A piezoelectric micromachined ultrasound transducer (PMUT) array may comprise PMUT devices with respective piezoelectric layers and electrode layers. Parasitic capacitance can be reduced when an electrode layer is not shared across PMUT devices but may expose the devices to electromagnetic interference (EMI). A conductive layer located within the structural layer or on a shared plane with the electrode layers may reduce EMI affecting the PMUT array operation.

A piezoelectric element includes a stack including a plurality of internal electrodes and a plurality of piezoelectric layers stacked on one another, and a surface electrode located on a side surface of the stack and connected to the plurality of internal electrodes. A second electrode illustrated in FIG. 3B includes a first conductor including a strip extending in a longitudinal direction and an extension having one end continuous with the strip and another end exposed on the side surface of the stack and connected to the surface electrode. The piezoelectric element includes a second conductor located between the extension and an opposite portion of the side surface of the stack opposite to a portion of the side surface on which the other end of the extension is exposed.

A piezoelectric drive element disposed on a placement surface of a metal substrate includes a piezoelectric drive body having a first main surface opposite the placement surface, a second main surface on a placement surface side, and a side surface, and a first electrode disposed on the first main surface. The piezoelectric drive element is disposed on the placement surface such that a part of the placement surface is located outside the side surface. A second bonding member having conductivity includes a first portion disposed between the placement surface and the piezoelectric drive element, and a second portion being continuous from the first portion and disposed in a corner formed by the part of the placement surface and the side surface. The second portion does not reach the first electrode.

A metal substrate supported by a wiring substrate includes a movable portion, a first extending portion, a first coupling portion that couples the first extending portion and the movable portion, and a first connection portion connected to the first extending portion. The first connection portion includes a first fixing region fixed to the wiring substrate, and a first connection region connected to the first extending portion and to the first fixing region. The first connection region includes a first bent portion. The first bent portion has a first outer edge on a movable portion side, and a second outer edge opposite the movable portion, and each of the first outer edge and the second outer edge is bent toward the movable portion side when viewed in a Z-axis direction.

A piezoelectric actuator assembly is described. The assembly including a first layer including a top and a bottom surfaces. The assembly including a second layer having a top and a bottom surfaces, the bottom surface of the second layer is disposed over the top surface of the first layer. The assembly including a third layer having a top and a bottom surfaces, the bottom surface of the third layer is disposed over the top surface of the second layer. The assembly includes a first electrode, a second electrode, a third electrode, and a fourth electrode. The third electrode is configured to be shorter than the second electrode such that the active PZT length of the second layer and the third layer is shorter than the active PZT length of the first layer.

Provided is a vibration panel including an inner member, a first outer member, a second outer member, a piezoelectric actuator, an actuator bonding layer, and a filler. The inner member includes first and second main surfaces. The first outer member includes third and fourth main surfaces, the third main surface including a first region and a second region. The second outer member includes fifth and sixth main surfaces, the fifth main surface including a third region and a fourth region. The piezoelectric actuator causes vibration. The actuator bonding layer is disposed between the piezoelectric actuator and the second region and bonds the piezoelectric actuator to the second region. The filler fills a space between the second region and the fourth region and covers the piezoelectric actuator.

A piezoelectric device including a substrate, a metal-insulator-metal element, a hydrogen blocking layer, a passivation layer, a first contact terminal and a second contact terminal is provided. The metal-insulator-metal element is disposed on the substrate. The hydrogen blocking layer is disposed on the metal-insulator-metal element. The passivation layer covers the hydrogen blocking layer and the metal-insulator-metal element. The first contact terminal is electrically connected to the metal-insulator-metal element. The second contact terminal is electrically connected to the metal-insulator-metal element.

The proposed device comprises a plurality of electroactive material actuator units arranged as a set. Control data for driving individual units is transferred over three shared power lines. The electroactive material actuator of each unit is driven depending on control data received from the power lines via a demodulator, a controller, and a driver.

Lattice structure with piezoelectric behavior characterized in that the lattice structure (1) comprises a periodic succession of unitary cells (10), wherein each unitary cell (10) is made of a dielectric material, is bending or torsion dominated and comprises nanometric structural connectors (11) connected to each other through nodes (12) defining a non-centrosymmetric shape having a topological constraint that induces torsion or bending of said structural connectors (11); and wherein the unitary cells (10) are connected to each other at least in series defining a continuous electric potential accumulation path with two opposed ends (2, 3), the unitary cells (10) being arranged within the lattice structure (1) in a non-centrosymmetric disposition accumulating and conducting without cancellation the electric gradient generated on each unitary cell (10) through the lattice structure (1) to said two opposed ends (2, 3).

A suspended device structure comprises a substrate, a cavity disposed in a surface of the substrate, and a device suspended entirely over a bottom of the cavity. The device is a piezoelectric device and is suspended at least by a tether that physically connects the device to the substrate. The tether has a non-linear centerline. A wafer can comprise a plurality of suspended device structures. A device structure can comprise a device over a sacrificial portion or cavity and a tether with a tether opening extending to the sacrificial portion or cavity. The tether or tether opening can have a T shape. The tether can have a tether length at least one third as large as a device length and the device can have a device length at least twice as large as a device width.