A method for manufacturing a plurality of fingerprint identification modules simultaneously is provided. A first thin film and a second thin film are formed on a first transfer base and a second transfer base respectively. The first thin film and the second thin film are cut respectively to form a plurality of first thin film units and a plurality of second thin film units. The first transfer base and the second transfer base are adhered on opposite surfaces of a substrate. The first thin film units and the second thin film units are cut respectively to form a plurality of the first piezoelectric layers and a plurality of the second piezoelectric layers. A plurality of first slits and a plurality of second slits are formed on opposite surfaces of the substrate for breaking the mother base into the fingerprint identification modules.

The present disclosure relates to the bulk manufacture of transducer arrays, including arrays having at least one 3D printed (or otherwise additive manufactured) acoustic matching layers. In certain implementations, the manufactured transducers include a composite-piezoelectric transducer on a de-matching layer. In one implementation, by producing multiple arrays at once on a common carrier, and by using direct-deposit additive processes for the matching layers, the described processes greatly reduce the number of parts and the number of manual operations.

A semiconductor module and a method for manufacturing the same are provided. The semiconductor module includes a substrate comprising a front side and at least one semiconductor device formed on the front side, a shielding structure formed on the at least one semiconductor device, and a piezoelectric layer formed on the shielding structure.

A shear vibration-based piezoelectric composite material and a preparation method thereof are disclosed. The piezoelectric composite material includes a piezoelectric material and the passive material. The piezoelectric material includes a piezoelectric material polarized along the x-axis positive and a piezoelectric material negatively polarized along the x-axis. The piezoelectric materials in the two polarization directions are alternately arranged along the x-axis direction. The passive material includes a filling layer, a transition layer, and a planar layer. The filling layer is disposed between every two adjacent piezoelectric materials. The planar layer is located outer two surfaces perpendicular to the z-axis of the piezoelectric material. The planar layer on one side is fixedly connected to the filling layer in the odd-numbered position via the transition layer. The planar layer on the other side is fixedly connected to the filling layer in the even-numbered position via the transition layer. The piezoelectric composite material can be used to prepare an underwater acoustic transducer, a hydrophone, piezoelectric energy harvesters, and the like. The invention innovatively converts shear vibrations into the thickness vibrations of the upper and lower surfaces of the composite material, thereby improving the performance of the composite material.

A multilayer piezoelectric element includes a ceramic base body, a pair of external electrodes, multiple internal electrodes, and surface electrodes. The pair of external electrodes cover a pair of end faces and extend from the pair of end faces along a pair of principal faces and a pair of side faces. The multiple internal electrodes are stacked inside the ceramic base body along the thickness direction, and are connected alternately to one or the other of the pair of external electrodes along the thickness direction. The surface electrodes extend from the pair of external electrodes along the pair of principal faces, and are each divided in the longitudinal direction at a position near, of the pair of external electrodes, the external electrode to which the internal electrode adjacent to the principal face is connected.

A piezoelectric element includes a first electrode, a piezoelectric layer formed of a first piezoelectric film which is formed on the first electrode and which includes potassium, sodium, and niobium and a plurality of second piezoelectric films which are formed on the first piezoelectric film and which include potassium, sodium, and niobium, and a second electrode formed on the piezoelectric layer, in which the piezoelectric layer is a stack of a plurality of piezoelectric films, the first piezoelectric film has a thickness of 30 nm to 70 nm, a concentration of sodium in each of the piezoelectric films is along a gradient in the film thickness direction with the first electrode side being high and the second electrode side being low.

An actuator may be integrated into an optical element such as a liquid lens and configured to create spherical curvature as well as a variable cylinder radius and axis in a surface of the optical element. An example actuator may include a stack of electromechanical layers, and electrodes configured to apply an electric field independently across each of the electromechanical layers. Within the stack, an orientation of neighboring electromechanical layers may differ, e.g., stepwise, by at least approximately 10°.

A vibrating body includes a substrate, a piezoelectric element comprising a piezoelectric layer and electrode layers and joined to the substrate, and a ceramic layer between the substrate and the piezoelectric element. The ceramic layer comprises a first region and a second region which is adjacent to the first region in a direction perpendicular to a thickness direction of the ceramic layer. The first region has a square shape, each side of the first region having a length equal to a thickness of the ceramic layer, the second region has a square shape, each side of the second region having the length equal to the thickness of the ceramic layer, and a difference between a porosity of the first region and a porosity of the second region is not greater than 15%.

The invention relates to a BAW resonator with reduced heat build-up. The heat build-up is reduced by a thermal bridge, which dissipates heat from the electro-acoustically active region to a support substrate, without impairing the acoustics of the resonator.

Provided is a method of manufacturing an ultrasound probe. The method includes: preparing a backing layer having first and second surfaces with different heights due to forming a groove in the backing layer, wherein first and second electrodes are exposed on the first and second surfaces, respectively; forming a third electrode that is in contact with the first electrode; forming a base piezoelectric unit on the third electrode, the base piezoelectric unit including a piezoelectric layer; forming a piezoelectric unit by removing an upper region of the base piezoelectric unit; and forming a fourth electrode on the backing layer and the piezoelectric unit.