Patent classifications
H01F2017/0026
Multilayer LC filter
A multilayer body includes a first inductor and a second inductor provided in a first planar region, and a third inductor and a fourth inductor provided in a second planar region when viewed in a lamination direction of dielectric layers of the multilayer body. When the multilayer body is viewed in a direction perpendicular or substantially perpendicular to the lamination direction of the dielectric layers, the first inductor and the fourth inductor are provided in a first thickness region, and the second inductor and the third inductor are provided in a second thickness region.
Multilayer LC filter
A multilayer LC filter includes one via conductor on a second edge side and two via conductors on a fourth edge side that are connected to line-shaped conductor patterns of a first inductor, and two via conductors on the second edge side and one via conductor on the fourth edge side that are connected to line-shaped conductor patterns of a second inductor, and the third to fifth inductors also have this same relationship.
ELECTRONIC COMPONENT, ELECTRONIC-COMPONENT MOUNTING BOARD, AND ELECTRONIC-COMPONENT MANUFACTURING METHOD
An electronic component includes a single-layer glass plate, an outer-surface conductor that is disposed above an outer surface of the single-layer glass plate and that is at least a part of an electrical element, and a terminal electrode that is a terminal of the electrical element. The terminal electrode is disposed above the outer surface of the single-layer glass plate and being electrically connected to the outer-surface conductor.
LC composite device, processor, and method for manufacturing LC composite device
An LC composite device includes a capacitor portion, an inductor portion, and a magnetic body portion. The capacitor portion is configured of a first substrate and a thin film capacitance element formed on the first substrate through a thin film process. The inductor portion is configured of a second substrate and a thin film inductance element formed on the second substrate through a thin film process. The magnetic body portion includes a magnetic substrate, and the capacitor portion. The inductor portion and the magnetic body portion are stacked in a positional relationship in which the magnetic body portion and the inductor portion are in contact with each other.
Instantaneous beamforming exploiting user physical signatures
A communication system where a central node (base-station or access point) communicates with multiple clients in its neighbourhood using transparent immediate beam-forming. Resource allocation and channel access is such that the central node does not necessarily know when each client starts its transmission. Receive beam-forming in such a system is not possible, as beam-forming coefficients for each client should be selected according to the particular channel realization from that client to the central node. Each client is detected early in its transmission cycle, based on either a signature that is part of the physical characteristics unique to that client, or based on a signature that is intentionally inserted in the clients' signal, and accordingly adjusts its beam-forming coefficients.
High frequency component
The present disclosure is intended to reduce connection resistance between a shield film and a ground electrode, and to improve characteristics of the shield film. A high frequency component 1a includes a ceramic substrate 2, a ground electrode 3a disposed inside the ceramic substrate 2, a shield film 4 covering an upper surface 2a and lateral surfaces 2c of the ceramic substrate 2, and connecting portions 6a connecting the ground electrode 3a and the shield film 4, wherein the ground electrode 3a is formed using a conductive paste that contains a metal ingredient, powder, and a material constituting the ceramic substrate 2, and a weight rate of a metal ingredient in the connecting portions 6a is higher than that of the metal ingredient in the ground electrode 3a.
Multilayer LC filter
A multilayer LC filter includes a magnetic coupling adjustment inductor for at least one LC resonator. The magnetic coupling adjustment inductor includes a line conductor pattern and a first via conductor connected to each other. The line conductor pattern is connected to an intermediate point of a second via conductor, and the first via conductor is connected to a ground conductor pattern. A loop inductor and the magnetic coupling adjustment inductor in the LC resonator for which the magnetic coupling adjustment inductor is provided are magnetically coupled to a loop inductor in another adjacent LC resonator.
COIL COMPONENT AND FILTER CIRCUIT INCLUDING SAME
A coil component includes a first coil and a second coil that magnetically couples with the coil and causes a negative inductance to be generated. The coil component further includes an electrode that is provided at a position adjacent to or in the vicinity of a port of each of the first and second coils.
ELECTRONIC COMPONENT
An electronic component according one embodiment of the disclosure includes an insulator, an internal conductor, and an external electrode. The insulator may be formed of a material that contains resin. The internal conductor is provided inside the insulator and includes a conductive main body and an outer coating film that is provided on at least a part of a peripheral surface of the conductive main body and has a resistivity higher than the conductive main body. The external electrode is disposed on the insulator and electrically coupled to the internal conductor.
MULTILAYER BAND PASS FILTER
A multilayer band pass filter includes first and second LC parallel resonators. The first and second LC parallel resonators include a first inductor and a second inductor, respectively. The first inductor includes a first line conductive pattern, a first via conductive pattern, and a second via conductive pattern. The first line conductive pattern extends in the X-axis direction on a first dielectric layer. The first via conductive pattern and second via conductive pattern extend from the first line conductive pattern toward a second dielectric layer. The second inductor includes a third via conductive pattern extending in the Z-axis direction.