A substrate for an integrated circuit package, the substrate comprising a dielectric, at least one conductor plane within the dielectric, and a planar magnetic structure comprising an organic magnetic laminate embedded within the dielectric, wherein the planar magnetic structure is integrated within the at least one conductor plane.

A dust core contains a powder of a crystalline magnetic material powder and a powder of an amorphous magnetic material. The sum of the content of the crystalline magnetic material powder and the content of the amorphous magnetic material powder is 83 mass percent or more. The mass ratio of the content of the crystalline magnetic material powder to the sum of the content of the crystalline magnetic material powder and the content of the amorphous magnetic material powder is 20 mass percent or less. The median diameter D50a of the amorphous magnetic material powder is greater than or equal to the median diameter D50c of the crystalline magnetic material powder. A 10% cumulative diameter D10a in a volume-based cumulative particle size distribution of the amorphous magnetic material powder is 9.5 μm or less.

An adjustable inductor including a toroidal core defining a plurality of gaps, a compressible gap material positioned in the gaps, at least one winding wound on the core, a force-applying structure, and a film substantially covering the adjustable inductor. The force-applying structure is operable to apply a force to the core to adjust the gaps and thereby an inductance of the adjustable inductor. The film is configured to prevent movement of force-applying structure when above a predetermined temperature threshold, and allow movement of the force-applying structure when below the predetermined threshold.

A powder core includes a compact including a soft magnetic powder, and an outer coating of the compact. The outer coating contains polyethersulfone. An electric or electronic component including the powder core, and an electric or electronic device having the electric or electronic component mounted therein are also provided.

A power semiconductor system includes: a power stage module having one or more power transistor dies attached to or embedded in a first printed circuit board; and an inductor module attached to the power stage module and having an inductor electrically connected to an output node of the power stage module. The inductor includes windings patterned into a second printed circuit board of the inductor module.

A multi-phase inductor includes a core made of a magnetic material; at least two phase windings surrounding the core for inducing a magnetic field in the core, such that a common mode inductance (LCM) is provided for the at least two phase windings; and an adjustment member made of a magnetic material, which adjustment member has at least two legs, which are interconnected with each other at an inner end and which are touching the core at an outer end to provide a differential mode inductance (LDM) for the at least two phase windings; wherein the outer end of each leg of the adjustment member overlays an axial side of the core and/or each leg of the adjustment member has a varying thickness between the inner end and the outer end to adjust the differential mode inductance (LDM).

An inductor device, a filter device, and a steering system. The inductor device includes first to third cores and first and second wires. The first core, a portion of the first wire passing through the first core, and a portion of the second wire passing through the first core are provided as a first inductor. The second core and another portion of the first wire passing through the second core are provided as a second inductor. The third core and another portion of the second wire passing through the third core are provided as a third inductor.

A coil component includes a main body portion containing resin, a coil provided in the main body portion, and an outer electrode electrically connected to the coil. A recess extending from a top surface of the main body portion toward a bottom surface thereof is provided in the side surface of the main body portion. The outer electrode is disposed in the recess, and a wall layer is interposed between the outer electrode and the inner surface of the recess.

A system comprising a high voltage (HV) bank section using energy storage devices arranged into one or more banks, an inductive device coupling the HV bank to a service voltage (SV) bank section and load through a charging circuit charging the SV bank from a more fully charged bank until the charging bank is depleted, and a switch switching, from the depleted bank to the other bank to charge the SV bank. The charging circuit then charging the depleted bank by a power supply as the other HV bank charges the SV bank. A supervisory controller controls the switch to repeat discharging and charging between the two banks for a defined period. The energy storage devices may be supercapacitors capable of storing energy on the order of 1 to 10 MegaJoules, and the inductive device may be a high-inductance, toroidal multifilar inductor.

A DC filter device includes: a first filter device connection; a second filter device connection; a third filter device connection; a fourth filter device connection; a coil core; at least one first coil arranged on the coil core, the at least one first coil being connected in between the first filter device connection and the third filter device connection; at least one second coil arranged on the coil core, the at least one second coil being connected in between the second filter device connection and the fourth filter device connection; and a third coil arranged on the coil core, the third coil having a first coil connection and a second coil connection. The first coil connection and the second coil connection are connected to one another via a circuit device, which circuit device has a resistor.