This disclosure relates to a medical device including a hard part and a converter. The hard part has fluid paths for conducting a medical fluid through the hard part. The converter is arranged to measure a characteristic of the medical fluid while the medical fluid is present in one of the fluid paths. At least a section of the converter is applied or superimposed to the hard part by at least one additive application method.

A stretchable temperature sensor includes one or more elastomeric ionic conducting layers; at least two electronic conducting elements, wherein the one or more ionic conducting layers and one or more electronic conducting elements are configured and arranged to provide at least one electrical double layer at a first contact area between the ionic conducting layer and a first electronic conducting element in a sensing end and at least one electrical double layer at a contact area between the ionic conducting layer and a second electronic conducting element in an open end of the temperature sensor; wherein the second electronic conducting element provides a connection at the open end to an external circuit for measuring a signal generated in response to a temperature condition at the sensing end.

An ultrasonic fingerprint recognition sensor and a manufacturing method thereof, and a display device are disclosed. The ultrasonic fingerprint recognition sensor includes a resonant cavity, a receiver electrode, a drive electrode, and a piezoelectric thin film layer between the receiver electrode and the drive electrode, the resonant cavity is on a side, closer to the piezoelectric thin film layer, of the receiver electrode, and is configured to increase vibration amplitude of the piezoelectric thin film layer.

Various systems, devices, and methods for a vehicle smart brake pad comprising a sensor such as a force sensing device, and a production process thereof. For example, a production process of a vehicle brake pad can include the following steps in time sequence: applying an electrical circuit a support plate; screen printing on the electrical circuit of at least a first electrode; screen printing on the at least first electrode of a sheet of piezoelectric material; screen printing on the sheet of at least a second electrode; applying a friction pad on the support plate; and bulk polarizing the sheet of piezoelectric material by a supply of power to the at least first and second electrodes.

Disclosed are pressure sensors including a die and an application-specific integrated circuit (ASIC) mounted on a top surface of a substrate. The pressure sensor can define an inner volume and a bottom opening configured to abut the substrate. The die and ASIC are mounted on the top surface of the substrate within the inner volume. The substrate defines a first aperture therethrough and the die defines a second aperture therethrough in a direction along an axis perpendicular to the substrate, the first aperture and the second aperture being aligned. Metallic barrier(s) disposed on a bottom surface of the substrate, circumferentially about the first aperture, can be at least partially coated with solder mask to reduce or prevent flow of unwanted materials past the metallic barriers and through the first aperture. The substrate can include electrical connection pads on the bottom surface configured to be in communication with a daughter board.

A piezo-resistor sensor includes a diffusion of a first conductivity type in a well of an opposite second type, contacts with islands in the diffusion, interconnects with the contacts, and a shield covers the diffusion between the contacts and extends over side walls of the diffusion between the contacts. Each interconnect covers the diffusion at the corresponding contact and extends over edges of the diffusion, and each island is at a side covered by its interconnect. A guard ring of the second type is around the diffusion. The shield covers the well between the diffusion and the ring and the edge of the ring facing the diffusion. If a gap between the shield and the interconnect is present, the ring bridges this gap, and/or the edges of the diffusion are completely covered by the combination of the shield and the interconnects.

Systems and methods of providing power to high-voltage sensors in power-limited environments through environmental energy harvesting are disclosed. The systems and methods are configured to intermittently power high-voltage sensors by repeatedly releasing stored energy in bursts. An environmental energy harvesting device generates a low-voltage power supply and is coupled to one or more capacitors to charge the capacitors to a high-voltage threshold. After such high-voltage threshold has been reached, the capacitors are discharged to provide a high-voltage power burst to a high-voltage sensor configured to inspect a component and generate an inspection result signal. The inspection result signal is received by an output module, which may further store or transmit to an external receiver a data signal indicating the inspection results.

In some embodiments, a piezoelectric biosensor is provided. The piezoelectric biosensor includes a semiconductor substrate. A first electrode is disposed over the semiconductor substrate. A piezoelectric structure is disposed on the first electrode. A second electrode is disposed on the piezoelectric structure. A sensing reservoir is disposed over the piezoelectric structure and exposed to an ambient environment, where the sensing reservoir is configured to collect a fluid comprising a number of bio-entities.

Piezo-optic transducers convert variations in mechanical stress to a change in optical properties by coupling electro-optic and piezo-electric elements in a format suited to a single composite device without needing on-board electronics.

In piezoelectric sensors, conventional amplification factor adjustment methods involving the cutting of a wiring pattern or use of a laser trimmable resistor are unable to adjust the amplification factor when the sensor is in a completed state. As a result, the production process becomes complex and production costs increase. Further, because the amplification factor adjustment is carried out in a different state from that of the finished product, the problem that the amplification factor is not set correctly in the finished product also occurs. A non-volatile memory is incorporated in an integrated circuit in which there are integrated piezoelectric sensor circuit elements. The amplification factor is adjusted by writing data from a writing terminal to change an amplification resistor a.