A method of manufacturing resistor units that each comprise a carrier comprising resistor elements including ends with a respective first and second electrical terminal is disclosed. The method includes: a) providing a carrier plate; b) forming strips of a resistor material at the lower side of the carrier plate in a regular pattern such that a respective row of strips of the resistor material is formed along a longitudinal direction; c) forming a plurality of zones of an electrically conductive material at the lower side of the carrier plate in a regular pattern such that a respective row of zones of the electrically conductive material is formed along the longitudinal direction; and d) cutting through the carrier plate by regular transverse incisions, first longitudinal incisions, and second longitudinal incisions such that a respective resistor unit and a respective residual section are alternately formed along a transverse direction.

A method of manufacturing resistor units that each comprise a carrier comprising resistor elements including ends with a respective first and second electrical terminal is disclosed. The method includes: a) providing a carrier plate; b) forming strips of a resistor material at the lower side of the carrier plate in a regular pattern such that a respective row of strips of the resistor material is formed along a longitudinal direction; c) forming a plurality of zones of an electrically conductive material at the lower side of the carrier plate in a regular pattern such that a respective row of zones of the electrically conductive material is formed along the longitudinal direction; and d) cutting through the carrier plate by regular transverse incisions, first longitudinal incisions, and second longitudinal incisions such that a respective resistor unit and a respective residual section are alternately formed along a transverse direction.

A method of manufacturing resistor units that each comprise a carrier comprising resistor elements including ends with a respective first and second electrical terminal is disclosed. The method includes: a) providing a carrier plate; b) forming strips of a resistor material at the lower side of the carrier plate in a regular pattern such that a respective row of strips of the resistor material is formed along a longitudinal direction; c) forming a plurality of zones of an electrically conductive material at the lower side of the carrier plate in a regular pattern such that a respective row of zones of the electrically conductive material is formed along the longitudinal direction; and d) cutting through the carrier plate by regular transverse incisions, first longitudinal incisions, and second longitudinal incisions such that a respective resistor unit and a respective residual section are alternately formed along a transverse direction.

A chip resistor is capable of improving surge characteristic while finely adjusting a resistance value with high accuracy. A chip resistor includes a resistor which is print-formed such that a first meandering portion is consecutively connected to a second meandering portion across a rectangular adjustment portion. The adjustment portion is provided with a first trimming groove to lengthen a current path of the resistor, thereby improving the surge characteristic while coarsely adjusting a resistance value of the resistor to bring it close to a target resistance value. Furthermore, a second trimming groove is provided in an area of the second meandering portion where a current distribution is small, thereby finely adjusting the resistance value of the resistor to make it coincide with the target resistance value in accordance with a cutting amount of the second trimming groove.

A chip resistor is capable of improving surge characteristic while finely adjusting a resistance value with high accuracy. A chip resistor includes a resistor which is print-formed such that a first meandering portion is consecutively connected to a second meandering portion across a rectangular adjustment portion. The adjustment portion is provided with a first trimming groove to lengthen a current path of the resistor, thereby improving the surge characteristic while coarsely adjusting a resistance value of the resistor to bring it close to a target resistance value. Furthermore, a second trimming groove is provided in an area of the second meandering portion where a current distribution is small, thereby finely adjusting the resistance value of the resistor to make it coincide with the target resistance value in accordance with a cutting amount of the second trimming groove.

Regarding a chip resistor including a resistor provided with a first trimming groove for coarse adjustment and a second trimming groove for fine adjustment, the steps of setting the length of a first lateral direction cut part of the first trimming groove after L-shaped direction turning to be a certain length, setting coordinates of a trimming start point of the second trimming groove at a position which is constantly separated from a first vertical direction cut part of the first trimming groove only by a certain distance, and irradiating with a laser light from the coordinates toward a direction orthogonal to a direction between the electrodes are performed to form the second trimming groove which faces the first trimming groove and is oriented in the direction opposite to the orientation of the first trimming groove.

Regarding a chip resistor including a resistor provided with a first trimming groove for coarse adjustment and a second trimming groove for fine adjustment, the steps of setting the length of a first lateral direction cut part of the first trimming groove after L-shaped direction turning to be a certain length, setting coordinates of a trimming start point of the second trimming groove at a position which is constantly separated from a first vertical direction cut part of the first trimming groove only by a certain distance, and irradiating with a laser light from the coordinates toward a direction orthogonal to a direction between the electrodes are performed to form the second trimming groove which faces the first trimming groove and is oriented in the direction opposite to the orientation of the first trimming groove.

Methods and apparatus providing a vertically constructed, temperature sensing resistor are disclosed. An example apparatus includes a semiconductor substrate including a plurality of resistor unit cells arranged in an array, each resistor unit cell formed within the semiconductor substrate and including a top contact. A conductive layer located over the semiconductor substrate electrically connects to a subset of the top contacts.

Methods and apparatus providing a vertically constructed, temperature sensing resistor are disclosed. An example apparatus includes a semiconductor substrate including a plurality of resistor unit cells arranged in an array, each resistor unit cell formed within the semiconductor substrate and including a top contact. A conductive layer located over the semiconductor substrate electrically connects to a subset of the top contacts.

A resistor component includes a support substrate, a resistive layer disposed on one surface of the support substrate, and a plurality of slits disposed in the resistive layer, each extending from one end or another end of the resistive layer opposing each other in a first direction, and spaced apart from each other in a second direction traversing the first direction. First and second internal electrodes are disposed on the support substrate and are respectively disposed on one end and another end of the resistive layer opposing each other in the second direction to be spaced apart from each other. A first protective layer is disposed on the resistive layer. The plurality of slits include a primary slit covered by the first protective layer, and a secondary slit extending in the first protective layer.