Disclosed is an apparatus including a plurality of vias each having a defined shape, wherein each of the plurality of vias includes a first two-dimensional conductive layer plated on a first side of a substrate, the first two-dimensional conductive layer having the defined shape, a second two-dimensional conductive layer plated on a second side of the substrate, the second two-dimensional conductive layer having the defined shape, and a via conductively coupling the first two-dimensional conductive layer to the second two-dimensional conductive layer. The apparatus further includes a plurality of interconnects configured to conductively couple the plurality of vias, wherein the first two-dimensional conductive layer and the second two-dimensional conductive layer of each of the plurality of vias are perpendicular to the plurality of interconnects.

A multilayer coil component includes an element body including a main surface (a mounting surface) and a main surface, a pair of terminal electrodes disposed on the main surface of the element body, and a coil that is disposed in the element body and electrically connected to the pair of terminal electrodes, wherein the element body includes at least one element body layer containing a filler and at least one element body layer having a lower dielectric constant than the element body layer between a first wiring portion and the terminal electrodes.

An inductor component includes a body including a first surface and a second surface opposing each other in a first direction, and a third surface and a fourth surface connected to the first surface and the second surface and opposing each other in a second direction, a first conductor disposed in the body and extending in the first direction, a second conductor disposed adjacent to the first conductor in the body and extending in the first direction, a first pad and a second pad disposed on the third surface of the body, a first conductive via extending in the second direction and connecting the first conductor and the first pad, and a second conductive via extending in the second direction and connecting the second conductor and the second pad. The second conductor is disposed to be shifted with respect to the first conductor in the first direction.

A circuit board includes a substrate, a first magnetic structure, a first dielectric layer and an inductive coil. The substrate has a top surface and a bottom surface. The first magnetic structure is disposed on the top surface of the substrate. The first dielectric layer covers the substrate and the first magnetic structure. The inductive coil includes a first interconnect, a second interconnect and a plurality of conductive pillars. The first interconnect is disposed on the first dielectric layer. The second interconnect is disposed on the bottom surface of the substrate. The conductive pillars connect the first interconnect and the second interconnect. The first interconnect, the second interconnect and the conductive pillars form a helical structure surrounding the first magnetic structure.

An electronic component that has fewer cracks during production is provided. The electronic component includes an outer electrode on a multilayer body, which includes an inner glass layer, a magnetic material layer on top and bottom surfaces of the inner glass layer, and an outer glass layer on top and bottom surfaces of the magnetic material layer. The insulating layers of the inner glass layer and the outer glass layers contain a dielectric glass material that contains a glass material containing at least K, B, and Si, quartz, and alumina. The glass material content of each insulating layer of the inner glass layer ranges from approximately 60%-65% by weight, the quartz content of each insulating layer of the inner glass layer ranges from approximately 34%-37% by weight, and the alumina content of each insulating layer of the inner glass layer ranges from approximately 0.5%-4% by weight.

An inductor component includes a core base material, a magnetic body in the core, a first conductor pattern formed on primary surface of the core, a second conductor pattern formed on secondary surface of the core, and through-hole conductors formed in through holes through the core such that the conductors are connecting the first and second patterns. The first pattern, second pattern and conductors are positioned to form an inductor such that the magnetic body is positioned on inner side of the inductor, each conductor has a diameter k1, each pattern has conductor thickness in range of 50 μm to 200 μm and has line patterns each having width w1 and separated by line separation distance w2, and a ratio of cross-sectional area of each line pattern to cross-sectional area of each conductor along the diameter k1 in direction of the width w1 is in range of 0.8 to 2.0.

An inductor apparatus includes: a substrate including an electrical insulation property and a non-magnetic material; and a plurality of inductors disposed in the substrate so as to extend from a first surface of the substrate to a second surface of the substrate, each of the plurality of inductors including: an inductor conductive part that has an electrical conductivity and extends in a thickness direction of the substrate; and a magnetic layer that covers a side of the inductor conductive part and include a relative permeability and a soft magnetic material.

An inductor component includes an element body, a coil disposed in the element body, and a non-magnetic insulating layer configured to cover at least part of the coil. The element body has a first magnetic layer and a second magnetic layer stacked in order along a first direction. The coil has an inductor wiring extending along a plane orthogonal to the first direction between the first magnetic layer and the second magnetic layer. In a first section orthogonal to an extending direction of the inductor wiring, the inductor wiring has a top surface facing the first direction, a bottom surface facing a second direction as a reverse direction of the first direction, a first side surface facing a third direction orthogonal to the first direction, and a second side surface facing a fourth direction as a reverse direction of the third direction.

An apparatus is provided which comprises: a plurality of plated through holes; a material with magnetic properties adjacent to the plurality of plated through holes; and one or more conductors orthogonal to a length of the plurality of plated through holes, the one or more conductors to couple one plated through hole of the plurality with another plated through hole of the plurality such that an inductor is formed.

An apparatus includes a substrate and a three-dimensional (3D) wirewound inductor integrated within the substrate. The apparatus further includes a capacitor coupled to the 3D wirewound inductor.