A multi-layer piezoelectric microactuator assembly has at least one poled and active piezoelectric layer and one poled but inactive piezoelectric layer. The poled but inactive layer acts as a constraining layer in resisting expansion or contract of the first piezoelectric layer thereby reducing or eliminating bending of the assembly as installed in an environment, thereby increasing the effective stroke length of the assembly. Poling only a single layer would induce stresses into the device; hence, polling both piezoelectric layers even though only one layer will be active in use reduces stresses in the device and therefore increases reliability.

A sensor device includes a microelectromechanical system (MEMS) force sensor, and a capacitive acceleration sensor. In the method of manufacturing the sensor device, a sensor portion of the MEMS force sensor is prepared over a front surface of a first substrate. The sensor portion includes a piezo-resistive element and a front electrode. A bottom electrode and a first electrode are formed on a back surface of the first substrate. A second substrate having an electrode pad and a second electrode to the bottom of the first substrate are attached such that the bottom electrode is connected to the electrode pad and the first electrode faces the second electrode with a space therebetween.

Piezoelectrically actuated devices constructed from thin semiconductor membranes bonded directly to piezoelectric substrates are provided. Methods for fabricating these devices are also provided. The bonding of the semiconductor to the piezoelectric material does not require the use of any intermediate layers, such as bonding agents.

An ultrasonic transducer that includes a delay line, an active piezoelectric element, and interposing metal conductive layer between the delay line and active piezoelectric element. The delay line and active piezoelectric element are joined so that ultrasonic waves may be coupled from the active piezoelectric element into the delay line or from the delay line into the active piezoelectric element. A via is formed, using a milling operation, in the active piezoelectric element to expose the edge of the interposing metal conductive layer between the delay line and active piezoelectric element. A conductive layer makes electrical contact between the interposing metal conductive layer and the surface of the active piezoelectric element to allow an electrical connection to be made from the surface of the active piezoelectric element to the interposing metal conductive layer.

A method for designing a piezoelectric element unit, a ultrasonic element having the piezoelectric element manufactured using the method, a method for manufacturing the ultrasonic element, and an acoustic pressure focusing device having the ultrasonic element are provided. In the method for designing a piezoelectric element unit, a target position and a target distance are selected. A basic information of a piezoelectric element base material is inputted. Each of a plurality of grids is grouped into a unit grid group. A size of an output acoustic pressure outputted at each unit grid group is calculated. The unit grid group outputting the output acoustic pressure included in a range of a reference acoustic pressure among a plurality of the unit groups is decided. The plurality of ring patterns being concentric is determined based on a pattern shape information.

An oscillator manufacturing method is a method for manufacturing a plurality of types of oscillators including a first oscillator and a second oscillator. The method includes preparing a first resonator device and a second resonator device each including a resonator, an oscillation circuit electrically coupled to the resonator, and a storage circuit that stores characteristic setting information used to set the characteristics of the oscillation circuit, housing the first resonator device in a first container to manufacture the first oscillator, housing the second resonator device in a second container different in type from the first container to manufacture the second oscillator, and setting characteristic setting information in the storage circuit, and the first resonator device and the second resonator device are resonator devices of the same type.

An oscillator manufacturing method is a method for manufacturing a plurality of types of oscillators including a first oscillator and a second oscillator. The method includes preparing a first resonator device and a second resonator device each including a resonator, an oscillation circuit electrically coupled to the resonator, and a storage circuit that stores characteristic setting information used to set the characteristics of the oscillation circuit, housing the first resonator device in a first container to manufacture the first oscillator, housing the second resonator device in a second container different in type from the first container to manufacture the second oscillator, and setting characteristic setting information in the storage circuit, and the first resonator device and the second resonator device are resonator devices of the same type.

A vibration power generation device includes a weight, beams, piezoelectric members, and a fixation member. The beams extend from the weight in directions parallel to a single plane. The piezoelectric members are disposed at respective beams. The fixation member includes at least a frame-shaped portion. The beams are fixed to the frame-shaped portion in such a manner that the weight and the piezoelectric members are positioned inside the frame-shaped portion.

A vibration power generation device includes a weight, beams, piezoelectric members, and a fixation member. The beams extend from the weight in directions parallel to a single plane. The piezoelectric members are disposed at respective beams. The fixation member includes at least a frame-shaped portion. The beams are fixed to the frame-shaped portion in such a manner that the weight and the piezoelectric members are positioned inside the frame-shaped portion.

A method of manufacturing a power generation element includes a first step of disposing a support unit that supports a vibration unit in one end portion of the vibration unit in one direction, and disposing a weight unit in the other end portion of the vibration unit in the one direction in a substrate including the vibration unit capable of vibrating, a second step of disposing a piezoelectric unit that generates power due to vibration in a portion of the vibration unit on an opposite side from the support unit side in a thickness direction of the substrate after the support unit and the weight unit are disposed in the vibration unit, and a third step of extracting a power generation element from the substrate by cutting an outer edge of the vibration unit in the thickness direction of the substrate after the piezoelectric unit is disposed in the vibration unit.