, CNTs are deposited on a substrate, coated with a thin adhesive layer, and sonicated. The adhesive layer is strong enough to keep the individual CNTs on the substrate, but not the larger CNT aggregates. When combined with a CNFET CMOS process as disclosed here, record CNFET CMOS yield and uniformity can be realized.