A high frequency flexible flat cable includes a first metal isolation layer, a first low-k dielectric adhesive layer attached to one side of the first metal isolation layer, a second low-k dielectric adhesive layer attached another side of the first metal isolation layer and at least two conductor layers respectively attached to the first low-k dielectric adhesive layer and the second low-k dielectric adhesive layer. In addition, the high frequency flexible flat cable further includes a third low-k dielectric adhesive layer, a fourth low-k dielectric adhesive layer, a second metal isolation layer and a third metal isolation layer. The second metal isolation layer and the third metal isolation layer are respectively adhered to outsides of the conductor layers by using the third low-k dielectric adhesive layer and the fourth low-k dielectric adhesive layer to adjust the impedance of the high frequency flexible flat cable according to requirements.

Systems and methods for forming insulation on magnet wire are provided. An extruder that includes one or more rotating screws may receive a thermoset polymeric material and process the thermoset polymeric material to increase its pressure and temperature. An extrusion crosshead assembly in fluid communication with the extruder may receive the thermoset polymeric material and press extrude the thermoset polymeric material as insulation onto a magnet wire. A curing device may then cure the extruded insulation material.

A composition comprises, based on the total weight of the composition, 25 wt % to 50 wt % of a polyetherimide; and 50 wt % to 75 wt % of a polyphthalamide; wherein the composition has a number of drops to tracking at 250 volts of greater than or equal to 50 drops determined according to ASTM D-3638-85.

A high frequency flexible flat cable includes a first metal isolation layer, a first low-k dielectric adhesive layer attached to one side of the first metal isolation layer, a second low-k dielectric adhesive layer attached another side of the first metal isolation layer and at least two conductor layers respectively attached to the first low-k dielectric adhesive layer and the second low-k dielectric adhesive layer. In addition, the high frequency flexible flat cable further includes a third low-k dielectric adhesive layer, a fourth low-k dielectric adhesive layer, a second metal isolation layer and a third metal isolation layer. The second metal isolation layer and the third metal isolation layer are respectively adhered to outsides of the conductor layers by using the third low-k dielectric adhesive layer and the fourth low-k dielectric adhesive layer to adjust the impedance of the high frequency flexible flat cable according to requirements.

A composition comprises, based on the total weight of the composition, 50 wt % to 90 wt % of a polyetherimide; and 10 wt % to 50 wt % of a filler comprising talc, titanium dioxide, zirconium oxide, neutral aluminum oxide, or a combination comprising at least one of the foregoing; wherein the composition has a number of drops to tracking at 250 volts of greater than or equal to 50 drops determined according to ASTM D-3638-85.

Systems and methods for forming insulation on magnet wire are provided. An extruder that includes one or more rotating screws may receive a plurality of ingredients for a polymeric insulation material and process the plurality of ingredients to facilitate polymerization of the polymeric insulation material within the extruder. An application assembly in fluid communication with the extruder may apply the polymeric insulation material onto a wire. A curing device may then cure the polymeric insulation material.

The present invention discloses a halogen-free epoxy resin composition having low dielectric loss, comprises: (A) 100 parts by weight of an epoxy resin; (B) 10-30 parts by weight of a DOPO modified curing agent; (C) 1-10 parts by weight of benzoxazine resin; (D) 60-90 parts by weight of an active ester compound; (E) 20-50 parts by weight of a flame retardant; and (F) 0.5-10 parts by weight of a curing accelerator. The halogen-free epoxy resin composition uses active ester as a curing agent of the epoxy resin to ensure that the hardening product has characteristics such as low dielectric constant (Dk), low dielectric loss (Df), high heat resistance, low water absorption, flame retardant and halogen-free. The halogen-free epoxy resin composition of the present invention is used for manufacturing semi-cured prepregs or resin-coated films, and is applied toward manufacturing metal clad laminates and printed circuit boards.

A filled polymeric film comprising polymer and an inorganic dielectric constant-enhancing additive, the filled polymeric film having 12 to 75 percent by weight of said inorganic dielectric constant-enhancing additive, based on the total weight of the polymer and said inorganic constant-enhancing additive in the filled polymeric film; wherein the polymer comprises imidazole groups; and wherein the filled polymeric film has a filled film tenacity that is 70 to 100 percent of a neat film tenacity of a polymeric film having the same thickness made from the same polymer but without the said inorganic dielectric constant-enhancing additive.

An insulated wire including: a linear conductor; and an insulating layer that covers an outer peripheral surface of the conductor, wherein the insulating layer contains, as residual solvents, a first solvent having a relative permittivity of 15 or more and a second solvent having a relative permittivity of less than 15, a first ratio that is a ratio of a content of the second solvent to a total content of the first solvent and the second solvent contained in the insulating layer is 50% by mass or more, and a second ratio that is a ratio of the content of the second solvent to the total content of the first solvent and the second solvent contained in the insulating layer after a heating treatment of heating the insulated wire at 350? C. for 1 minute is higher than the first ratio.

The invention relates to an insulation element (1) with low electrical conductivity for the electrical insulation of an electrotechnical component in the high voltage range. The insulation element (1) comprises artificial fibres (2) and electrically conductive particles (3) having an electrically non-conductive core (5) and an electrically conductive or semi-conductive cladding (6) surrounding the core (5). Moreover, the insulation element (1) comprises a cationic polymer (4).