A quantum mechanical circuit includes a substrate; a first electrical conductor and a second electrical conductor provided on the substrate and spaced apart to provide a gap therebetween; and a third electrical conductor to electrically connect the first electrical conductor and the second electrical conductor. The third electrical conductor is a poor thermal conductor.

A quantum mechanical circuit includes a substrate; a first electrical conductor and a second electrical conductor provided on the substrate and spaced apart to provide a gap therebetween; and a third electrical conductor to electrically connect the first electrical conductor and the second electrical conductor. The third electrical conductor is a poor thermal conductor.

Systems, methods, and devices for electrically coupling an integrated circuit to a set of coaxial lines via a printed circuit board assembly are described. A device sample holder includes a printed circuit board that is operable to edge-couple to an integrated circuit. A surface of the printed circuit board that carries a set of coaxial connectors is orthogonal to another surface of the printed circuit board that exposes a set of conductive traces. The set of conductive traces are operable to electrically couple to a set of conductive paths of an integrated circuit to provide a communicative path between the integrated circuit and components of an input/output system in a refrigerated environment.

Devices, systems, methods, and/or computer-implemented methods that can facilitate a qubit device comprising a vacuum encapsulated Josephson junction are provided. According to an embodiment, a device can comprise a substrate having an encapsulated vacuum cavity provided on the substrate. The device can further comprise one or more superconducting components of a superconducting circuit provided inside the encapsulated vacuum cavity.

A discharge pipe is connected to a refrigerant container from outside of a vacuum container, and discharges a vaporized refrigerant. A pair of external leads are electrically connected respectively to opposite ends of a superconducting coil from a position outside of the vacuum container, so as to cause a current to flow through the superconducting coil. A protection circuit is electrically connected to the superconducting coil, and consumes energy stored in the superconducting coil during quenching. The protection circuit is in contact with the discharge pipe outside of the vacuum container.

A quantum device includes a quantum chip and a holder. The holder includes a pedestal, a recess portion formed in a main surface of the pedestal so as to be opposed to the quantum chip, and a suction tube provided such that in the recess portion, a suction opening is positioned in a bottom surface of the quantum chip.

A superconducting power transmission system that comprises an inner pipe housing a superconducting cable therein, a radiation covering at least a part of the inner pipe from outside; and an outer pipe housing the inner pipe and the radiation shield therein. A vacuum is created in a space from an inside of the outer pipe to an outside of the inner pipe with the radiation shield therebetween. The system further comprises at least one radiation shield pipe, housed in the outer pipe and thermally coupled with the radiation shield, a liquefied natural gas (LNG) as a second cryogen for the radiation shield being made to flow through the radiation shield pipe.

To provide a quantum device capable of preventing a connection member connecting a quantum chip with an interposer from being broken. The quantum device 1 includes at least one quantum chip 10, at least one interposer 20 on which the at least one quantum chip 10 is mounted, and a plurality of connection members 30 formed of a conductor. The plurality of connection members 30 are disposed between the quantum chip 10 and the interposer 20, and connect the quantum chip 10 with the interposer 20. The size of the connection member 30 on the surface along the mounting surface 20s of the interposer 20 is changed according to the position thereof relative to the quantum chip 10.

A quantum device (100) includes: an interposer (112); a quantum chip (111); a first connection part (130) that is provided between the interposer (112) and the quantum chip (111) and electrically connects a wiring layer of the interposer (112) to a wiring layer of the quantum chip (111); and a second connection part (140) that is provided on a main surface of the interposer (112) where the first connection part (130) is arranged and is connected to a cooling plate (115).

A quantum device (100) includes: an interposer (112); a quantum chip (111); and a connection part (130) that is provided between the interposer (112) and the quantum chip (111) and electrically connects a wiring layer of the interposer (112) to a wiring layer of the quantum chip (111), in which the connection part (130) includes: a plurality of pillars (131) arranged on a main surface of the interposer (112); and a metal film (132) provided on a surface of the plurality of pillars (131) in such a way that it contacts the wiring layer of the quantum chip (111) and the thickness of the metal film at outer peripheral parts of the tip of each of the plurality of pillars (131) becomes larger than the thickness of the metal film at a center part of the tip of each of the plurality of pillars (131).