A low-core-loss transformer for high transfer ratio and high power density applications can have five pillars including four corner pillars and at least one center pillar between magnetic metal plates. The center pillar provides an additional flux path to reduce thermal and core losses and improve efficiency. Magnetic flux density may be further reduced by having multiple central pillars in an N-track configuration in several kinds of symmetrical arrangements. The low-core-loss transformer achieves a flexible voltage transfer ratio. The ratio can be either even or odd numbers. An odd ratio design is able to fulfill the requirement of future data centers to supply a 400-volt high-distribution power bus. The transformer windings can be traces on a Printed Circuit Board (PCB) that integrate electronic components for a compact and modular design.

The present disclosure provides methods and techniques associated with a planar transformer for an apparatus. The planar transformers include a substrate carrying electronic components and a continuous core that is formed by distributing the encapsulant material uniformly around the substrate unit to define a consistent cross-sectional area for the magnetic path. The electronic components include primary windings and secondary windings associated with the transformer. In some embodiments, the encapsulant material is molded to seals air gaps to the substrate unit.

A component carrier includes a base material stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and a magnet stack with a plurality of magnetic layers and at least one bonding layer, each of the at least one bonding layer bonding two respectively neighboured magnetic layers, wherein the magnet stack is embedded in the base material stack.

A broadside coupled coplanar inductor device includes first and second coplanar inductors in which the conductors of the first and second coplanar inductors are broadside coupled. The conductors are located one above the other at a first distance and the return paths are located to the side of the respective first and second conductor signal paths at a second distance. One or both of the dimensions of the first and second first distances is defined so as to maximize a mutual inductance between the conductors. First and second driver circuit apply voltages across each conductor. The input pulse width modulation signals applied to the first and second driver circuits are 180 degrees out of phase.

A transformer assembly includes a transformer with primary windings located on multiple layers and with secondary windings interleaved with the multiple layers and includes a substrate connected to the transformer and with a first transistor with first, second, and third terminals, in which the first terminal is connected to the secondary windings, the second terminal is connected to an output terminal of the transformer assembly, and the third terminal is a control terminal; first conductive layers; second conductive layers interleaved with the first conductive layers; a first via that is solid filled and that connects the first conductive layers and the first terminal; and a second via that is solid filled and that connects the second conductive layers and the second terminal.

Provided is a semiconductor device that has a configuration provided with: a driving unit for driving an upper switching element and a lower switching element according to a control signal for controlling the driving of the upper switching element and the lower switching element, which are connected in series to constitute a bridge circuit; an insulating unit having an insulating transformer; and a package for sealing at least a part of the insulating unit and the driving unit. The insulating unit transmits a signal corresponding to the control signal to the driving unit side while insulating the signal.

A system and method for integrating a magnetic component within a power converter includes a coil integrated on a PCB. The PCB includes multiple layers and traces on each layer to form a single coil or to form multiple coils on the magnetic component. The PCB further includes at least one opening in the PCB through which a core component may pass, such that the magnetic component is defined by the coils and the core material. To reduce eddy currents built up within the traces, the dimensions of traces on a layer are varied and the position of traces between layers of the PCB are varied. The widths and locations of individual traces are selected to reduce coupling of the trace to leakage fluxes within the magnetic component. A floating conductive layer may also be provided to still further reduce the magnitude of eddy currents induced within the coil.

Various examples of magnetic integration of matrix transformers with controllable leakage inductance are described. In one example, a transformer includes a magnetic core comprising a plurality of core legs and a leakage core leg. The leakage core leg is positioned among the plurality of core legs to control a leakage inductance of the transformer. The transformer also includes a planar winding structure. The planar winding structure includes a primary winding and a plurality of secondary windings. The primary winding and the plurality of secondary windings extend in a number of turns around the plurality of core legs, without a turn around the leakage core leg, to further control the leakage inductance of the matrix transformer.

A planar magnetic element includes a pair of cores, a first winding layer disposed between the pair of cores and including a first winding coupled between a first terminal and a second terminal, and a plurality of second winding layers disposed between the pair of cores and including second windings coupled between a third terminal and a fourth terminal, wherein the first winding layer may be disposed between the plurality of second winding layers.

According to one embodiment, a matching network circuit includes a first capacitor coupled, in parallel, to an input port of the matching network circuit; a broadband on-chip transformer coupled, in parallel, to the first capacitor, where the broadband on-chip transformer includes a primary winding and a secondary winding, where the secondary winding is a partial winding. The matching network circuit includes a second capacitor coupled, in series, in between the broadband on-chip transformer and an output port of the matching network circuit.