Embodiments of the disclosure relate to apparatuses for enhanced thermal management of a planar inductor assembly. In one embodiment, a cooling package for an inductor assembly includes a cold plate and a heat-spreading bracket mechanically coupled to the cold plate at a first end of the heat-spreading bracket. The cold plate has a slotted recess for mounting a first inductor core along a first end thereof. The heat-spreading bracket is configured to apply a clamping force to a second inductor core at a second end opposite to the first end of the heat-spreading bracket.

Embodiments of the disclosure relate to apparatuses for enhanced thermal management of a planar inductor assembly. In one embodiment, a cooling package for an inductor assembly includes a cold plate and a heat-spreading bracket mechanically coupled to the cold plate at a first end of the heat-spreading bracket. The cold plate has a slotted recess for mounting a first inductor core along a first end thereof. The heat-spreading bracket is configured to apply a clamping force to a second inductor core at a second end opposite to the first end of the heat-spreading bracket.

A heat management system includes a tank and a thermal siphon attached to the tank. The thermal siphon contains a liquid that absorbs heat via thermal conduction from the tank. The liquid is heated to a vaporization point, and the heat from the vaporized liquid is transferred to cooling fins extending from the thermal siphon.

The present disclosure includes an electrical power transformer that may include a core and a conductor pack. A conductor pack may include a conducting layer disposed around a portion of the core, a first planar insulating layer disposed on a first side of the conducting layer, and a second planar insulating layer disposed on a second side of the conducting layer. A cooling member may be disposed adjacent to the conductor pack. A method of manufacturing an electrical power transformer may include providing a core and providing a plurality of planar conductor packs. The planar conductor packs including a plurality of planar conducting layers and a plurality of planar insulating layers. The method may include inserting a cooling member between insulating layers of adjacent ones of the plurality of planar conductor packs.

The present disclosure includes an electrical power transformer that may include a core and a conductor pack. A conductor pack may include a conducting layer disposed around a portion of the core, a first planar insulating layer disposed on a first side of the conducting layer, and a second planar insulating layer disposed on a second side of the conducting layer. A cooling member may be disposed adjacent to the conductor pack. A method of manufacturing an electrical power transformer may include providing a core and providing a plurality of planar conductor packs. The planar conductor packs including a plurality of planar conducting layers and a plurality of planar insulating layers. The method may include inserting a cooling member between insulating layers of adjacent ones of the plurality of planar conductor packs.

Methods and apparatuses for cooling an electronic device assembly having a heat producing are described. An electronic device assembly includes a heat dissipation member and a dielectric two-phase heat transfer device. The dielectric heat transfer device has an evaporator region thermally attached to a hot region of the heat producing component and a condenser region thermally attached to the heat dissipation member. The dielectric two-phase heat transfer device is fabricated from a dielectric material.

Methods and apparatuses for cooling an electronic device assembly having a heat producing are described. An electronic device assembly includes a heat dissipation member and a dielectric two-phase heat transfer device. The dielectric heat transfer device has an evaporator region thermally attached to a hot region of the heat producing component and a condenser region thermally attached to the heat dissipation member. The dielectric two-phase heat transfer device is fabricated from a dielectric material.

The invention comprises a high frequency inductor filter apparatus and method of use thereof. In one embodiment, an inductor is used to filter/convert power, where the inductor comprises a distributed gap core and/or a powdered core material. The inductor core is wound with one or more turns, where multiple turns are optionally electrically wired in parallel. In one example, the minimum carrier frequency is above that usable by an iron-steel inductor, such as greater than ten kiloHertz at fifty or more amperes. The core is optionally an annular core, solid rod core, or a core used for multiple phases, such as a C or E core. Optionally, the inductor is used in an inductor/converter apparatus, where output power has a carrier frequency, modulated by a fundamental frequency, and a set of harmonic frequencies, in conjunction with one or more of a silicon carbide, gallium arsenide, and/or gallium nitride based transistor.

A hydrofluoroether compound represented by the following general formula:

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A hydrofluoroether compound represented by the following general formula:

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