H01F2027/2819

METHODS AND APPARATUS FOR ISOLATION BARRIER WITH INTEGRATED MAGNETICS FOR HIGH POWER MODULES

For isolation barrier with magnetics, an apparatus includes an isolation laminate including a dielectric core having a first surface and a second surface opposed to the first surface; at least one conductive layer configured as a first transformer coil overlying the first surface; a first dielectric layer surrounding the at least one conductive layer; a first magnetic layer overlying the at least one conductive layer; at least one additional conductive layer configured as a second transformer coil overlying the second surface; a second dielectric layer surrounding the at least one additional conductive layer; and a second magnetic layer overlying the at least one additional conductive layer. Methods for forming the isolation barriers and additional apparatus arrangements are also described.

ELECTRIC CURRENT TRANSFORMER AND CURRENT MEASUREMENT UNIT

An electric current transformer including a first coil and a second coil, which are produced with a first printed circuit including a first positioning device, and a second positioning device; and a first magnetic part including a first holding device and a second magnetic part including a second holding device, the positioning device being arranged to join together with the holding device so as to hold reference faces of the magnetic parts a predetermined distance away from the turns of the first and second coils. A current measurement unit includes such a current transformer.

HIGH DENSITY COIL DESIGN AND PROCESS

Devices including a substrate and a plurality of coil portions disposed on the substrate. The plurality of coil portions electrically coupled to form a coil structure.

INDUCTIVE COMPONENT
20200082967 · 2020-03-12 · ·

An inductive component has at least one conductor loop arranged on a printed circuit board and at least one core made of inductive material that cooperates inductively with the conductor loop. The printed circuit board comprises an upper face, a lower face and narrow faces, and moreover at least two printed circuit board parts. Each printed circuit board part has a part of the at least one conductor loop. At least one of the printed circuit board parts comprises a first and a second contact portion. The first contact portion is connected to a first face, in particular the upper face, of the second printed circuit board part and the second contact portion is connected to a second face, in particular the lower face, of the second printed circuit board part, which second face is different from the first face.

PLANAR TRANSFORMER

A planar transformer includes a flexible insulating substrate having a first surface and a second surface on the opposite side with respect to the first surface, and multiple coils formed side by side on the first surface and the second surface of the flexible insulating substrate such that each of the coils includes a spiral-shaped wiring. The flexible insulating substrate has bending portions formed such that the flexible insulating substrate is folded at the bending portions and stack the coils one another.

Electronic component including planar transformer
10580569 · 2020-03-03 · ·

An electronic component 100 includes: a circuit board module 104 which is composed of a plurality of layers, and in which a primary circuit 120 and secondary circuits 122, 124 are each formed using wring patterns of a first layer L1 to an eighth layer L8; and a magnetic core 106 which magnetically couples the primary circuit 120 and the secondary circuits 122, 124. The circuit board module 104 includes: cutout portions 104b which are formed in a cutout shape from side edge portions toward an inner side and which position the magnetic core 106 at a predetermined attachment position in a state of housing the magnetic core 106; and widened portions 104c which continue from the cutout portions 104b and are formed in a cutout shape from the side edge portions toward the inner side of the circuit board module 104, and which are formed on sides of the magnetic core 106 so as to be larger than a width W1 for housing of the cutout portions 104b.

Heterogeneously integrated power converter assembly

A power converter assembly is provided and includes high quality factor (Q) shield-to-transistor integrated low-inductance capacitor elements to divert common mode (CM) currents, high Q shield-to-shield integrated low-inductance capacitor elements to compliment line-to-line filter capacitors and high Q baseplate integrated low-inductance capacitor elements to attenuate residual CM currents.

RF DAMPING STRUCTURE IN INDUCTIVE DEVICE
20200020474 · 2020-01-16 ·

A spiral inductor includes a spiral trace and a plurality of first projections extending along a first edge of the spiral trace. The spiral inductor may further include a plurality of second projections extending along a second edge of the spiral trace, the second edge being opposite the first edge.

Transformer

A transformer includes: a first coil section formed by coiling a conductor pattern in a planar state around an insertion hole provided on a circuit board; a second coil section that includes a first ring composed of a coil formed by coiling a conductor plate, the coil being covered with an electric-insulating resin, a second ring composed of a coil formed by coiling a conductor plate, the coil covered with the electric-insulating resin, and a coupled part formed by covering a coupled position between the first ring and the second ring with the electric-insulating resin; and core sections forming a closed magnetic circuit that magnetically couples the first coil section and the second coil section.

Embedded high voltage transformer components and methods
10522279 · 2019-12-31 · ·

Disclosed are apparatus and methods for embedded high voltage transformer components. Industrial applications require transformers that provide high voltage isolation. The laminate materials used for fabricating Printed Circuit Boards (PCB) are very good insulators and PCB transformers can provide higher voltage isolation than traditional wire wound devices. There are a variety of PCB laminate materials with different properties for voltage breakdown. FR-4 laminate is commonly used and has voltage breakdown properties exceeding 10 kV/mm. To produce PCB transformers with breakdown voltages exceeding 5 kV, it is beneficial to use laminate with much higher breakdown voltages. Generally, the materials with high breakdown voltage cost more. High voltage isolation can be achieved at a moderate cost by mixing low cost FR-4 laminate with high voltage dielectric materials.