Bonding strength with which a substrate and an adhesive layer are bonded together to seal a piezoelectric vibrator on the substrate is enhanced. A piezoelectric vibration component includes a lid including a recess and a flange protruding outward from an opening edge of the recess. Moreover, the component includes a substrate having a first area opposing the recess and a second area opposing the flange. A piezoelectric vibrator is mounted on the first area, and an adhesive layer bonds the second area and the flange together to seal the piezoelectric vibrator in a space between the recess and the first area. The second area has surface roughness greater than surface roughness of the first area.

To provide a tactile vibration applying device that efficiently outputs vibrations using an electrostatic or piezoelectric actuator. The tactile vibration applying device includes the electrostatic or piezoelectric actuator formed in a flat shape, and expanding and contracting in a thickness direction, a first elastic body having an elastic modulus smaller than an elastic modulus of the actuator in the thickness direction and disposed to contact a surface of the actuator on a side of the first electrode, and a first cover covering a surface of the first elastic body opposite to a surface of the first elastic body contacting the actuator, pressing the actuator and the first elastic body in the thickness direction of the actuator, and holding the first elastic body in a state that the first elastic body is compressed more than the actuator.

An array of piezoelectric micromachined ultrasonic transducers (PMUTs) includes a first piezoelectric layer and a second piezoelectric layer, a dielectric layer positioned between the first piezoelectric layer and the second piezoelectric layer, and a plurality of conductive layers positioned on opposing surfaces of the first piezoelectric layer and opposing surfaces of the second piezoelectric layer. A plurality of isolation trenches extend through the dielectric layer and at least a portion of conductive layers of the plurality of conductive layers, where the plurality of isolation trenches are positioned between neighboring PMUTs of the array of PMUTs such that the neighboring PMUTs are electrically isolated, and wherein the plurality of isolation trenches relieve stress in the dielectric layer.

A method for manufacturing an electronic component is provided where resin adhesive rarely spreads before curing. The method includes providing a first sealing member and forming a frame-shaped glass layer on a principal surface of the first sealing member. Moreover, the first sealing member is cut into multiple first sealing members and second sealing members are bonded with resin adhesive to inner frame regions on the principal surface of the first sealing member defined by the glass layer.

An electronic component has a main body. The main body includes a porous material having surface pores at a surface of the main body. A passivation liquid is arranged in the surface pores. A method of forming an electronic component is also disclosed as is a method of passivating a body.

A method for the quality inspection of an ultrasonic transducer and an ultrasonic sensor comprising an ultrasonic transducer and carrying out the quality inspection method are described. The ultrasonic transducer comprises a housing having an electrically conductive layer extending at least over an inner surface of a housing wall of the housing, and a piezoelectric transducer arranged in the housing, the end face of which equipped with an electrode is connected to the electrically conductive layer by means of a dielectric coupling layer. According to the method, at least one quality inspection of the ultrasonic transducer is carried out, in which a capacitance of a capacitor comprising the electrode, the electrically conductive layer serving as the counter electrode, and the dielectric coupling layer as a dielectric is measured and a quality defect of the ultrasonic transducer is determined if the measured capacitance is outside a specified capacitance range.

A backing includes a plurality of backing plates that are laminated. Each backing plate includes a lead row and a backing material. Each lead includes a lead wire and an insulating coating. The insulating coating is integrated with the backing material, and an adhesive layer between them does not exist. Short-circuit between the leads may be prevented or reduced by the insulating coating. The backing plate is manufactured by a screen printing method.

An ultrasonic element includes an element substrate including a first surface, a second surface having a front-back relation with the first surface, an opening section piercing through the element substrate from the first surface to the second surface, and a partition wall section surrounding the opening section, a supporting film provided on the first surface of the element substrate to cover the opening section and including a third surface facing the opening section and a fourth surface having a front-back relation with the third surface, a piezoelectric element provided on the fourth surface of the supporting film and disposed in a region overlapping the opening section of the supporting film in a plan view from a film thickness direction extending from the third surface to the fourth surface, a sealing plate provided to be opposed to the fourth surface of the supporting film and joined to the supporting film by an adhesive member via a beam section projecting toward the supporting film, and a wall section provided on the fourth surface of the supporting film and provided to project toward the sealing plate between the beam section and the piezoelectric element.

Chemical sensors include a functionalized electrode configured to change surface potential in the presence of an analyte. A piezoelectric element is connected to the functionalized electrode. A piezoresistive element is in contact with the piezoelectric element.

Provided is a method of manufacturing an electrostrictive element by which an electrostrictive element including an expandable and contradictable film electrode having a thin and uniform thickness can be easily formed. In a method of manufacturing an electrostrictive element 1, screen printing is performed while a first jig 12 contacts with a face of a dielectric film 2 opposite to a face where screen printing is performed such that the first jig 12 surrounds an area where the screen printing is performed. Thus, a film electrode 3 is formed.