A package on a die having a low resistive substrate, wherein the package comprises an inductor on low-k dielectric and a capacitor on high-k dielectric. The stacked arrangement having different dielectric materials may provide an inductor having a high Q-factor while still having a high capacitance density. In addition, moving the inductor from the die to the package and fabricating the high density capacitor on the package reduces the silicon area required permitting smaller RF/analog blocks on the chip.

An LC resonator includes first and second plane electrodes, a first line electrode, a first and second via conductors, and a third plane electrode. The second plane electrode is opposed to at least a portion of the first plane electrode in a specific direction. The first via conductor and the second via conductor extend from the first line electrode in the specific direction to be connected to the first plane electrode and the second plane electrode, respectively. The third plane electrode is opposed to at least a portion of the second plane electrode in the specific direction. The second plane electrode is between the first plane electrode and the third plane electrode in the specific direction.

An LC composite component includes a magnetic substrate with magnetism, a magnetic layer with magnetism, inductors, capacitors, and core parts with magnetism. The magnetic substrate includes a first surface and a second surface on a side opposite to the first surface. The magnetic layer is disposed to face the first surface of the magnetic substrate. The inductors and the capacitors are disposed between the first surface of the magnetic substrate and the magnetic layer. The core parts are disposed between the first surface of the magnetic substrate and the magnetic layer and connected to the magnetic layer. The thickness of the core part is 1.0 or more times the thickness of the magnetic layer, the thickness of the magnetic substrate is 1.0 or more times the thickness of the magnetic layer.

An inductor device includes a first trace, a second trace, and a capacitor. The first trace includes a first sub-trace and a second sub-trace. The first sub-trace and the second sub-trace form a plurality of first wires together at a first side of the inductor device, and form a plurality of second wires together at a second side of the inductor device. The second sub-trace is coupled to one terminal of the first sub-trace at a first node. The third sub-trace and the fourth sub-trace form a plurality of third wires together at the first side of the inductor device, and form a plurality of fourth wires together at the second side of the inductor device. The fourth sub-trace is coupled to one terminal of the third sub-trace at a second node. The capacitor is coupled to the first node and the second node.

A resonant element includes first, second, and third plane electrodes, a first via electrode defining a first inductor, a second inductor, and a third inductor. The first via electrode connects the first plane electrode and the second plane electrode, and each of the second inductor and the third inductor connects the first plane electrode and the third plane electrode. The third plane electrode defines a first capacitor together with the second plane electrode, the second inductor includes second via electrodes, and the third inductor includes third via electrodes. Each of the second via electrodes and the third via electrodes is a columnar conductor extending in the extending direction of the first via electrode.

A filter device is mounted on a module substrate and is shielded by a shield member. The filter device has first and second side surfaces opposed to each other. A ground terminal and signal terminals are formed on a bottom surface of the filter device. The shield member includes side wall portions facing the first and second side surfaces. The filter device includes plural LC parallel resonance circuits therein. The inductors of the LC parallel resonance circuits are arranged in parallel with the first side surface and the bottom surface. Each inductor extends upward from its end portion electrically connected to the ground terminal, extends from the first side surface toward the second side surface, and then extends toward the bottom surface. The gap between the first side surface and the corresponding side wall portion is smaller than that between the second side surface and the corresponding side wall portion.

A multilayer electronic component includes a multilayer structure that includes dielectric layers stacked in a stack direction and has first and second surfaces provided on respective sides in the stack direction, a first side-surface electrode provided on a side surface of the multilayer structure, an inductor provided in the multilayer structure, a capacitor provided between the inductor and the first surface, a via wiring line penetrating dielectric layers from a first dielectric layer, which is in contact with the inductor, to a second dielectric layer, which is located closer to the first surface than at least a part of the capacitor, and electrically connecting a first end of the inductor and the first side-surface electrode, and a second side-surface electrode electrically connected to the first side-surface electrode through the inductor and the via wiring line and provided on the side surface or another side surface of the multilayer structure.

An LC filter includes a multilayer body including dielectric layers layered therein, plate electrodes, capacitor electrodes, inductor vias, and ground vias. The plate electrodes are provided on different layers of the multilayer body. The capacitor electrodes each define a capacitor between itself and the electrode. The inductor via is connected with the electrode and the capacitor electrode, while the inductor via is connected with the electrode and the capacitor electrode. The ground vias connect the plate electrodes to each other. The inductor via and the capacitor electrode define a resonance circuit that receives a signal from an input terminal. The inductor via and the capacitor electrode define a resonance circuit that transfers a signal to the output terminal.

Radio frequency filtering circuitry blocks certain frequencies in an outgoing signal so that the signal may be transmitted over a desired frequency. The radio frequency filtering circuitry includes a first inductor having a first coil and a second inductor coupled to and disposed within the first coil. The second inductor has a second coil and a third coil symmetrical to the second coil. When current is applied to the radio frequency filtering circuitry, the current in the second coil causes a first induced current in the first coil and the current in the third coil causes a second induced current in the first coil, wherein the second induced current is approximately equal in magnitude and opposite in direction to the first induced current. As such, the second induced current may compensate for the first induced current.

Disclosed are a device and techniques for fabricating the device. The device may include a top substrate including a plurality of top vias coupled to a first top metal layer that forms a top winding portion of a first inductor. The device also includes a middle substrate including one or more middle metal layers. The top substrate is disposed on the middle substrate. The one or more middle metal layers form a middle winding portion of the first inductor. The device also includes a bottom substrate electrically coupled to the middle substrate opposite the top substrate, where a first bottom metal layer of the bottom substrate forms a bottom winding portion of the first inductor.