A SAW device includes a SAW element, a conductor connected to the SAW element, an LT substrate including the SAW element, and a case for housing the LT substrate including the SAW element. The case includes a cover part, a lateral part, and a bottom part. The bottom part is including a sapphire substrate, the LT substrate is positioned on a first surface of the sapphire substrate, the first surface serving as an inner surface of the case, and a second surface opposite to the first surface serves as an outer surface of the case. The conductor includes a via conductor provided in a through-hole continuously penetrating through the sapphire substrate and the LT substrate.

A piezoelectric/electrostrictive (“PE”) actuator includes a PE element including a laminated object having a PE layer and a pair of electrodes arranged respectively on both sides of the PE layer, and having an operating part corresponding to the portion in which the PE layer is sandwiched between the pair of electrodes and a non-operating part corresponding to the portion in which the PE layer is not sandwiched between the pair of electrodes, and a moisture-proof film covering at least the vicinity of a boundary between the operating part and the non-operating part, consisting of a liquid with a saturated moisture content at 25 degree Celsius of 300 ppm or less and a withstand voltage at the saturated moisture content of not less than 6 kV/mm. The liquid contains hydrocarbon system organic compound having a main backbone of carbon-carbon bond and consisting only of carbon and hydrogen.

Provided is a piezoelectric element capable of reliably performing an electrical connection to an electrode layer. A piezoelectric element includes a piezoelectric layer, electrode layers formed on both sides of the piezoelectric layer, and a protective layer laminated on a surface of the electrode layer opposite to a surface on the polymer composite piezoelectric body side. The protective layer has a hole that penetrates from the surface to the electrode layer. The piezoelectric element further includes a filling member consisting of a conductive material, which is formed from the inside of the hole to a part of a surface of the protective layer and is electrically connected to the electrode layer, a conductive member which covers at least a part of the filling member and is electrically connected to the filling member, and a fixing member for fixing the conductive member.

An electronic device includes: an electronic component including an inertial element, a base including a substrate to which the inertial element is fixed and a frame portion provided to surround the inertial element in a plan view, a first lid bonded to the frame portion so as to accommodate the inertial element between the first lid and the base, a second lid provided to face the first lid, and a bonding member disposed between the first lid and the second lid; and a molded portion covering the electronic component.

The present disclosure relates to an electromechanical actuator, having a stack arrangement made of ceramic basis material having electromechanical properties and electrodes as well as a ceramic insulation for operation/use of the actuator in a humid environment. To ensure a long service life of the actuator with increased electromechanical expansion, an exemplary structure of the ceramic insulation has a smaller average grain size than the structure of the ceramic basis material. A method for the production of an actuator having ceramic insulation and a method for controlling such an actuator are also disclosed.

A flexible piezoelectric thin film, and method of manufacture, has a polyvinyl alcohol (PVA)-glycine-PVA sandwich heterostructure. The thin film is manufactured by evaporating the solvent from a glycine-PVA mixture solution. The film automatically assembles into the PVA-glycine-PVA sandwich heterostructure as it is salted out. Strong hydrogen bonding between the oxygen atoms in glycine and hydroxyl groups on PVA chains are responsible for the nucleation and growth of the piezoelectric γ-glycine and alignment of the domain orientation.

A method for applying a waterproof coating to a transducer component includes the steps of cleaning and promoting bonding on the transducer component by immersing the component in a mixture of isopropyl alcohol, deionized water, and siline. The component is then air dried and rinsed in pure isopropyl alcohol. After drying, the component is vacuum baked and subjected to a vacuum for twelve hours. A parylene coating is provided to the component surface. The parylene coating is abraded, and the surface is rinsed with pure isopropyl alcohol. After drying, polyurethane is provided on the abraded parylene surface. The polyurethane is cured to form a waterproof coating on the transducer component. In further embodiments, a second parylene coating can be provided outside the polyurethane.

An integrated structure of a crystal resonator and a control circuit (110) and an integrated method therefor. Integration of the crystal resonator with the control circuit (110) is accomplished by forming, in a device wafer (100) containing the control circuit, a lower cavity (120) with an opening exposed at a back side of the device wafer (100), forming a piezoelectric vibrator (500) on the back side of the device wafer (100) and electrically connecting the piezoelectric vibrator (500) to the control circuit (110) in the device wafer (100) from the back side of the device wafer (100). The crystal resonator is more compact in size, less power-consuming and easier to integrate with other semiconductor components with a higher degree of integration.

A package that includes a first filter comprising a first polymer, a substrate cap, a second filter comprising a second polymer frame, at least one interconnect, an encapsulation layer and a plurality of through encapsulation vias. The substrate cap is coupled to the first polymer frame such that a first void is formed between the substrate cap and the first filter. The second polymer frame is coupled to the substrate cap such that a second void is formed between the substrate cap and the second filter. The at least one interconnect is coupled to the first filter and the second filter. The encapsulation layer encapsulates the first filter, the substrate cap, the second filter, and the at least one interconnect. The plurality of through encapsulation vias coupled to the first filter.

A semiconductor device includes a base, a detector on the base and including a first surface on which a detection portion is provided, and a resin package on the base and including an exposure hole to externally expose the detection portion of the detector. At least a portion of an outer peripheral edge of the first surface of the detector is exposed in the exposure hole. The resin package includes a depressed portion along the portion of the outer peripheral edge that is exposed in the exposure hole.