A transformer structure may include a first coil having one or more turns, and a second coil having one or more turns. A turn of the one or more turns of the first coil may overlap a turn of the one or more turns of the second coil in a lateral direction substantially along the turn of the first coil and in a vertical direction substantially along the turn of the first coil. In some implementations, the transformer structure may be integrated in a semiconductor device.

A transformer with improved insulation structure is provided which includes an insulating sheet separating the primary-side windings and portion of split magnetic core from the secondary-side windings and portion of split magnetic core. Thin layers of conductive and semiconductive material are deposited on areas of the insulating sheet surfaces facing the primary and secondary sides. These layers are electrically referenced or tied to the potentials of the respective primary or secondary sides. This ensures that the high electric field due to primary-to-secondary potential gradient is substantially placed across the insulating sheet dielectric and avoided in the air gaps or voids in the transformer, thus reducing undesirable partial discharge effects. The two core sections on the primary and secondary side are also electrically referenced or tied to the potentials of their adjacent windings, thus reducing high electric fields and partial discharge in the space between the core sections and the windings.

A laminate embedded core and coil structure comprises a magnetic core embedded in a laminate structure that includes two types of laminates. A first laminate embeds the coils of the structure and a second laminate fills space between the magnetic core and the first laminate, as well as space below the magnetic core and lower surface of the first laminate. The first and second laminates form a laminate structure that protects and improves isolation of the magnetic components. Solder resist encloses the laminate structure, magnetic core and coils. The laminate embedded core and coil structure may be assembled on a transformer leadframe of various types using non-conductive paste.

A method for planar transformer with an odd turn ratio includes: determining a turn ratio and winding parameters of a transformer to be manufactured; if the turn ratio is odd, determining that there is respectively one winding turn on a first middle layer and a second middle layer and two winding turns on a top layer and a bottom layer; determining widths of winding wires on marginal layers as well as widths of winding wires on middle layers; winding and parallelly connecting an inner winding wire on the top layer to an inner winding wire on the bottom layer, and then serially connecting the parallel-connected inner winding wires to an outer winding wire to form a primary winding; and parallelly connecting the winding wire on the first middle layer to the winding wire on the second middle layer to form a secondary winding, so as to obtain the transformer.

The present disclosure provides a power module and a manufacturing method thereof. The power module includes a substrate, an electronic component, a magnetic component and an encapsulation layer. The substrate includes a first surface and a second surface opposite to each other, and a working region. The working region is disposed on the first surface or the second surface. The electronic component is disposed on the substrate. The magnetic component is disposed on the working region and includes a lateral periphery. The encapsulation layer is disposed on the substrate, covers the electronic component and at least partially surrounds the lateral periphery of the magnetic component. A projection of the encapsulation layer on the first surface of the substrate is not overlapped with a projection of the working region on the first surface, and a gap is formed between the encapsulation layer and the lateral periphery of the magnetic component.

A transformer device includes first conductive segments, second segments, and third conductive segments. The second segments include second conductive segments and first bridging segments. The first bridging segments are connected to the first conductive segments to form a first inductor. The third conductive segments include second bridging segments, and the third conductive segments are connected to the second conductive segments to form a second inductor. The first inductor is located on the second inductor. The first bridging segments and the first conductive segments form first interlaced portions along a first direction. The second bridging segments and the second conductive segments form second interlaced portions along a second direction. The first direction is different from the second direction.

A high-insulation multilayer planar transformer (1) includes a pair of iron cores (20) and a circuit board integration (10a). The circuit board integration (10a) is stacked between the iron cores (20) and has a through hole (100a). The circuit board integration (10a) includes a first to a third insulating layers (11a, 12a, 14a) and a first to a second coil windings (13a, 15a). The first and third insulating layers (11a, 14a) include at least two insulating plates (111a, 141a) stacked with each other respectively. The second insulating layer (12a) includes at least one insulating plate (121a). The coil winding (13a, 15a) is disposed between the adjacent insulating layers and surrounds the through hole (100a) planarly. Therefore, the reinforced insulation requirement of safety regulations may be achieved.

A magnetic and electrical circuit element including magnetic-flux-conducting posts, and a multi-layer structure formed with an electrically-conductive material. The multi-layer structure includes multiple layers forming a stack of layers along a length of the posts, said multi-layer structure configured as primary and secondary windings of a transformer. The primary winding is embedded in the multi-layer structure and wound around the magnetic-flux-conducting posts in such a way that a magnetic field induced in each of the magnetic-flux-conducting posts has a magnetic field polarity opposite to a polarity of the respective magnetic field of the magnetic-flux-conducting post adjacent the respective magnetic-flux-conducting post. Around each of the magnetic-flux-conducting posts, there is a respective one of the secondary windings connected to a semiconductor device. The magnetic-flux-conducting posts are connected magnetically by continuous magnetic-flux-conducting plates, each of which is shaped to ensure a continuous flow of the magnetic field successively through adjacent magnetic-flux-conducting posts.

A set of multi-winding transformer designs that achieve leakage integration in multi-port power electronics systems is presented. The magnetic design structures are extendable to realize an N-port multi-winding transformer with or without leakage inductance integration, that interfaces different voltage levels (high-voltage and/or low-voltage) with galvanic isolation. The disclosed designs enable: (i) reduced number of discrete magnetic components (ii) high efficiency and high power density; (iii) reduced transformer parasitic capacitances. Furthermore, a global transformer optimization approach that considers magnetizing and leakage inductances, core and winding losses, and parasitic capacitances is presented to systemize the sophisticated multi-winding integrated leakage transformer design process.

Disclosed herein is a symmetric split planar transformer in the context of a DC-DC isolated converter. The symmetric split planar transformer reduces or eliminates asymmetry in the distribution of parasitic capacitance across the isolation barrier going from one end to another end of a primary coil, and as a result, undesirable electromagnetic interference (EMI) due to common mode dipole emission across the isolation barrier may be reduced. In some embodiments, the primary winding is split into at least a first coil and a second coil, each occupying a different area side-by-side on a substrate. The transformer is symmetric in the sense that a capacitive coupling of the first coil to a secondary winding is the same as a capacitive coupling of the second coil to the secondary winding, such that common mode EMI may be reduced. Each coil may include stacked spiral coil portions in multiple metal planes to increase inductive density across the isolation barrier. Furthermore, in some embodiments the first and second coils may have opposite spiral directions such that far field radiation effect from the transformer may be reduced.