In one aspect, an apparatus includes: a first power amplifier to receive a first voltage signal and to output a first current; a second power amplifier to receive a second voltage signal and to output a second current; and a transformer coupled to the first power amplifier and the second power amplifier. The transformer may have multiple differential input ports to realize a controllable impedance based on a desired output power level.

A device includes a first circuit assembly with first circuitry configured on a first upper surface of a first circuit board that includes a first side of power conversion circuit. A first magnetic core is also configured on the first upper surface of the first circuit board. The device also includes a second circuit assembly with second circuitry configured on a second upper surface of a second circuit board that includes a second side of the power conversion circuit. A second magnetic core is also configured on the second upper surface of the second circuit board. The first circuitry of the first circuit assembly is connected to the second circuitry of the second circuit assembly to form the power conversion circuit via at least one of an electrical connection or a magnetic coupling between the first magnetic core and the second magnetic core.

The invention relates to a power converter module comprising a circuit board (7) in which an iron core (1) is integrated in recesses (6) of the circuit board (7), a winding with windings, forming a secondary circuit (8) of the power converter module, is arranged in or on the circuit board (7).

A transformer includes a lower magnetic core having a lower column upwardly formed at a center thereof; an upper magnetic core having an upper column downwardly formed at a center thereof, the lower upper and magnetic cores being symmetrically coupled so that the lower and upper columns are engaged with each other; a double-sided printed circuit board being fitted through an opening formed on a center thereof around a middle of the columns and having primary coils patterned on both surfaces thereof; a lower secondary coil molded product being fitted through an opening formed on a center thereof around a lower portion of the columns and including a secondary coil embedded therein; and an upper secondary coil molded product being fitted through an opening formed at a center thereof around an upper portion of the columns and including a secondary coil embedded therein.

An example power converter may include a planar transformer including a magnetic core, a primary winding, a first secondary winding interleaved with the primary winding, and a second secondary winding interleaved with the primary winding. The magnetic core may include a first core half, a second core half, multiple auxiliary legs formed by the first core half and the second core half, and multiple core legs formed by the first core half and the second core half. The multiple core legs may include a central core leg, and the primary winding may be wound around the central core leg among the two or more core legs. The planar transformer may be electrically coupled between a primary-side converter stage and a secondary-side converter stage.

An inductor device includes a first trace, a second trace, a third trace, a fourth trace, and a double ring inductor. The first trace is disposed in a first area, and located on a first layer. The second trace is disposed in the first area, coupled to the first trace, and located on a second layer. The third trace is disposed in a second area, and located on the first layer. The fourth trace is disposed in the second area, coupled to the third trace, and located on the second layer. The double ring inductor is disposed on the first layer, located at outer side of the first trace and the third trace, and coupled to the first trace and the third trace.

The capacitor-type network transformer includes a circuit board, at least one a transformer member mounted to the circuit board, at least one peripheral element mounted to the circuit board to a side of the transformer member, and a casing configured on the circuit board completely covering the transformer members and the peripheral elements. Each transformer member includes a transformer, a common-mode filter, and at least one capacitor. The present invention configures at least a transformer member and at least a peripheral element on a circuit board through Surface Mount Technology (SMT), which are all entirely covered by a casing, thereby avoiding the conventional manual process's complexity and inconvenience, and enhancing production cost and efficiency. As the peripheral elements, such as Transient Voltage Suppressor (TVS) diodes, are also integrated inside the casing, the network transformer is more robust to electrical shocks and easier for product miniaturization.

An electronic structure comprising: a circuit board, wherein electronic devices and a transformer are disposed on the circuit board, wherein the transformer comprises a first coil, a second coil, and a magnetic body comprising a pillar with at least one portion of the pillar being disposed in a through-opening of the circuit board, wherein the first coil is wound around an upper portion of the pillar and the second coil is wound around a lower portion of the pillar for forming the transformer.

An integrated circuit includes a first coil and a second coil. The first coil is disposed on the first side of the integrated circuit. The second coil is disposed on the second side of the integrated circuit, and is partially overlapped with the first coil at a junction. The first coil is not interlaced with the second coil at the junction.

A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate. The output circuit(s), which include a transformer and rectification circuitry, provide current multiplication at an essentially fixed conversion ratio, K, in the semiconductor package, receiving AC power at a relatively high voltage and delivering DC power at a relatively low voltage to the die. The output circuits may be connected in series or parallel as needed. A driver circuit may be provided outside the semiconductor package for receiving power from a source and driving the transformer in the output circuit(s), preferably with sinusoidal currents. The driver circuit may drive a plurality of output circuits. The semiconductor package may require far fewer interface connections for supplying power to the die.