A semiconductor device includes: a first semiconductor chip including a first coil that generates a magnetic field signal; a wiring board including a second coil, a third coil, and a twisted pair wiring, the second coil being disposed to face the first coil and receiving the magnetic field signal generated by the first coil, the twisted pair wiring connecting the second coil with the third coil; and a second semiconductor chip including a fourth coil disposed to face the third coil and receiving a magnetic field signal generated by the third coil.

An electronic device has a substrate and first and second metallization levels with a resonant circuit. The first metallization level has a first dielectric layer on a side of the substrate, and a first metal layer on the first dielectric layer. The second metallization level has a second dielectric layer on the first dielectric layer and the first metal layer, and a second metal layer on the second dielectric layer. The electronic device includes a first plate in the first metal layer, and a second plate spaced apart from the first plate in the second metal layer to form a capacitor. The electronic device includes a winding in one of the first or second metal layers and coupled to one of the first or second plates in a resonant circuit.

A DC-DC converter includes: an transformer having a primary winding and a secondary winding magnetically coupled to the primary winding; a power oscillator applying an oscillating signal to the primary to transmit a power signal to the secondary winding; a rectifier connected to the secondary winding of the transformer to obtain an output DC voltage by rectification of the power signal; comparison circuitry to generate an error signal representing a difference between the output DC voltage and a reference voltage; a transmitter connected to the secondary winding of the transformer to apply an amplitude modulation to the power signal at the secondary winding of the transformer in response to the error signal to thereby produce an amplitude modulated signal at the primary winding; and a receiver and control circuit connected to the primary winding to control an amplitude of the oscillating signal as a function of the amplitude modulated signal.

Micro-isolators exhibiting enhanced isolation breakdown voltage are described. The micro-isolators may include an electrically floating ring surrounding one of the isolator elements of the micro-isolator. The isolator elements may be capacitor plates or coils. The electrically floating ring surrounding one of the isolator elements may reduce the electric field at the outer edge of the isolator element, thereby enhancing the isolation breakdown voltage.

Micro-isolators exhibiting enhanced isolation breakdown voltage are described. The micro-isolators may include an electrically floating ring surrounding one of the isolator elements of the micro-isolator. The isolator elements may be capacitor plates or coils. The electrically floating ring surrounding one of the isolator elements may reduce the electric field at the outer edge of the isolator element, thereby enhancing the isolation breakdown voltage.

The present disclosure provides a signal convertor, which includes a circuit board, a plurality of isolation transformers, a capacitor, a signal-converting module, an electrical connection interface and a plugging interface. The isolation transformers, the capacitor, the signal-converting module are disposed on the circuit board. The signal-converting module is for converting a plugging signal received from the plugging interface into an electrical signal and transferring the electrical signal to the isolation transformers, or for converting the electrical signal received from the isolation transformers into the plugging signal and transferring the plugging signal to the plugging interface.

A multi-voltage domain device includes a semiconductor layer including a first voltage domain, a second voltage domain, and an isolation region that electrically isolates the first voltage domain and the second voltage domain in a lateral direction. The isolation region includes at least one deep trench isolation barrier. A layer stack is arranged on the semiconductor layer and includes a stack insulator layer, a first coil arranged in the stack insulator layer, and a second coil arranged in the stack insulator layer and laterally separated from the first coil in the lateral direction. The first and second coils are magnetically coupled to each other in the lateral direction. The first coil includes terminals arranged vertically over the first region and are electrically coupled to the first voltage domain, and the second coil includes terminals arranged vertically over the second region and are electrically coupled to the second voltage domain.

An isolator includes a lower electrode, a first insulating layer, a second insulating layer, an upper electrode, and a low permittivity portion. The first insulating layer is provided on the lower electrode, and includes a protruding portion in an upper portion of the first insulating layer. The second insulating layer is provided on the protruding portion, extends sideways from a region directly above the protruding portion, and has a specific permittivity higher than a specific permittivity of the first insulating layer. The upper electrode is in contact with an upper surface of the second insulating layer. The low permittivity portion is in contact with a side surface of the protruding portion and a lower surface of the second insulating layer. The low permittivity portion has a specific permittivity lower than the specific permittivity of the first insulating layer.

A transformer includes a multilayer board including insulation layers stacked in a thickness direction, a primary coil provided on at least one of the insulation layers, and a secondary coil provided on at least one of the insulation layers. The primary coil includes first sub coils electrically connected in series to each other, and second sub coils electrically connected in series to each other. Surfaces of the plurality of insulation layers constitute layer planes of the multilayer board. At least two of the first sub coils are provided on layer planes out of the layer plane different from each other. At least two of the second sub coils are provided on layer planes out of the layer planes different from each other. An average of positions of the first sub coils in the thickness direction is aligned with an average of positions of the second sub coils in the thickness direction.

An electromagnetic resonant coupler includes an input line to which a transmission signal is input; a first resonance line connected to the input line; a second resonance line opposing the first resonance line, the second resonance line undergoing resonant coupling with the first resonance line to thus wirelessly transmit the transmission signal between the first resonance line and the second resonance line; an output line connected to the second resonance line, the transmission signal being output through the output line; a coupling line that electromagnetically couples with at least one selected from the group consisting of the first resonance line and the second resonance line; and a terminator connected to one end of the coupling line.