An object is to provide a chip resistor in which hot spots can be dispersed and the adverse effects on performance caused by microcracks can also be reduced. A chip resistor includes an insulating substrate, a resistive element, and electrodes. In the resistive element, a first trimming groove and a second trimming groove are formed. A first vertical groove of the first trimming groove and a second vertical groove of the second trimming groove are formed with a spacing in between in an X1-X2 direction. A first horizontal groove of the first trimming groove and a second horizontal groove of the second trimming groove extend in directions approaching each other, and terminal ends of the first horizontal groove and the second horizontal groove are formed to be separated in the X1-X2 direction such that the first horizontal groove and the second horizontal groove do not overlap in a Y1-Y2 direction.

An object is to provide a chip resistor in which hot spots can be dispersed and the adverse effects on performance caused by microcracks can also be reduced. A chip resistor includes an insulating substrate, a resistive element, and electrodes. In the resistive element, a first trimming groove and a second trimming groove are formed. A first vertical groove of the first trimming groove and a second vertical groove of the second trimming groove are formed with a spacing in between in an X1-X2 direction. A first horizontal groove of the first trimming groove and a second horizontal groove of the second trimming groove extend in directions approaching each other, and terminal ends of the first horizontal groove and the second horizontal groove are formed to be separated in the X1-X2 direction such that the first horizontal groove and the second horizontal groove do not overlap in a Y1-Y2 direction.

A resistor includes a resistive element including a first surface and a second surface; a protective film having electrical insulating properties disposed on the first surface; and a pair of electrodes in contact with the resistive element. The protective film includes a first outer edge and a second outer edge. The resistive element includes a first slit and a second slit extending from the first surface through to the second surface and extending in the second direction. The first slit is located closest to the first outer edge; and the second slit is located closest to the second outer edge. As viewed in the thickness direction, a first distance from the first outer edge to the first slit and a second distance from the second outer edge to the second slit together have a length 15% or greater of a dimension of the protective film in the first direction.

A resistor includes a resistive element including a first surface and a second surface; a protective film having electrical insulating properties disposed on the first surface; and a pair of electrodes in contact with the resistive element. The protective film includes a first outer edge and a second outer edge. The resistive element includes a first slit and a second slit extending from the first surface through to the second surface and extending in the second direction. The first slit is located closest to the first outer edge; and the second slit is located closest to the second outer edge. As viewed in the thickness direction, a first distance from the first outer edge to the first slit and a second distance from the second outer edge to the second slit together have a length 15% or greater of a dimension of the protective film in the first direction.

A chip resistor includes a substrate, a first electrode, a second electrode, a first resistor body, a second resistor body, and a connection electrode. The substrate includes a first primary surface. The first electrode includes a first terminal electrode and a first auxiliary electrode. The second electrode includes a second terminal electrode and a second auxiliary electrode. The first auxiliary electrode has a larger area than the first terminal electrode and the second auxiliary electrode has a larger area than the second terminal electrode, in plan view of the first primary surface of the substrate.

Provided are: a resistor unit a manufacturing method therefor; and a device provided with a resistor unit. A resistor unit is equipped with a resistor and at least one pair of electrode layers formed on the resistor. In at least one of the electrode layers, a removal part for trimming is formed in a region, from among regions where the electrode layers are formed, that excludes the peripheral edges of such layers. The resistor is a thermosensitive resistor, for example.

Provided are: a resistor unit a manufacturing method therefor; and a device provided with a resistor unit. A resistor unit is equipped with a resistor and at least one pair of electrode layers formed on the resistor. In at least one of the electrode layers, a removal part for trimming is formed in a region, from among regions where the electrode layers are formed, that excludes the peripheral edges of such layers. The resistor is a thermosensitive resistor, for example.

A method of manufacturing a layered heater includes: applying a dielectric material on a substrate to form a dielectric layer; thermal-spraying a resistive material on the dielectric layer to form a resistive layer on the dielectric layer; forming a plurality of conductive overlays at predetermined locations on the substrate; and forming a plurality of cuts into the resistive layer by laser cutting to form a resistive circuit pattern that overlaps the conductive overlays.

A method of manufacturing a layered heater includes: applying a dielectric material on a substrate to form a dielectric layer; thermal-spraying a resistive material on the dielectric layer to form a resistive layer on the dielectric layer; forming a plurality of conductive overlays at predetermined locations on the substrate; and forming a plurality of cuts into the resistive layer by laser cutting to form a resistive circuit pattern that overlaps the conductive overlays.

A method of manufacturing resistor units that each comprise a carrier comprising resistor elements including ends with a respective first and second electrical terminal is disclosed. The method includes: a) providing a carrier plate; b) forming strips of a resistor material at the lower side of the carrier plate in a regular pattern such that a respective row of strips of the resistor material is formed along a longitudinal direction; c) forming a plurality of zones of an electrically conductive material at the lower side of the carrier plate in a regular pattern such that a respective row of zones of the electrically conductive material is formed along the longitudinal direction; and d) cutting through the carrier plate by regular transverse incisions, first longitudinal incisions, and second longitudinal incisions such that a respective resistor unit and a respective residual section are alternately formed along a transverse direction.