Patent classifications
H01F2027/2809
Coil component
A coil component includes a body; a supporting substrate embedded in the body; a coil portion including a coil pattern, and a lead-out pattern exposed to an outside of the body through an external surface of the body, and disposed on the supporting substrate and embedded in the body; and an insulating film disposed between the coil portion and the body, wherein at least a portion of the lead-out pattern contacts the body through an opening formed in the insulating film.
Multilayer coil component
A multilayer coil component includes a multilayer body formed by stacking a plurality of insulating layers and including a coil built therein, and first and second outer electrodes electrically connected to the coil. The coil is formed by electrically connecting a plurality of coil conductors stacked together with the insulating layers. The multilayer coil component further includes, inside the multilayer body, first and second connecting conductors. The first connecting conductor connects between a portion of the first outer electrode covering the first end face, and a coil conductor facing the portion. The second connecting conductor connects between a portion of the second outer electrode covering the second end face, and a coil conductor facing the portion. Concerning the length direction, the first and second connecting conductors each have a length from about 2.5% to about 7.5% of the length of the multilayer body.
Module substrate antenna, and module substrate mounting the same
A module substrate antenna includes: a laminate in which a plurality of ferrite layers are stacked; antennal coils provided on surfaces of the respective ferrite layers; a connection pad connected to an external circuit; and a lead wire provided between the laminate and the connection pad. In the laminate, the antenna coils are two types of the antenna coils, and the two types of the antenna coils are alternately stacked.
Coil component
A multilayer coil component including an element assembly that includes an insulator portion and a coil embedded in the insulator portion and composed of a plurality of coil conductors electrically connected to each other, an extension portion disposed at each end portion of the coil, and an outer electrode disposed on the surface of the insulator portion and electrically connected to the extension portion. The thickness of the coil conductor in the extension portion of the coil is about 1.05 times or more and 2.0 times or less (i.e., from about 1.05 times to 2.0 times) the thickness of the coil conductor in a winding portion of the coil.
Multilayer coil component
A sintered material contains Fe in an amount of from 8 mol % to 37 mol % in terms of Fe.sub.2O.sub.3, Zn in an amount of from 30 mol % to 60 mol % in terms of ZnO, Cu in an amount of from 1 mol % to 7 mol % in terms of CuO, Ni in an amount of from 3 mol % to 17 mol % in terms of NiO, and Si in an amount of from 7 mol % to 28 mol % in terms of SiO.sub.2. A mole ratio (SiO.sub.2/Fe.sub.2O.sub.3) of the SiO.sub.2 to the Fe.sub.2O.sub.3 is from 0.2 to 3.5. The sintered material contains B in an amount of from 0.05 mol parts to 0.5 mol parts.
Coil component, circuit board, and electronic device
A coil component according to one or more embodiments includes a base body having first to sixth surfaces, and a coil conductor including a winding portion that extends around a coil axis intersecting the first and second surfaces. The winding portion includes first, second, third, and fourth portions facing the third, fourth, fifth, and sixth surfaces, respectively when viewed from a direction of the coil axis. The radii of curvature of the first and second portions are both smaller than the radii of curvature of the third and fourth portions. When viewed from the direction of the coil axis, the distance between the first portion and the third surface and the distance between the second portion and the fourth surface are both larger than the distance between the third portion and the fifth surface and the distance between the fourth portion and the sixth surface.
On-chip multi-layer transformer and inductor
A stacked transformer or inductor apparatus including a first layer with a first layer wire element extending around a center axis and a second layer with a second layer wire element. The second layer element includes side by side first and second wire components in parallel spaced relation extending around the center axis and the first wire component is connected to the first layer wire element to form a primary turn winding. A third layer includes a third layer wire element extending around the center axis and connected to the second wire component of the second layer wire element to form a secondary turn winding partially overlapping with the primary turn winding.
Coil array component
A coil array component including an element assembly that includes a filler and a resin material, a first coil portion and a second coil portion that are embedded in the element assembly and that are composed of a first coil conductor and a second coil conductor, respectively, and four outer electrodes electrically connected to the first coil portion and the second coil portion. Also, the first coil conductor and the second coil conductor are covered with a glass layer.
Systems and methods of fabricating coils for coreless transformers and inductors
The disclosure relates to methods for fabricating coreless printed circuit board (PCB) based transformers and/or coreless PCB-based circuits containing one or more coil inductor(s). More specifically, the disclosure relates to methods for fabricating coreless PCB-based transformers and/or inductors having concatenated helix architecture of their primary and secondary windings using layer-by-layer printing of dielectric and conductive patterns.
Inductor device
An inductor device includes a first trace, a second trace, and a double ring inductor. The first trace is disposed at a first area. The second trace is disposed at a second area. The double ring inductor is located at an outside of the first trace and the second trace. The double ring inductor is respectively coupled to the first trace and the second trace in an interlaced manner.