A method of fabricating an integrated circuit (IC) includes providing a substrate having a semiconductor surface layer comprising an unpatterned resistive layer. Measurements are obtained of a characteristic of the unpatterned resistive layer at each of a plurality of locations over the substrate. The unpatterned resistive layer is modified, such as by targeted removal of layer material, in response to the measurements such that the measured characteristic is more uniform across the substrate. A resistor on the IC is defined from the unpatterned resistive layer after the modifying.

A method of fabricating an integrated circuit (IC) includes providing a substrate having a semiconductor surface layer comprising an unpatterned resistive layer. Measurements are obtained of a characteristic of the unpatterned resistive layer at each of a plurality of locations over the substrate. The unpatterned resistive layer is modified, such as by targeted removal of layer material, in response to the measurements such that the measured characteristic is more uniform across the substrate. A resistor on the IC is defined from the unpatterned resistive layer after the modifying.

The invention relates to a sensor element comprising a sensor chip and an anisotropically conductive material, wherein the sensor chip has an electrically insulating substrate, at least two contact pads arranged on a first side of the electrically insulating substrate, and a resistor structure on the first side of the electrically insulating substrate, extending from a first contact pad to at least one other contact pad, wherein the resistor structure includes at least one trimmer structure. An anisotropically conductive material is directly or indirectly arranged on the first side of the electrically insulating substrate, at least on the at least one trimmer structure.