An NTC thermistor to be embedded in a substrate includes a thermistor body that is a ceramic sintered body and includes two opposed main surfaces, two opposed side surfaces, and two opposed end surfaces, a plurality of internal electrodes provided inside the thermistor body, and two external electrodes provided on outer surfaces of the thermistor body, and electrically connected to the plurality of internal electrodes. Each of the external electrodes includes a first electrode layer covering one of the end surfaces of the thermistor body, a second electrode layer provided on each of the main surfaces of the thermistor body, the second electrode layer including at least one layer, one end of the second electrode layer being in contact with the first electrode layer, and another end thereof extending in a direction of another end surface, and a third electrode layer including at least one layer and covering the first electrode and the second electrode layers.

A sensor element and a method for producing a sensor element are disclosed. In an embodiment a sensor element includes a ceramic carrier having a top side and an underside, a respective NTC layer arranged on the top side and on the underside of the carrier and at least one electrode, wherein a resistance of the respective NTC layer depends on a thickness and/or geometry of the respective NTC layer.

A hybrid device, comprising: a first electrode, disposed on a first side of the hybrid device, a second electrode, disposed on a second side of the hybrid device, opposite the first side. The hybrid device may further include at least one layer, disposed between the first electrode and the second electrode, the at least one layer comprising a negative temperature coefficient material and a plurality of conductive particles, wherein the hybrid device exhibits a positive temperature coefficient characteristic and a negative temperature coefficient characteristic.

A sensor arrangement and a method for producing a sensor arrangement are disclosed. In an embodiment, the sensor arrangement for a temperature measurement includes a sensor element with at least one electrode and at least one contacting element, wherein the contacting element is arranged and configured for wireless contacting of the sensor element.

A sensor element and a method for producing a sensor element are disclosed. In an embodiment the sensor element is configured to be secured on a printed circuit board by pressure sintering, wherein a structural form of the sensor element is designed such that an exposure to pressure of the sensor element during the pressure sintering is compensated.

A composite thermistor element is described. The element includes a sensor material that is disposed between a pair of electrodes. The sensor material includes particles in a dielectric matrix. Each of the particles have: a core having a temperature dependent resistance, and a cover layer of an inorganic material. The particles form an electron conducting pathway between the electrodes having a temperature dependent resistance and a base-line resistance. Further aspects relate to a method of manufacturing the thermistor, the coated particles, a composition for use in the manufacturing of composite thermistors that includes the particles, and to a temperature sensor including the thermistor described herein.

An NTC component comprising a first electrode (1) and a second electrode (2) is specified. The NTC component further comprises an NTC element (3) disposed between the first electrode (1) and the second electrode (2), wherein the NTC element (3) comprises a ceramic having the general composition AB.sub.2O.sub.4, and where A and B each comprise one or more of the materials Mn, Ni, Co and Cu, and B additionally comprises one or more of the materials Fe, Y, Pr, Al, In, Ga and Sb.

A method for producing an electrical component is disclosed. In an embodiment the method includes providing a carrier element providing a material having a temperature-dependent resistance, applying the material on a surface of the carrier element for producing a resistance layer on the carrier element and subsequently sintering the resistance layer for linking the resistance layer to the carrier element.

An electronic component is disclosed. In an embodiment, the electronic component includes a plurality of functional layers arranged one on top of the other forming a stack, first inner electrodes, and second inner electrodes, each of the first and second inner electrodes arranged between two adjacent functional layers. The electronic component further includes a first outer contact electrically connected to the first inner electrodes and a second outer contact electrically connected to the second inner electrodes, wherein the functional layers are selected such that the first and second outer contacts are electrically conductively connected to one another via the functional layers both in a basic state and in a hot state of the electronic component, wherein a temperature of the hot state is higher than a temperature of the basic state, and wherein the electronic component is an NTC component.

An NTC thermistor to be embedded in a substrate includes a thermistor body that is a ceramic sintered body and includes two opposed main surfaces, two opposed side surfaces, and two opposed end surfaces, a plurality of internal electrodes provided inside the thermistor body, and two external electrodes provided on outer surfaces of the thermistor body, and electrically connected to the plurality of internal electrodes. Each of the external electrodes includes a first electrode layer covering one of the end surfaces of the thermistor body, a second electrode layer provided on each of the main surfaces of the thermistor body, the second electrode layer including at least one layer, one end of the second electrode layer being in contact with the first electrode layer, and another end thereof extending in a direction of another end surface, and a third electrode layer including at least one layer and covering the first electrode and the second electrode layers.