A filter structure includes a ground plane in a first metal layer of an integrated circuit (IC) package, a plate in a second metal layer of the IC package, a dielectric layer between the ground plane and the plate, the ground plane, the dielectric layer, and the plate thereby being configured as a capacitive device, and an inductive device in a third metal layer of the IC package. The inductive device is electrically connected to the plate, and the plate and the inductive device are configured to have a resonance frequency greater than 1 GHz.

A filter circuit includes a coil component, an inductor, and a capacitor. In the coil component, a first coil and a second coil are magnetically coupled. The inductor is electrically connected to a first end of the first coil and a second end of the second coil and is connected in parallel to the coil component. The capacitor is electrically connected between a ground electrode and an electrode electrically connected to a second end of the first coil and a second end of the coil.

Disclosed herein is an electronic component that includes an element body having a structure in which a plurality of conductor layers are stacked in a first direction on a surface of a substrate with insulating layers interposed therebetween, and a plurality of terminal electrodes provided on a mounting surface of the element body. The mounting surface extends in the first direction and in a second direction perpendicular to the first direction. The element body includes an inductor constituted by the plurality of conductor layers and has a coil axis extending in a third direction perpendicular to both the first and second directions.

A filter structure includes a ground plane in a first metal layer of an integrated circuit (IC) package, a plate in a second metal layer of the IC package, a dielectric layer between the ground plane and the plate, the ground plane, the dielectric layer, and the plate thereby being configured as a capacitive device, and an inductive device in a third metal layer of the IC package. The inductive device is electrically connected to the plate, and the plate and the inductive device are configured to have a resonance frequency greater than 1 GHz.

A filter includes a first resonance circuit including a first capacitor and a first inductor connected in parallel between a ground terminal and a first node electrically connected to a first signal terminal not through any capacitor, no inductor being connected in series with the first capacitor between the first node and the ground terminal, a second resonance circuit including a second capacitor and a second inductor connected in parallel between the ground terminal and a second node electrically connected to a second signal terminal not through any capacitor, and a third resonance circuit including a third capacitor and a third inductor connected in parallel between a third node, located in a path through which a high-frequency signal is transmitted between the first and second nodes, and the ground terminal, and a first series inductor connected in series with the third capacitor between the third node and the ground terminal.

An electronic component having an electric element including a coil, a magnetic layer covering at least a portion of the electric element, a plurality of external terminals electrically connected to the electric element and embedded in the magnetic layer to be partially exposed from one surface of the magnetic layer, and a nonmagnetic layer embedded in the magnetic layer. The plurality of external terminals include at least one or more first external terminals. The first external terminals are surrounded by the nonmagnetic layer when viewed from the one surface side of the magnetic layer.

In a resonant device, a first via electrode and a second via electrode connect a first plane electrode and a third plane electrode. A third via electrode and a fourth via electrode connect the first plane electrode and a second plane electrode. When the first plane electrode is seen in plan view in a normal direction of the first plane electrode, a first imaginary line connecting the first via electrode and the second via electrode intersects with a second imaginary line connecting the third via electrode and the fourth via electrode.

An electronic component a multilayer body including insulation layers stacked in a stacking direction, a mounting surface that opposes a circuit board when the electronic component is mounted on the circuit board, first and second input/output terminals provided on the mounting surface and adjacent to each other, a ground terminal, a first filter circuit, in the multilayer body, electrically connected between the first input/output terminal and the second input/output terminal, and a ground conductor layer, provided between the first filter circuit and the mounting surface in the stacking direction, that overlaps with the first input/output terminal and the second input/output terminal when viewed in plan view from the stacking direction, and that is connected to the ground terminal.

A coil component includes a first coil and a second coil that are magnetically coupled to each other. The coil component includes a multilayer body, first wiring patterns, second wiring patterns, and third wiring patterns. The first coil includes a portion in which the first wiring patterns and the third wiring patterns are electrically connected to each other by a first via conductor and a second via conductor through the first wiring patterns and the third wiring pattern to connect the wiring patterns in parallel. The second coil includes a portion in which the second wiring patterns and the third wiring patterns are electrically connected to each other by a third via conductor and a fourth via conductor through the second wiring patterns and the third wiring pattern to connect the wiring patterns in parallel.

A resonant element includes first, second, and third plane electrodes, a first via electrode defining a first inductor, a second inductor, and a third inductor. The first via electrode connects the first plane electrode and the second plane electrode, and each of the second inductor and the third inductor connects the first plane electrode and the third plane electrode. The third plane electrode defines a first capacitor together with the second plane electrode, the second inductor includes second via electrodes, and the third inductor includes third via electrodes. Each of the second via electrodes and the third via electrodes is a columnar conductor extending in the extending direction of the first via electrode.