The invention provides a nano water ion group generator, including: at least a pair of P/N-type semiconductor dies including P-type semiconductor dies and N-type semiconductor dies, with one end being a cooling end and the other end being a heating end; a heat absorption member for obtaining a cold energy generated by the cooling end and transferring the cold energy to a blocking member; the blocking member for conducting the cold energy to obtain moisture in a condensed water or an air with high relative humidity; an ionizing member to absorb, collect or accumulate moisture in the condensed water or the air with high relative humidity, and be electrically coupled to the high voltage power supply for further ionizing the air and the moisture around the ionizing member under the action of avalanche effect to obtain at least one nanometer-sized substance among charged particles and oxygen-containing radicals.

Disclosed are a thermoelectric device and a manufacturing mold and manufacturing method thereof. The thermoelectric device includes at least one set of thermoelectric arm unit, wherein a first thermoelectric arm is provided with a first upper surface and a first lower surface opposite to the first upper surface; a second thermoelectric arm is provided with a second upper surface and a second lower surface opposite to the second upper surface; the second thermoelectric arm is seamlessly bonded with the first thermoelectric arm via an insulating adhesive layer; the first upper surface is flush with the second upper surface, and a first spacing groove is formed between adjacent positions of the first upper surface and the second upper surface; the first lower surface is flush with the second lower surface, and a second spacing groove is formed between adjacent positions of the first lower surface and the second lower surface

A cooling system includes an evaporator associated with a heat source. A condenser is located at a higher elevation than the evaporator. A heat pipe structure fluidly connects the evaporator with the condenser. A fan forces air through the condenser. A working fluid is in the evaporator so as to be heated to a vapor state, with the heat pipe structure transferring the vapor to the condenser and passively returning condensed working fluid back to the evaporator for cooling of the heat source. A plurality of thermoelectric generators is associated with the condenser and converts heat, obtained from the working fluid in the vapor state, to electrical energy to power the fan absent an external power source. The thermoelectric generators provide the electrical energy to the fan so that a rotational speed of the fan is automatically self-regulating to either increase or decrease based on a varying heat load.

An electrical converter and heater module with heat insulators having different cross-sectional areas includes a thermoelectric conversion module that corrects the difference in thermal resistance between a P-type thermoelectric conversion member and an N-type thermoelectric conversion member. In this thermoelectric conversion module, since insulators included in the P-type thermoelectric conversion member and the N-type thermoelectric conversion member have a different thermal resistance, it is possible to correct the difference in thermal resistance between the P-type thermoelectric conversion element and the N-type thermoelectric conversion element.

A catheter has a cooling distal section for freezing tissue to sub-zero temperatures with one or more miniature reverse thermoelectric or Peltier elements, also referred to herein as micro-Peltier cooling (MPC) units or electrodes. The MPC units may be on outer surface of an inflatable or balloon member or a tip electrode shell wall that has a fluid-containing interior cavity acting as a heat sink. Each MPC unit has a hot junction and a cold junction whose temperatures are regulated by the heat sink, and a voltage/current applied to the MPC units. A temperature differential of about 70 degrees Celsius may be achieved between the hot and cold junctions for extreme cooling, especially where the MPC units include semiconductor materials with high Peltier co-efficients. An outer coating of thermally-conductive but electrically-insulative material seals the MPC units to prevent unintended current paths through the MPC units.

A thermoelectric conversion element includes a substrate, a thermoelectric conversion layer disposed on a first main surface of the substrate, an insulating layer covering the thermoelectric conversion layer, a first electrode disposed on the insulating layer and connecting to a first main surface of the thermoelectric conversion layer via a first contact hole of insulating layer, and a second electrode disposed on the insulating layer and connecting to the first main surface of the thermoelectric conversion layer via a second contact hole of the insulating layer. At least a portion of the first electrode is formed from a material that has a work function that is different from a work function of a material forming the second electrode.

A thermoelectric conversion element includes a substrate, a thermoelectric conversion layer disposed on a first main surface of the substrate, an insulating layer covering the thermoelectric conversion layer, a first electrode disposed on the insulating layer and connecting to a first main surface of the thermoelectric conversion layer via a first contact hole of insulating layer, and a second electrode disposed on the insulating layer and connecting to the first main surface of the thermoelectric conversion layer via a second contact hole of the insulating layer. At least a portion of the first electrode is formed from a material that has a work function that is different from a work function of a material forming the second electrode.

A sensing system including in-ground sensors not requiring battery power. A thermoelectric generator sensor rod includes an upper thermal contact and a lower thermal contact at or near its two ends. When the thermoelectric generator sensor rod is buried in the ground with one end buried more deeply than the other, a temperature gradient in the soil produces a temperature difference between the upper thermal contact and the lower thermal contact. The upper thermal contact and the lower thermal contact are thermally connected to a thermoelectric generator, e.g., by heat pipes or thermally conductive rods. Electrical power generated by the thermoelectric generator powers sensors for monitoring conditions in the ground, and circuitry for transmitting sensor data to a central data processing system.

A method for packaging a thermoelectric module may include thermoelectric module accommodation, of accommodating at least one thermoelectric module in a housing having a base and a sidewall, electric wire sealing, of sealing an electric wire of the thermoelectric module with a sealing tube, bonding member interposing, of placing a cover having a top portion and a sidewall on top of the housing and interposing a bonding member between the sidewall of the housing and the sidewall of the cover, and bonding, of bonding the sidewall of the housing and the sidewall of the cover that are hermetically sealed by the bonding member, in which the bonding member may be formed of a resin material.

Provided with a semiconductor apparatus which is able to be miniaturized and is provided with a Peltier element. The semiconductor apparatus is provided with a semiconductor substrate and the Peltier element which is disposed facing the semiconductor substrate. The Peltier element has a first substrate and a thermoelectric semiconductor which is disposed between the first substrate and the semiconductor substrate. The semiconductor substrate has a first electrode provided on a surface side facing the first substrate. The first substrate has a second electrode provided on a surface side facing the semiconductor substrate. The first electrodes and the second electrodes are each connected to the thermoelectric semiconductor.