A carrier structure includes a substrate, a first patterned circuit layer and at least one magnetic element. The substrate has a first surface and an opening passing through the substrate. The first patterned circuit layer is disposed on the first surface of the substrate and includes an annular circuit for generating an electromagnetic field. The magnetic element is disposed within the opening of the substrate, wherein the magnetic element couples the annular circuit and acts in response to the magnetic force of the electromagnetic field.

An integrated transformer includes a first and second inductors. The first inductor includes a first and second windings. The second inductor includes a third and fourth windings. The first, second, third and fourth windings have a first, second, third and fourth outer turn, respectively. At least one segment of the first (or second) outer turn substantially overlaps at least one segment of the third (or fourth) outer turn. The first and second outer turns are connected through a first segment and a first trace that cross each other, and the third and fourth outer turns are connected through a second trace and a second segment that cross each other. The first trace and the second segment are on the first metal layer, and the first segment and the second trace are on the second metal layer different from the first metal layer.

A power conversion circuit has a multilayer transformer and a plurality fo rectifying transistors coupled to the secondary windings of the multilayer transformer. The multilayer transformer is formed as multiple layers within a PCB stack, where primary winding conductors and secondary winding conductors are vertically aligned and stacked. The secondary winding conductors are constructed to have one or more secondary winding arms that provide area to which the plurality of rectifying transistors are physically connected. The primary winding conductors are constructed to have a primary winding arm. A footprint of each primary winding conductor is configured to substantially overlap an entire footprint of each of the secondary winding conductors. As such, an entirety of the secondary current flowing through the secondary winding conductors is vertically aligned with the primary winding conductors, and therefore with the primary current flowing through the secondary winding conductors.

In a method of manufacturing a plurality of embedded magnetic component devices, a row of cavities for respective magnetic cores is formed in an insulating substrate. Neighboring cavities are connected to each other by channels formed in the substrate. Adhesive is applied to a cavity floor throughout the row of cavities, and magnetic cores are inserted into the cavities. The cavities and magnetic cores are covered with a first insulating layer. Through holes are formed through the first insulating layer and the insulating substrate, and plated up to form conductive vias. Metallic traces are added to the exterior surfaces of the first insulating layer and the insulating substrate to form upper and lower winding layers. The metallic traces and conductive vias form the windings for an embedded magnetic component, such as transformer or inductor.

An inductor device includes a first wire, a second wire, a third wire, a fourth wire, and an eight-shaped inductor structure. The first wire includes at least two first sub-wires. The second wire includes at least two second sub-wires. The third wire includes at least two third sub-wires. The fourth wire includes at least two fourth sub-wires. The first wire is disposed in a first area. The second wire is disposed in a second area. The third wire is disposed in the first area and at least partially overlapped with the first wire in a vertical direction. The fourth wire is disposed in the second area and at least partially overlapped with the second wire in the vertical direction. The eight-shaped inductor structure is disposed on an outer side of the third wire and the fourth wire.

An inductor device includes a first trace, a second trace, a third trace, a fourth trace, and a double ring inductor. The first trace is disposed in a first area, and located on a first layer. The second trace is disposed in the first area, coupled to the first trace, and located on a second layer. The third trace is disposed in a second area, and located on the first layer. The fourth trace is disposed in the second area, coupled to the third trace, and located on the second layer. The double ring inductor is disposed on the first layer, located at outer side of the first trace and the third trace, and coupled to the first trace and the third trace.

A transformer device includes first, second, and third windings, located in an insulating substrate by conductive vias joined together by conductive traces. Positions of the conductive vias are arranged so as to optimize the isolation properties of the transformer, and to improve the coupling of the transformer by increasing the leakage inductance and reducing the distributed capacitance. The transformer device is compact and is weakly coupled. The weak coupling between the windings reduces the likelihood of the transformer malfunctioning, particularly when used in a self-resonant converter circuit.

A packaged electronic device includes first conductive leads and second conductive leads at least partially exposed to an exterior of a package structure, and a multilevel lamination structure in the package structure. The multilevel lamination structure includes a first patterned conductive feature having multiple turns in a first level to form a first winding coupled to at least one of the first conductive leads in a first circuit, a second patterned conductive feature having multiple turns in a different level to form a second winding coupled to at least one of the second conductive leads in a second circuit isolated from the first circuit, and a conductive shield trace having multiple turns in a second level spaced apart from and between the first patterned conductive feature and the second patterned conductive feature, the conductive shield trace coupled in the first circuit.

A transformer includes a primary winding and a secondary winding, which are flat, and a magnetic core that has a middle leg that passes through the primary and secondary windings, a first core that is connected to one end along the length direction of the middle leg, and a second core that is connected to the other end along the length direction. A first wall surface on the side of the first core where the middle leg is positioned and a second wall surface on the side of the second core which faces the first wall surface are formed so as to be parallel, the primary winding is fixed to the first wall surface, the secondary winding is fixed to the second wall surface, and the distance between the primary winding and the secondary winding is kept constant.

Isolators for signals and/or powers transmitted between two circuits configured to operate at different voltage domains are provided. The isolators may have working voltages, for example, higher than 500 Vrms, higher than 1000 Vrms, or between 333 Vrms and 1800 Vrms. The isolators may have a fully symmetrical configuration. The isolators may include a primary winding coupled to a driver and a secondary winding coupled to a receiver. The primary and secondary windings may be laterally coupled to and galvanically isolated from each other. The primary and secondary windings may include concentric traces. The primary and secondary windings may be fabricated using a single metallization layer on a substrate.