A magnetic assembly includes a multilevel lamination or metallization structure with a core dielectric layer, dielectric stack layers, a high permittivity dielectric layer, and first and second patterned conductive features, the dielectric stack layers having a first relative permittivity, the high permittivity dielectric layer extends between and contacting the first patterned conductive feature and one of the dielectric stack layers or the core dielectric layer, the high permittivity dielectric layer has a second relative permittivity, and the second relative permittivity is at least 1.5 times the first relative permittivity to mitigate dielectric breakdown in isolation products.

The invention relates to a printed circuit board having a layer structure, which accommodates a plurality of electric circuits. The electric circuits are separated from each other by an insulating barrier layer having a minimum thickness (Di) and a minimum distance (D0) between conductive components of the electric circuits.

A signal generation device, including: an insulation element having transmission and reception units, and isolatedly transmitting an input wave introduced to the transmission unit, to thereby output an output wave from the reception unit; a power unit generating a voltage according to the output wave; a terminal having an output signal corresponding to the voltage; a generation unit generating a control signal; an insulation unit isolatedly transmitting the control signal, and generating a drive signal according to the control signal; a selection unit selecting whether to output the output signal to the terminal, according to the drive signal; a detection unit generating a detection signal indicating the state of the output signal, according to a detection wave obtained from the transmission unit; and a control signal adjustment unit adjusting the control signal according to the detection signal, the output signal being adjusted according to the adjustment of the control signal.

A transformer includes: a primary winding comprising a first port, a second port and a metal layer connected between the first port and the second port, the metal layer comprising a plurality of sections of different electrical lengths and/or characteristic impedances; and a secondary winding electromagnetically coupled with the primary winding, the secondary winding comprising a first port, a second port and a metal layer connected between the first port and the second port, the metal layer comprising a plurality of sections of different electrical lengths and/or characteristic impedances.

Apparatus for communicating across an isolation barrier. In one embodiment, the apparatus comprises a transformer having a first winding disposed on a first side of a printed circuit board (PCB) and coupled to a first local ground, and a second winding disposed on a second side of the PCB, the second side opposite to the first side, and coupled to a second local ground; a transmitter coupled to the first winding; and a receiver, coupled the second winding, that generates an output signal based on a signal received from the transmitter.

A DC-DC converter includes: an transformer having a primary winding and a secondary winding magnetically coupled to the primary winding; a power oscillator applying an oscillating signal to the primary to transmit a power signal to the secondary winding; a rectifier connected to the secondary winding of the transformer to obtain an output DC voltage by rectification of the power signal; comparison circuitry to generate an error signal representing a difference between the output DC voltage and a reference voltage; a transmitter connected to the secondary winding of the transformer to apply an amplitude modulation to the power signal at the secondary winding of the transformer in response to the error signal to thereby produce an amplitude modulated signal at the primary winding; and a receiver and control circuit connected to the primary winding to control an amplitude of the oscillating signal as a function of the amplitude modulated signal.

The present application provides a packaged gate drive circuit having a transformer. The transformer which is used to transfer both signals and power from a primary side to a secondary side. The windings of the transformer are formed using a combination of tracks and wirebond wires. The transformer is positioned in a well formed using a first insulating material and covered with a second insulating material.

Micro-isolators exhibiting enhanced isolation breakdown voltage are described. The micro-isolators may include an electrically floating ring surrounding one of the isolator elements of the micro-isolator. The isolator elements may be capacitor plates or coils. The electrically floating ring surrounding one of the isolator elements may reduce the electric field at the outer edge of the isolator element, thereby enhancing the isolation breakdown voltage.

An apparatus includes a laminate, the laminate including a dielectric layer having a first surface and a second surface opposed to the first surface, and a conductive layer forming a circuit element overlying the first surface of the dielectric layer. The apparatus further includes a magnetic layer over the conductive layer. A first edge surface of the magnetic layer is coplanar with a first edge surface of the laminate, and a second edge surface of the magnetic layer is coplanar with a second edge surface of the laminate.

An electronic device has a substrate and first and second metallization levels with a resonant circuit. The first metallization level has a first dielectric layer on a side of the substrate, and a first metal layer on the first dielectric layer. The second metallization level has a second dielectric layer on the first dielectric layer and the first metal layer, and a second metal layer on the second dielectric layer. The electronic device includes a first plate in the first metal layer, and a second plate spaced apart from the first plate in the second metal layer to form a capacitor. The electronic device includes a winding in one of the first and second metal layers and coupled to one of the first and second plates in a resonant circuit.